Abstract:
According to an embodiment, a memory interface that includes n number of channels and writes data subjected to an error correction encoding process having capable of correcting t symbols, n number of first error correction decoding units that perform an error correction decoding process of correcting s (s
Abstract translation:根据一个实施例,一种存储器接口,其包括n个通道并且写入经过能够校正t个符号的纠错编码处理的数据,n个第一纠错解码单元,其执行校正s( s
Abstract:
According to one embodiment, a semiconductor storage device includes a nonvolatile semiconductor memory, a temporary storage buffer that temporarily stores writing data to be written to the nonvolatile semiconductor memory, and a coding processing unit that divides coding target data of an error correction code into two or more divided data and writes an error correction code obtained by performing an error correction coding process based on the divided data stored in the temporary storage buffer to the temporary storage buffer as an intermediate code.
Abstract:
An apparatus, system, and method are disclosed for providing error correction for a data storage device 102, 112. A determination module 602 determines an error-correcting code (ECC) characteristic of the data storage device 102, 112. An ECC module 116 validates requested data read from the data storage device 102, 112 using a hardware 5 ECC decoder 322. In response to the requested data satisfying a correction threshold, a software ECC decoder module 604 validates the data using a software ECC decoder 604. The software ECC decoder 604 is configured according to the ECC characteristic of the data storage device 102, 112.
Abstract:
Provided is a system including a group of error-detecting/correcting-code self-checked/self-timed/self-corrected circuits for logic robust and performance scalable nanoelectronic design, including: (1) a combinational logic network that outputs an error-detecting/error-correcting code (EDC/ECC); and (2) an error-detecting module which gates an external clock (in a self-checked circuit), or generates an internal clock (in a self-timed circuit), and/or an error-correcting module which corrects the sequential element states (in a self-corrected circuit). Also provided is a method for implementing an error-detecting/error-correcting code (EDC/ECC) self-checked/timed/corrected circuit. The method includes (1) encoding combinational logic outputs in an error-detecting/correcting code (EDC/ECC), (2) synthesizing combinational logic, and (4) generating a gated clock in a self-checked circuit, an internal clock in a self-timed circuit, and/or corrected signals in a self-corrected circuit.
Abstract:
The disclosed embodiments provide a dynamic memory device, comprising a set of dynamic memory cells and a set of replacement dynamic memory cells. The set of replacement dynamic memory cells includes data cells which contain replacement data bits for predetermined faulty cells in the set of dynamic memory cells, and address cells which contain address bits identifying the faulty cells, wherein each data cell is associated with a group of address cells that identify an associated faulty cell in the set of dynamic memory cells. The dynamic memory device also includes a remapping circuit, which remaps a faulty cell in the set of dynamic memory cells to an associated replacement cell in the set of replacement cells.
Abstract:
Various embodiments include apparatus and methods to store data in a first semiconductor memory unit and to store error correction information in a second semiconductor memory unit to recover the data. The error correction information has a value equal to at least the value of the data store in the first memory unit.