公开(公告)号：WO2009031687A2

公开(公告)日：2009-03-12

申请号：PCT/JP2008/066263

申请日：2008-09-03

Applicant: FUJIFILM Corporation ,  TATEISHI, Keiichi ,  HAYASHI, Shinya ,  NAGATA, Yoshiaki ,  NAKAMURA, Tomoaki

Inventor： TATEISHI, Keiichi ,  HAYASHI, Shinya ,  NAGATA, Yoshiaki ,  NAKAMURA, Tomoaki

IPC: B41J2/01 ,  B41M5/00 ,  C09B29/09 ,  C09B29/36 ,  C09B67/20 ,  C09B67/46 ,  C09D11/00 ,  C09D11/322

CPC classification number: C09B29/3656 ,  C09B29/0037 ,  C09B29/004 ,  C09B29/0081 ,  C09B29/0085 ,  C09B29/0092 ,  C09B67/0002 ,  C09B67/009 ,  G02B5/223 ,  G03G9/091

Abstract: A monoazo pigment is represented by the general formula (1), a tautomer of the monoazopigment, and a salt or a hydrate thereof: wherein R 1 , P 1 , and Q 1 each independently represents a hydrogen or a substituent, G represents the non-metallic atoms necessary to complete a 5- to 6-membered heterocyclic group, W represents a substituent capable of binding to the heterocyclic group constituted by G, t represents an integer of from 0 to 5, Het-1 represents a group selected from the aromatic heterocyclic groups represented by the general formula (2): wherein X, Y, Z, W 0 , W 1 , W 2 , W 3 , and W 4 each independently represents a hydrogen or a substituent, and * shows the point of attachment to the azo linkage in the general formula (1).

Abstract translation: 单偶氮颜料由通式（1）表示，所述单偶氮颜料的互变异构体及其盐或水合物：其中R 1，P 2， 1和Q 1各自独立地表示氢或取代基，G表示完成5至6元杂环基所需的非金属原子，W表示能够取代的 与由G构成的杂环基的结合，t表示0-5的整数，Het-1表示选自由通式（2）表示的芳族杂环基的基团：其中X，Y，Z， sub> 0，w 1，w 2，w 3和w 4各自独立地 表示氢或取代基，*表示通式（1）中偶氮键的连接点。

公开(公告)号：WO2008096836A1

公开(公告)日：2008-08-14

申请号：PCT/JP2008/052090

申请日：2008-02-04

Applicant: FUJIFILM Corporation ,  EIHA, Noriko ,  ITO, Hidekane ,  WATANABE, Seiichi

Inventor： EIHA, Noriko ,  ITO, Hidekane ,  WATANABE, Seiichi

IPC: B29C31/06

CPC classification number: B29C31/063 ,  B29C31/048

Abstract: A resin material measuring method which obtains a prescribed amount of a resin material by measuring liquid resin material, the resin material measuring method including: charging the resin material having a fluidity into an internal space of a cylinder (10) using a cylinder-piston mechanism which includes: the cylinder having a discharge aperture (15) at one end (10c) and the internal space being constant in cross-sectional area; and a piston (11) which is inserted in the internal space; determining a necessary movement stroke length of the piston corresponding to the resin material of a prescribed volume according to a relationship between the volume of the resin material and the cross-sectional area and the movement stroke length; discharging the resin material from the cylinder through the discharge aperture by moving the piston by the determined movement stroke length; and cutting the discharged resin material from the resin material located inside the cylinder.

Abstract translation: 一种通过测量液体树脂材料来获得规定量的树脂材料的树脂材料测量方法，该树脂材料测量方法包括：使用气缸活塞机构将具有流动性的树脂材料装入圆筒（10）的内部空间 其包括：所述圆柱体在一端（10c）具有排出孔（15），并且所述内部空间的横截面积恒定; 以及插入在所述内部空间中的活塞（11） 根据树脂材料的体积与横截面积之间的关系和移动冲程长度，确定与规定体积的树脂材料相对应的活塞的必要移动行程长度; 通过使活塞移动所确定的移动行程长度，通过排出孔将树脂材料从气缸排出; 并且从位于气缸内部的树脂材料切割排出的树脂材料。

公开(公告)号：WO2008093856A1

公开(公告)日：2008-08-07

申请号：PCT/JP2008/051698

申请日：2008-01-28

Applicant: FUJIFILM Corporation ,  WADA, Kenji

Inventor： WADA, Kenji

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/20

CPC classification number: G03F7/0397 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0758 ,  G03F7/2041

Abstract: A positive resist composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under action of an acid; and (C) a compound capable of decomposing under action of an acid to generate an acid.

Abstract translation: 正型抗蚀剂组合物包括：（A）在用光化射线或辐射照射时能够产生酸的化合物; （B）在酸的作用下在碱性显影剂中的溶解度增加的树脂; 和（C）能够在酸作用下分解以产生酸的化合物。

公开(公告)号：WO2008044755A1

公开(公告)日：2008-04-17

申请号：PCT/JP2007/069909

申请日：2007-10-04

Applicant: FUJIFILM Corporation ,  TATEISHI, Keiichi ,  ARAI, Yoshimitsu

Inventor： TATEISHI, Keiichi ,  ARAI, Yoshimitsu

IPC: C09D11/00

CPC classification number: C09D11/328

Abstract: An ink composition includes a colorant represented by the following formula (I); water; a guanidine-based compound; and a colorless water-soluble planar compound having more than ten delocalized p-electrons within one molecule: Formula (I) wherein Pc represents a (k+l+m+n)-valent phthalocyanine nucleus represented by the following formula (II); Formula (II) wherein the symbols in the formulae (I) and (II) are defined in the specification.

Abstract translation: 油墨组合物包含由下式（I）表示的着色剂; 水; 基于胍的化合物; 和在一分子内具有多于十个离域p电子的无色水溶性平面化合物：式（I）其中Pc表示由下式（II）表示的（k + 1 + m + n）价酞菁核; 其中式（I）和（II）中的符号在说明书中定义的式（II）。

公开(公告)号：WO2007119869A1

公开(公告)日：2007-10-25

申请号：PCT/JP2007/058475

申请日：2007-04-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  NISHI, Syoichi

Inventor： INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  NISHI, Syoichi

IPC: H05K13/04

CPC classification number: H05K13/08 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/303 ,  H05K3/3484 ,  H05K13/0413 ,  H05K2203/0195 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53091 ,  Y10T29/53174

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract translation: 在由多个电子部件安装装置形成的电子部件安装系统通过彼此连接构成安装电路板的电子部件安装工艺中，印刷在电路板上的焊膏位置的数据作为前馈传送 数据到电子元件放置装置和放置状态检查装置。 基于焊接位置数据，更新控制参数，该控制参数控制由于电子元件放置设备而导致的元件放置操作中的放置位置和指示在放置状态检查中的元件的标准位置的检查参数。 因此，可以通过有效且适当地使用从各处理获得的检查信息来实现精确的安装。

公开(公告)号：WO2007077969A1

公开(公告)日：2007-07-12

申请号：PCT/JP2006/326393

申请日：2006-12-27

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  TOKUNAGA, Yoshimi

Inventor： TOKUNAGA, Yoshimi

IPC: H04B3/54

CPC classification number: H04B3/54 ,  H04B2203/545 ,  H04B2203/5454 ,  H04B2203/5458

Abstract: To provide an AC adaptor, which is capable of suppressing unnecessary radiation even when the cable length of a DC cable is set to be long, and a power line communication system using the AC adaptor. A power line communication modem 90 within a network camera 7 outputs a communication signal to an AC adaptor 6. Then, a signal superimposition and separation circuit 4 of the AC adaptor 6 separates a received communication signal from a DC voltage and an amplifier 66 of the AC adaptor 6 amplifies a signal level of the communication signal and then outputs the amplified signal to a power line 1 through a plug 45. The communication signal is transmitted through a DC cable under a state in which a signal level of the communication signal is attenuated. Accordingly, even when the cable length of a DC cable is large, unnecessary radiation can be suppressed.

Abstract translation: 即使在将直流电缆的电缆长度设定为长时，也能够抑制不必要的辐射的AC适配器以及使用该AC适配器的电力线通信系统。 网络摄像机7内的电力线通信调制解调器90将通信信号输出到AC适配器6.然后，AC适配器6的信号叠加和分离电路4将接收到的通信信号与DC电压和 AC适配器6放大通信信号的信号电平，然后通过插头45将放大的信号输出到电力线1.通信信号通过DC电缆在通信信号的信号电平被衰减的状态下传输 。 因此，即使直流电缆的电缆长度大，也可以抑制不必要的辐射。

公开(公告)号：WO2007069754A1

公开(公告)日：2007-06-21

申请号：PCT/JP2006/325136

申请日：2006-12-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  TANAKA, Tetsuya ,  MIYAHARA, Seiichi

Inventor： TANAKA, Tetsuya ,  MIYAHARA, Seiichi

IPC: B41F15/22 ,  B41F15/26 ,  B41F15/18 ,  B41F15/08 ,  H05K3/00

CPC classification number: H05K3/1233 ,  B41F15/26 ,  B41P2215/114 ,  B41P2215/14 ,  H05K2203/0264

Abstract: To provide a screen printing apparatus and a screen printing method which can enhance a plate separating property after a printing operation regardless of a type of a mask, thereby suppressing occurrence of printing failure. A screen printing apparatus includes mask supporting means 6 for supporting a mask 2 from the rear surface thereof, holding means 20 for holding a printing medium 3, posture changing means 30 for changing a posture of the printing medium 3 held by the holding means 20 between a parallel posture parallel to the mask 2 and a tilted posture tilted about the mask 2, and lifting means for lifting the holding means 20 so as to contact and separate the surface of the printing medium 3 with or from the rear surface of the mask 2. Here, the printing medium 3 having been subjected to a pattern printing operation is separated from the mask 2 from one end of the printing medium to the other end thereof. Accordingly, it is possible to enhance a separating property between the printing medium 3 and the mask 2, thereby suppressing occurrence of printing failure.

Abstract translation: 为了提供丝网印刷装置和丝网印刷方法，其可以在印刷操作之后增强印版分离性能，而与掩模类型无关，从而抑制印刷失败的发生。 丝网印刷装置包括用于从其后表面支撑掩模2的掩模支撑装置6，用于保持打印介质3的保持装置20，用于改变由保持装置20保持的打印介质3的姿势的姿势改变装置30， 平行于掩模2的平行姿势和围绕掩模2倾斜的倾斜姿势;以及提升装置，用于提升保持装置20，以便与打印介质3的表面接触和分离与面罩2的后表面 这里，已经进行图案印刷操作的打印介质3从掩模2从打印介质的一端分离到其另一端。 因此，可以提高打印介质3和掩模2之间的分离性，从而抑制印刷失败的发生。

公开(公告)号：WO2007061123A1

公开(公告)日：2007-05-31

申请号：PCT/JP2006/323870

申请日：2006-11-22

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  HUNT, Nevil

Inventor： HUNT, Nevil

IPC: H04M19/04

CPC classification number: H04M19/04

Abstract: In a portable wireless transceiver such as a mobile telephone, the spectral content of a polyphonic ringtone is reduced if a call is not answered after a predetermined period of time, in order to render the ringtone more audible.

Abstract translation: 在诸如移动电话的便携式无线收发机中，如果在预定时间段之后呼叫未被应答，则为了使铃声更可听，则和弦铃声的频谱内容将被减少。

公开(公告)号：WO2007043355A1

公开(公告)日：2007-04-19

申请号：PCT/JP2006/319403

申请日：2006-09-22

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SAKAI, Tadahiko ,  EIFUKU, Hideki

Inventor： SAKAI, Tadahiko ,  EIFUKU, Hideki

IPC: H01L21/60

CPC classification number: H05K3/3436 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0781 ,  H05K3/323 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0475 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599

Abstract: An electronic component mounting method for mounting a electronic component on a board, in which an Au bump provided at an electronic component is joined to a joining terminal formed on a board by using solder made of Sn or solder containing Sn and the electronic component is adhered to the board by means of thermosetting resin thereby to mount the electronic component on the board. The applied thermosetting resin is flown toward the outside by the lower surface of the electronic component, then a part of the solder particles contained within the thermosetting resin are made in contact with the side surfaces of the Au bumps which are heated to the temperature higher than the melting point of the solder and also another part of the solder particles are molten in a state of being sandwiched between the Au bumps and the electrodes. Thus, the diffusion of Sn into the Au bumps from the outside is promoted and so the density of Sn within the Au bumps can be increased. Further, the diffusion of Sn into the Au bump from a solder joining portion can be suppressed and so the generation of Kirkendall voids can be suppressed.

Abstract translation: 一种用于将电子部件安装在电子部件上的电子部件安装方法，其中设置在电子部件处的Au凸块通过使用由Sn制成的焊料或包含Sn的焊料和电子部件而接合到形成在板上的接合端子，并且电子部件被粘合 通过热固性树脂到板上，从而将电子部件安装在板上。 涂布的热固性树脂通过电子部件的下表面向外部流动，使包含在热固性树脂内的焊料粒子的一部分与Au凸块的侧面接触，加热到高于 焊料的熔点以及焊料颗粒的另一部分在夹在Au凸块和电极之间的状态下熔融。 因此，促进了Sn从外部扩散到Au凸块中，因此可以增加Au凸块内的Sn的密度。 此外，可以抑制Sn从焊料接合部扩散到Au凸块中，因此可以抑制Kirkendall空隙的产生。

公开(公告)号：WO2007032418A1

公开(公告)日：2007-03-22

申请号：PCT/JP2006/318226

申请日：2006-09-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  IWAI, Tetsuhiro

Inventor： IWAI, Tetsuhiro

IPC: H01J37/32

CPC classification number: H01J37/32009 ,  H01J37/32559 ,  H01J2237/334

Abstract: In a plasma treating apparatus for carrying out a plasma treatment by setting a plate-shaped work to be an object, an electrode member ( 46) to abut on a lower surface of the work is constituted by soldering a plate-shaped suction member (45) having a plurality of through holes ( 45a) formed thereon and a cooling plate (44) , and a sprayed film (65) obtained by spraying alumina is formed on an upper surface of the suction member (45) , and furthermore, an edge of a hole portion (45d) in which the through holes (45) a are formed is covered with the sprayed film (65) . Consequently, it is possible to reduce a consumption of the electrode member due to sputtering to prolong a lifetime, thereby decreasing a component consuming cost and preventing an inner part of the apparatus from being contaminated by a scattered substance .

Abstract translation: 在通过将板状作业设定为对象来进行等离子体处理的等离子体处理装置中，通过将板状吸引部件（45）焊接在一起而构成工件下表面的电极部件（46） ）上形成有多个通孔（45a）和冷却板（44），并且在抽吸构件（45）的上表面上形成有通过喷涂氧化铝获得的喷涂膜（65），此外，边缘 其中形成有通孔（45）a的孔部（45d）被喷涂膜（65）覆盖。 因此，可以减少由于溅射引起的电极部件的消耗以延长寿命，从而降低部件消耗成本并防止装置的内部被散射物质污染。