Abstract:
Power saving in wireless networks is disclosed. A wireless network entity that includes a module to enable a reduction in power consumption in that wireless network entity is also disclosed. The module is configured to determine that a selected wireless station of one or more wireless stations associated with the wireless network entity in a same wireless network will transmit system control information (including synchronization information and service identification information) that is normally transmitted by the wireless network entity.
Abstract:
A high capacitance embedded capacitor and associated fabrication processes are disclosed for fabricating a capacitor stack in a multi-layer stack to include a first capacitor plate conductor formed with a cylinder-shaped storage node electrode formed in the multi-layer stack, a capacitor dielectric layer surrounding the cylinder-shaped storage node electrode, and a second capacitor plate conductor formed from a conductive layer in the multi-layer stack that is sandwiched between a bottom and top dielectric layer, where the cylinder-shaped storage node electrode is surrounded by and extends through the conductive layer.
Abstract:
A method of managing a solid-state drive. The method comprises coupling a flash memory device, serially connected with other flash memory devices to form a channel to further form a high-capacity flash memory structure, to a physica! bank of a solid-state drive controller; mapping a logical address from a flash translation fayer to a physical bank of the solid-state drive controller; and mapping the address in the physical bank of the solid-state drive controller to a plurality of physical addresses in the flash memory device.
Abstract:
A three-dimensional integrated circuit non-volatile memory array includes a memory array with first and second NAND memory cell string stacks having opposite orientations, where each NAND memory cell string includes a plurality of transistors and a source line contact connected in series between a bit line and string extension region which extends from the source line contact and past a first self-aligned SSL gate electrode located on a peripheral end of the NAND memory cell string, and also includes a string select transistor formed with a second self-aligned SSL connected in series between the bit line and the plurality of transistors, where the first and second self-aligned SSL gate electrodes are shared between adjacent NAND memory cell strings having opposite orientations.
Abstract:
A flash memory device comprising a local sensing circuitry is provided in a hierarchical structure with local and global bit lines. The local sensing circuitry comprise read and pass circuits configured to sense and amplify read currents during read operations, wherein the amplified read signals may be passed to a global circuit via the local and global bit lines.
Abstract:
A network access system providing network access to a mobile terminal or other device via an untrusted access point such as a wireless access point in an untrusted network. The access point registers with a service gateway, and the wireless terminal connects with the access point and receives a first network address for use with the service gateway. The terminal registers with the service gateway via the access point, and a context identity is maintained at the service gateway, associating the terminal with the access point for the duration of the connection. The terminal can then access a wider network through the service gateway. The service gateway may maintain billing and reward data associated with the context identity.
Abstract:
A non-volatile memory device, comprising: a substrate; a plurality of string stacks disposed over the substrate, each string stack comprising a long axis and a short axis in a plane parallel to the substrate, the long axis extending along a y- direction and the short axis extending along an x-direction, each string stack comprising a plurality of strings being stacked in a direction vertical to the substrate and having a first end and a second end at different locations in the y-direction, the plurality of string stacks comprising a first and a second set of string stacks, at least some of the string stacks of the first set of string stacks being offset along the x- direction from at least some of the string stacks of the second set of string stacks.
Abstract:
A three-dimensional NAND memory device and an associated method for manufacturing this device are provided. The three-dimensional NAND memory device includes a source contact electrically isolated from a conductive gate material. The source contact also electrically connects a conductive source line to a first silicon strip and a second silicon strip through the conductive gate material.
Abstract:
A memory device multi-chip package containing conventional parallel bus flash memory dies interfacing to an external parallel bus having the same format and protocol. A bridge chip within the memory device interfaces internally over one or more internal parallel bus interfaces to the flash dies within the package. The bridge chip presents a single load on the external bus interface so that several memory device multi-chip packages (MCPs) can be connected to a controller, thereby increasing the number of flash dies supported by a single controller channel operating at full performance.
Abstract:
A high capacitance embedded metal interconnect capacitor and associated fabrication processes are disclosed for using a directional barrier metal formation sequence in a dual damascene copper process to form multi-layer stacked copper interconnect structure having reduced barrier metal layer formation at the bottom of each via hole so that the multi- layer stacked copper interconnect structure may be readily removed and replaced with high capacitance MIM capacitor layers.