公开(公告)号：WO2005076353A2

公开(公告)日：2005-08-18

申请号：PCT/US2005/002534

申请日：2005-01-28

Applicant: ALIEN TECHNOLOGY CORPORATION ,  SWINDLEHURST, Susan ,  HADLEY, Mark, A. ,  DRZAIC, Paul, S. ,  CRAIG, Gordon, S., W. ,  GENGEL, Glenn ,  HERRMANN, Scott ,  TOOTOOCHI, Aly ,  EISENHARDT, Randolph, W.

Inventor： SWINDLEHURST, Susan ,  HADLEY, Mark, A. ,  DRZAIC, Paul, S. ,  CRAIG, Gordon, S., W. ,  GENGEL, Glenn ,  HERRMANN, Scott ,  TOOTOOCHI, Aly ,  EISENHARDT, Randolph, W.

IPC: H01L25/16

CPC classification number: G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: An apparatus incorporating small-feature size and large-feature­-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-­scale component to the integrated circuit. The large-scale component includes a second substrate.

Abstract translation: 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：WO2005076353A3

公开(公告)日：2006-02-02

申请号：PCT/US2005002534

申请日：2005-01-28

Applicant: ALIEN TECHNOLOGY CORP ,  SWINDLEHURST SUSAN ,  HADLEY MARK A ,  DRZAIC PAUL S ,  CRAIG GORDON S W ,  GENGEL GLENN ,  HERRMANN SCOTT ,  TOOTOOCHI ALY ,  EISENHARDT RANDOLPH W

Inventor： SWINDLEHURST SUSAN ,  HADLEY MARK A ,  DRZAIC PAUL S ,  CRAIG GORDON S W ,  GENGEL GLENN ,  HERRMANN SCOTT ,  TOOTOOCHI ALY ,  EISENHARDT RANDOLPH W

IPC: G06K19/077 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L29/06

CPC classification number: G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: An apparatus incorporating small-feature size and large-feature­-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-­scale component to the integrated circuit. The large-scale component includes a second substrate.

Abstract translation: 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。