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1.发明申请METHOD OF MANUFACTURING RFID DEVICES USING FLUIDIC SELF ASSEMBLY AND A LOCAL 审中-公开使用流体自组装和本地制造RFID设备的方法
公开(公告)号：WO2006052955A3
公开(公告)日：2007-04-19
申请号：PCT/US2005040410
申请日：2005-11-08
Applicant: ALIEN TECHNOLOGIES INC , CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
Inventor： CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
IPC: H01L21/98 , H01L21/60 , H01L23/498
CPC classification number: G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
Abstract: Methods and apparatuses for an electronic assembly. A material is selectively- printed on a web substrate (2502) at one or more selected areas. The web substrate (2502) includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head (2510, 2512) that dispenses the selected material is used to print. The print head is coupled to a guidance system (2508) capable of registering an alignment feature on the web substrate.
Abstract translation: 电子组件的方法和装置。 在一个或多个选定区域上的材料被选择性地印刷在网状基底（2502）上。 网状基板（2502）包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头（2510,2512）的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统（2508）。
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公开(公告)号：WO2006052955A2
公开(公告)日：2006-05-18
申请号：PCT/US2005/040410
申请日：2005-11-08
Applicant: ALIEN TECHNOLOGIES, INC. , CRAIG, Gordon, S., W. , TOOTOONCHI, Aly , EISENHARDT, Randy , HERRMANN, Scott , HADLEY, Mark, A. , DRZAIC, Paul
Inventor： CRAIG, Gordon, S., W. , TOOTOONCHI, Aly , EISENHARDT, Randy , HERRMANN, Scott , HADLEY, Mark, A. , DRZAIC, Paul
CPC classification number: G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
Abstract: Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits., A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.
Abstract translation: 用于电子组件的方法和装置。 材料在一个或多个选定区域选择性地印刷在幅材基底上。 纤维网基材包括具有集成电路的多个功能部件。配备有分配所选材料的打印头的本地打印系统用于打印。 打印头连接到能够在纤网基材上记录对齐特征的引导系统。
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Patent Agency Ranking3.发明申请APPARATUS INCORPORATING SMALL-FEATURE-SIZE AND LARGE-FEATURE-SIZE COMPONENTS AND METHOD FOR MAKING SAME 审中-公开包含小尺寸和大特征尺寸组件的装置及其制造方法
公开(公告)号：WO2005076353A3
公开(公告)日：2006-02-02
申请号：PCT/US2005002534
申请日：2005-01-28
Applicant: ALIEN TECHNOLOGY CORP , SWINDLEHURST SUSAN , HADLEY MARK A , DRZAIC PAUL S , CRAIG GORDON S W , GENGEL GLENN , HERRMANN SCOTT , TOOTOOCHI ALY , EISENHARDT RANDOLPH W
Inventor： SWINDLEHURST SUSAN , HADLEY MARK A , DRZAIC PAUL S , CRAIG GORDON S W , GENGEL GLENN , HERRMANN SCOTT , TOOTOOCHI ALY , EISENHARDT RANDOLPH W
IPC: G06K19/077 , H01L21/60 , H01L23/498 , H01L23/538 , H01L25/16 , H01L29/06
CPC classification number: G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
Abstract translation: 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。
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公开(公告)号：WO2006052955A9
公开(公告)日：2006-07-27
申请号：PCT/US2005040410
申请日：2005-11-08
Applicant: ALIEN TECHNOLOGIES INC , CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
Inventor： CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
CPC classification number: G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
Abstract: Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits., A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.
Abstract translation: 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。
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公开(公告)号：WO2007001442A3
公开(公告)日：2007-05-18
申请号：PCT/US2005039755
申请日：2005-11-03
Applicant: ALIEN TECHNOLOGY CORP , HERRMANN SCOTT JOHN , HADLEY MARK ALFRED , CRAIG GORDON SAMUEL WIGGINS , HATTICK JOHN BERHARD , DRZAIC PAUL STEPHEN , KANEMOTO ERIC RYAN
Inventor： HERRMANN SCOTT JOHN , HADLEY MARK ALFRED , CRAIG GORDON SAMUEL WIGGINS , HATTICK JOHN BERHARD , DRZAIC PAUL STEPHEN , KANEMOTO ERIC RYAN
IPC: G06K19/077
CPC classification number: G06K19/07735 , G06K19/077 , G08B13/244 , H01Q17/004 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124
Abstract: Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.
Abstract translation: 描述了用于保护射频识别（RFID）设备的方法和设备。 在一个方面，将静电消散材料应用于天线结构的腹板。 静电消散材料的涂层连续地施加在卷筒材料卷的多个天线结构上。 将RFID集成电路（IC）连接到具有耗散涂层的天线结构网上，随后在辊上进行测试。 执行对RFID标签的附加处理以产生RFID标签。
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6.发明申请APPARATUS INCORPORATING SMALL-FEATURE-SIZE AND LARGE-FEATURE-SIZE COMPONENTS AND METHOD FOR MAKING SAME 审中-公开包含小尺寸和大特征尺寸组件的装置及其制造方法
公开(公告)号：WO2005076353A2
公开(公告)日：2005-08-18
申请号：PCT/US2005/002534
申请日：2005-01-28
Applicant: ALIEN TECHNOLOGY CORPORATION , SWINDLEHURST, Susan , HADLEY, Mark, A. , DRZAIC, Paul, S. , CRAIG, Gordon, S., W. , GENGEL, Glenn , HERRMANN, Scott , TOOTOOCHI, Aly , EISENHARDT, Randolph, W.
Inventor： SWINDLEHURST, Susan , HADLEY, Mark, A. , DRZAIC, Paul, S. , CRAIG, Gordon, S., W. , GENGEL, Glenn , HERRMANN, Scott , TOOTOOCHI, Aly , EISENHARDT, Randolph, W.
IPC: H01L25/16
CPC classification number: G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
Abstract translation: 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。
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公开(公告)号：WO2007001442A2
公开(公告)日：2007-01-04
申请号：PCT/US2005/039755
申请日：2005-11-03
Applicant: ALIEN TECHNOLOGY CORPORATION , HERRMANN, Scott, John , HADLEY, Mark, Alfred , CRAIG, Gordon, Samuel, Wiggins , HATTICK, John, Berhard , DRZAIC, Paul, Stephen , KANEMOTO, Eric, Ryan
Inventor： HERRMANN, Scott, John , HADLEY, Mark, Alfred , CRAIG, Gordon, Samuel, Wiggins , HATTICK, John, Berhard , DRZAIC, Paul, Stephen , KANEMOTO, Eric, Ryan
CPC classification number: G06K19/07735 , G06K19/077 , G08B13/244 , H01Q17/004 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124
Abstract: Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.
Abstract translation: 描述了用于保护射频识别（RFID）设备的方法和设备。 在一个方面，将静电消散材料应用于天线结构的腹板。 静电消散材料的涂层连续地跨越卷筒材料卷的多个天线结构施加。 将RFID集成电路（IC）连接到具有消散涂层的天线结构网上，随后在辊上测试。 对RFID标签执行附加处理以产生RFID标签。
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