公开(公告)号：WO2011139454A1

公开(公告)日：2011-11-10

申请号：PCT/US2011/031107

申请日：2011-04-04

Applicant: INDIUM CORORATION ,  ZHANG, Hongwen ,  LEE, Ning-Cheng

Inventor： ZHANG, Hongwen ,  LEE, Ning-Cheng

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/362

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/362 ,  C22C12/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T428/12493 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A solder paste comprises an amount of a first solder alloy powder between about 60 wt% to about 92 wt%; an amount of a second solder alloy powder greater than 0 wt% and less than about 12 wt%; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260°C; and wherein the second solder alloy powder comprises a second solder alloy that has a sol idus temperature that is less than about 250°C.

Abstract translation: 焊膏包括一定量的第一焊料合金粉末，其在约60重量％至约92重量％之间; 大于0重量％且小于约12重量％的第二焊料合金粉末的量; 和助焊剂; 其中所述第一焊料合金粉末包括固相线温度高于约260℃的第一焊料合金; 并且其中所述第二焊料合金粉末包含具有小于约250℃的溶胶粘度温度的第二焊料合金。

公开(公告)号：WO2007027428A3

公开(公告)日：2007-03-08

申请号：PCT/US2006/031776

申请日：2006-08-15

Applicant: INDIUM CORPORATION OF AMERICA ,  HUANG, Benlih ,  HWANG, Hong-sik ,  LEE, Ning-cheng

Inventor： HUANG, Benlih ,  HWANG, Hong-sik ,  LEE, Ning-cheng

IPC: C22C13/00

Abstract: A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

公开(公告)号：WO2011163599A2

公开(公告)日：2011-12-29

申请号：PCT/US2011/041838

申请日：2011-06-24

Applicant: INDIUM CORPORATION ,  CHEN, Sihai ,  LEE, Ning-Cheng

Inventor： CHEN, Sihai ,  LEE, Ning-Cheng

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/13109 ,  H01L2224/1357 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13599 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13618 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/0102 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of

Abstract translation: 描述了以相对低的温度，优选低于铟的熔点进行有效的金属凸点接合的方法。 为了获得较低的加工温度（优选实施方案具有<100℃的熔点），在铟凸块表面上沉积金属或合金层。 优选地，选择材料使得金属或合金形成比下面的铟材料更耐氧化的钝化层。 还优选选择钝化材料以在铟凸块表面上形成具有铟的低熔点合金。 这通常通过将钝化材料扩散到铟中以形成扩散层合金来实现。 可用于与铟形成二元至四元低熔点合金的各种金属，包括Ga，Bi，Sn，Pb和Cd。 另外，Sn，Sn-Zn等金属向Ga-In合金中扩散; Sn，Cd，Pb-Sn合金成Bi-In合金; Cd，Zn，Pb，Pb-Cd成Sn-In合金可以帮助调整合金的熔点。

公开(公告)号：WO2011112722A1

公开(公告)日：2011-09-15

申请号：PCT/US2011/027759

申请日：2011-03-09

Applicant: INDIUM CORPORATION ,  LIU, Weiping ,  LEE, Ning-Cheng

Inventor： LIU, Weiping ,  LEE, Ning-Cheng

IPC: B23K35/02 ,  B23K35/26

CPC classification number: B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/15747 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

Abstract: Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs ). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.

Abstract translation: 本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。 层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。 在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。 所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。 接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

公开(公告)号：WO2011163599A3

公开(公告)日：2012-02-23

申请号：PCT/US2011041838

申请日：2011-06-24

Applicant: INDIUM CORP ,  CHEN SIHAI ,  LEE NING-CHENG

Inventor： CHEN SIHAI ,  LEE NING-CHENG

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/13109 ,  H01L2224/1357 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13599 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13618 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/0102 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A process of efficient metal bump bonding with relatively low temperatures, preferably lower than the melting point of indium, is described. To obtain a lower processing temperature (preferred embodiments have a melting point of

Abstract translation: 描述了以相对低的温度（优选低于铟的熔点）进行有效的金属凸块接合的工艺。 为了获得较低的加工温度（优选实施方案具有<100℃的熔点），在铟凸块（134）表面上沉积金属或合金层（138）。 优选地，选择材料使得金属或合金形成比下面的铟材料更耐氧化的钝化层。 还优选选择钝化材料以在铟凸块（134）表面上形成具有铟的低熔点合金。 这通常通过将钝化材料扩散到铟中以形成扩散层合金来实现。 可以使用包括Ga，Bi，Sn，Pb和Cd在内的各种金属与铟形成二元至四元低熔点合金。 另外，Sn，Sn-Zn等金属向Ga-In合金中扩散; Sn，Cd，Pb-Sn合金成Bi-In合金; Cd，Zn，Pb，Pb-Cd成Sn-In合金可以帮助调整合金的熔点。

公开(公告)号：WO2011137360A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/034596

申请日：2011-04-29

Applicant: INDIUM CORPORATION ,  CHEN, Sihai ,  LEE, Ning-Cheng

Inventor： CHEN, Sihai ,  LEE, Ning-Cheng

IPC: H01L23/373 ,  C09K5/14

CPC classification number: C09K5/14 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A composition for a highly reliable thermal interface materials includes: (A) moisture-resistant polymer with a water permeability coefficient preferably less than 10 -11 cm 3 (STP) cm/cm 2 S Pa, (B) gas barrier polymer having oxygen permeability coefficient preferably less than 10 -14 cm 3 (STP) cm/cm 2 S Pa, (C) antioxidant, (D) thermal conductive filler and ( E) other additive or optional materials. The thermal interface materials placed in between the thermal generating and dissipating devices can effectively barrier water and oxygen penetration, preventing the thermal fillers from degradation and improving the reliability of the devices.

Abstract translation: 用于高可靠性热界面材料的组合物包括：（A）具有优选小于10-11cm 3（STP）cm / cm 2 S Pa的透水系数的耐湿聚合物，（B）优选具有氧气渗透系数的阻气聚合物 小于10-14厘米3（STP）cm / cm2 S Pa，（C）抗氧化剂，（D）导热填料和（E）其他添加剂或任选材料。 放置在发热和散热装置之间的热界面材料可以有效地阻挡水和氧气渗透，防止热填料降解并提高设备的可靠性。

公开(公告)号：WO2007027428A2

公开(公告)日：2007-03-08

申请号：PCT/US2006031776

申请日：2006-08-15

Applicant: INDIUM CORP AMERICA ,  HUANG BENLIH ,  HWANG HONG-SIK ,  LEE NING-CHENG

Inventor： HUANG BENLIH ,  HWANG HONG-SIK ,  LEE NING-CHENG

IPC: C22C13/00

CPC classification number: C22C11/06 ,  B23K35/262 ,  C22C13/00

Abstract: A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

Abstract translation: 公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 至少一种稀土元素。