Abstract:
Disclosed is a portable device comprising a first touch-screen display and a second touch-screen display arranged on at least one foldable panel, and a method for controlling the portable device. In certain embodiments, a portable device displays pieces of information linked to each other through two touch-screen displays, and a user may interact with the portable device through a touch gesture sensed in at least one of the two touch-screen displays. In certain embodiments, a portable device provides, through two touch-screen displays, dual homepages, mode-switching capability, a pocket mode homepage screen, a gallery map, a task manager, a private broadcast, a clipboard, an electronic book, a video conference, a cooperative game, a calendar, a phone conversation, a camera, mode-switching capability by sensing the folding/unfolding of the panel, and/or the display of information over a hinge between panels.
Abstract:
The present invention relates to a valve for preventing reverse-flow employing a pneumatic cylinder to operate the isolating plate. A usage of separate power source for driving the isolating plate and the resulting geometry of the inner structure of the valve for preventing reverse-flow according to the present invention enable the isolating plate to be placed so as not to reduce exhaust conductance. Due to the enhanced exhaust conductance of the valve for preventing reverse-flow in accordance with the present invention, and therefore, a process time decreases, exhaust efficiency is improved and a reverse flow caused by a sudden stoppage of the vacuum pump can be rapidly and safely prevented so that the vacuum chamber is prevented from being contaminated.
Abstract:
A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
Abstract:
A multifunctional die attachment film used in a semiconductor packaging process includes a first die attachment film attached to a surface of a wafer having fine circuit patterns and solder bump patterns and having a first adhesive strength; and a second die attachment film attached on the first die attachment film and having a second adhesive strength with a wafer, a die chip, PCB and a flexible board, and the multifunctional die attachment film serves as a backgrinding tape in a backgrinding process, and after the backgrinding process is completed, the multifunctional die attachment film is not removed, but is used to attach a die chip to a connection member. And, the present invention utilizes the die attachment film as a backgrinding tape in the backgrinding process and concurrently a wafer protection means in a wafer dicing process, thereby preventing sawing burr, scratches or cracks.
Abstract:
The present invention relates to an insulating heater jacket, more particularly to an insulating heater jacket comprising a sheet-type heating section, and an insulating jacket, wherein the heating section and the insulating jacket have a detachable combining structure so that they can be combined with or detached from each other. Due to the detachable combining structure, the heating section and the insulating jacket of the insulating heater jacket according to the present invention can be easily combined with and detached from each other and, thus, only the damaged part can be replaced when a problem occurs.
Abstract:
The present invention relates to a foldable bookstand, and more particularly, to a foldable bookstand formed by a support frame having an extensible module as a basic unit and in which the centers of crossed rods are hinged together such that the rods can be opened into an X-shape and folded into the shape of a straight line. The extensible modules are coupled together in a horizontal direction so as to form an extensible frame. The support frame can be opened when a user uses the bookstand, and folded so as to be conveniently stored or carried after use.
Abstract:
The present invention relates to a foldable bookstand, and more particularly, to a foldable bookstand formed by a support frame having an extensible module as a basic unit and in which the centers of crossed rods are hinged together such that the rods can be opened into an X-shape and folded into the shape of a straight line. The extensible modules are coupled together in a horizontal direction so as to form an extensible frame. The support frame can be opened when a user uses the bookstand, and folded so as to be conveniently stored or carried after use.
Abstract:
The present invention relates to a method and to an apparatus for extracting information from content evaluated by user feedback and for using the information. According to one embodiment of the present invention, a method is provided for extracting information, comprising the step of extracting at least one keyword from a portion of highly evaluated components among a variety of components of content evaluated by user feedback.
Abstract:
The present invention relates to a heat generating bag which can heat water, a beverage or the like contained in a vessel such as a cup, bottle, baby bottle, bowl or the like in any place at any time. The present invention provides a heat generating bag comprising: a bag body unit having an interior divided into a water containing portion and a heat generating material containing portion by a partition membrane or an inner bag; a connection pipe extended from one side of the bag body unit into a tubular shape communicated to the heat generating material containing portion or the water containing portion; and a connection string having one end attached to the divided area and the other end exposed outwardly through the connection pipe. When the connection string is pulled, the partition membrane or the inner bag is torn such that heat can be generated by the exothermic reaction between the heat generating material and water.
Abstract:
A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B -staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time.