VALVE FOR PREVENTING REVERSE-FLOW
    2.
    发明申请
    VALVE FOR PREVENTING REVERSE-FLOW 审中-公开
    用于防止反向流动的阀

    公开(公告)号:WO2007139329A1

    公开(公告)日:2007-12-06

    申请号:PCT/KR2007/002577

    申请日:2007-05-29

    Inventor: SEO, Joon-Young

    CPC classification number: F16K15/03

    Abstract: The present invention relates to a valve for preventing reverse-flow employing a pneumatic cylinder to operate the isolating plate. A usage of separate power source for driving the isolating plate and the resulting geometry of the inner structure of the valve for preventing reverse-flow according to the present invention enable the isolating plate to be placed so as not to reduce exhaust conductance. Due to the enhanced exhaust conductance of the valve for preventing reverse-flow in accordance with the present invention, and therefore, a process time decreases, exhaust efficiency is improved and a reverse flow caused by a sudden stoppage of the vacuum pump can be rapidly and safely prevented so that the vacuum chamber is prevented from being contaminated.

    Abstract translation: 本发明涉及一种用于防止采用气缸反向流动来操作隔离板的阀。 根据本发明,用于驱动隔离板的单独的电源和用于防止逆流的阀的内部结构的几何形状的使用使得隔离板能够被放置成不减少排气传导。 由于根据本发明的用于防止逆流的阀的排气传导增强,因此,处理时间减少,排气效率提高,并且真空泵的突然停止引起的反向流可以快速地和 安全地防止真空室受到污染。

    INSULATING HEATER JACKET
    5.
    发明申请
    INSULATING HEATER JACKET 审中-公开
    绝缘加热器夹克

    公开(公告)号:WO2008002022A1

    公开(公告)日:2008-01-03

    申请号:PCT/KR2007/002815

    申请日:2007-06-12

    Inventor: SEO, Joon-Young

    CPC classification number: H05B3/58

    Abstract: The present invention relates to an insulating heater jacket, more particularly to an insulating heater jacket comprising a sheet-type heating section, and an insulating jacket, wherein the heating section and the insulating jacket have a detachable combining structure so that they can be combined with or detached from each other. Due to the detachable combining structure, the heating section and the insulating jacket of the insulating heater jacket according to the present invention can be easily combined with and detached from each other and, thus, only the damaged part can be replaced when a problem occurs.

    Abstract translation: 绝缘加热器护套技术领域本发明涉及一种绝缘加热器护套,更具体地涉及一种包括片状加热部分和绝缘护套的绝缘加热器护套,其中加热部分和绝缘护套具有可拆卸的组合结构,使得它们可以与 或彼此分离。 由于可拆卸的组合结构,根据本发明的绝热加热器护套的加热部分和绝缘护套可以容易地彼此组合和分离,因此当发生问题时,只能损坏部件被更换。

    FOLDABLE BOOKSTAND
    6.
    发明申请
    FOLDABLE BOOKSTAND 审中-公开
    可折叠的书架

    公开(公告)号:WO2012134136A3

    公开(公告)日:2013-01-10

    申请号:PCT/KR2012002199

    申请日:2012-03-27

    Applicant: SEO JOON

    Inventor: SEO JOON

    CPC classification number: A47B23/043

    Abstract: The present invention relates to a foldable bookstand, and more particularly, to a foldable bookstand formed by a support frame having an extensible module as a basic unit and in which the centers of crossed rods are hinged together such that the rods can be opened into an X-shape and folded into the shape of a straight line. The extensible modules are coupled together in a horizontal direction so as to form an extensible frame. The support frame can be opened when a user uses the bookstand, and folded so as to be conveniently stored or carried after use.

    Abstract translation: 可折叠书架技术领域本发明涉及一种可折叠书架,更具体地说,涉及一种可折叠书架,该可折叠书架由具有作为基本单元的可延伸模块的支撑框架形成,并且交叉杆的中心铰接在一起,使得杆可以打开成 X形并折叠成直线形状。 可伸缩模块沿水平方向连接在一起以形成可伸展框架。 当使用者使用书架时,支撑架可以打开,折叠起来以便在使用后方便地存放或携带。

    FOLDABLE BOOKSTAND
    7.
    发明申请
    FOLDABLE BOOKSTAND 审中-公开
    可折叠书柜

    公开(公告)号:WO2012134136A2

    公开(公告)日:2012-10-04

    申请号:PCT/KR2012002199

    申请日:2012-03-27

    Applicant: SEO JOON

    Inventor: SEO JOON

    CPC classification number: A47B23/043

    Abstract: The present invention relates to a foldable bookstand, and more particularly, to a foldable bookstand formed by a support frame having an extensible module as a basic unit and in which the centers of crossed rods are hinged together such that the rods can be opened into an X-shape and folded into the shape of a straight line. The extensible modules are coupled together in a horizontal direction so as to form an extensible frame. The support frame can be opened when a user uses the bookstand, and folded so as to be conveniently stored or carried after use.

    Abstract translation: 更具体地说,本发明涉及一种可折叠书架,更具体地说,涉及一种由支撑框架形成的可折叠书架,所述支架具有可伸缩模块作为基本单元,并且其中交叉杆的中心铰接在一起,使得所述杆可以打开成 X形折叠成直线的形状。 可伸缩模块沿水平方向耦合在一起以便形成可延伸框架。 当用户使用书架时,可以打开支撑框架,并折叠以便在使用后方便地存放或携带。

    METHOD AND APPARATUS FOR EXTRACTING INFORMATION FROM CONTENT EVALUATED BY USER FEEDBACK AND FOR USING SAME
    8.
    发明申请
    METHOD AND APPARATUS FOR EXTRACTING INFORMATION FROM CONTENT EVALUATED BY USER FEEDBACK AND FOR USING SAME 审中-公开
    从用户反馈评估内容提取信息和使用信息的方法和装置

    公开(公告)号:WO2010082734A3

    公开(公告)日:2010-09-23

    申请号:PCT/KR2009007982

    申请日:2009-12-30

    Applicant: KIM SEO-JOON

    Inventor: KIM SEO-JOON

    CPC classification number: G06F17/30616

    Abstract: The present invention relates to a method and to an apparatus for extracting information from content evaluated by user feedback and for using the information. According to one embodiment of the present invention, a method is provided for extracting information, comprising the step of extracting at least one keyword from a portion of highly evaluated components among a variety of components of content evaluated by user feedback.

    Abstract translation: 本发明涉及一种用于从由用户反馈评估的内容和用于使用该信息提取信息的方法和装置。 根据本发明的一个实施例,提供了一种用于提取信息的方法,包括从用户反馈评估的内容的各种组件中的高度评估的组件的一部分中提取至少一个关键字的步骤。

    HEAT GENERATING BAG
    9.
    发明申请
    HEAT GENERATING BAG 审中-公开
    发热袋

    公开(公告)号:WO2011074830A2

    公开(公告)日:2011-06-23

    申请号:PCT/KR2010008805

    申请日:2010-12-09

    Applicant: SEO JOON

    Inventor: SEO JOON

    CPC classification number: A47J36/28

    Abstract: The present invention relates to a heat generating bag which can heat water, a beverage or the like contained in a vessel such as a cup, bottle, baby bottle, bowl or the like in any place at any time. The present invention provides a heat generating bag comprising: a bag body unit having an interior divided into a water containing portion and a heat generating material containing portion by a partition membrane or an inner bag; a connection pipe extended from one side of the bag body unit into a tubular shape communicated to the heat generating material containing portion or the water containing portion; and a connection string having one end attached to the divided area and the other end exposed outwardly through the connection pipe. When the connection string is pulled, the partition membrane or the inner bag is torn such that heat can be generated by the exothermic reaction between the heat generating material and water.

    Abstract translation: 本发明涉及一种发热袋,其可以随时在任何地方加热容纳在诸如杯子,瓶子,婴儿奶瓶,碗等的容器中的水,饮料等。 本发明提供一种发热袋,其特征在于,包括:袋体单元,其具有通过分隔膜或内袋分成含水部的内部和发热体容纳部; 从所述袋体单元的一侧延伸成与所述发热材料容纳部或所述含水部连通的筒状的连接管; 以及连接串,其一端连接到分割区域,另一端通过连接管向外露出。 当连接线被拉动时,分隔膜或内袋被撕裂,使得发热材料和水之间的放热反应可产生热量。

    METHOD FOR PACKAGING SEMICONDUCTOR
    10.
    发明申请
    METHOD FOR PACKAGING SEMICONDUCTOR 审中-公开
    包装半导体的方法

    公开(公告)号:WO2008088120A1

    公开(公告)日:2008-07-24

    申请号:PCT/KR2007/005272

    申请日:2007-10-25

    Abstract: A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B -staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time.

    Abstract translation: 提供一种封装半导体的方法,可以均匀地涂覆芯片附着膏,缩短B阶段的时间,并提高模具的拾取特性和模具附着特性。 该方法包括制备粘度为1500至100,000cps的模头附着膏; 旋转晶片并将晶片附着膏施加到晶片的上表面,形成预定厚度; 并且将施加在晶片上的糊料进行B分级。 该方法可以通过代替WBL(晶片背面层叠)膜,均匀地将晶片附着膏施加到晶片来降低成本,通过调节出料糊的粘度和剂量,自由地控制施加的芯片附着膏的厚度,并且速度 旋转涂布机,并且还通过减少B阶段时间缩短处理时间。

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