公开(公告)号：WO2010103756A1

公开(公告)日：2010-09-16

申请号：PCT/JP2010/001496

申请日：2010-03-04

Applicant: パナソニック株式会社 ,  岩宮裕樹 ,  堺幸雄

Inventor： 岩宮裕樹 ,  堺幸雄

IPC: H01L23/00 ,  H01L23/28 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/1617 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K2201/0919 ,  H05K2201/09354 ,  H01L2924/00

Abstract: 　モジュール部品は、回路基板と、回路基板の上面に実装された部品と、回路基板の上面に設けられてかつ部品を封止する封止部と、回路基板の下面の外周部分に設けられたグランドパターンと、封止部と回路基板とを覆う金属膜とを備える。金属膜は、封止部の上面を覆う天面部と、天面部から延びてかつ回路基板の側面を覆う側面部と、側面部から延びて、グランドパターン上に設けられた底面部とを有する。底面部は側面部から離れるにしたがって小さくなる厚みを有する。このモジュール部品では、回路基板の配線パターンと金属膜とを高信頼性で電気的に接続することができる。

Abstract translation: 模块组件设有：电路板; 安装在电路板的上表面上的部件; 密封部，其布置在所述电路板的上表面上并密封所述部件; 布置在电路板的下表面的外周部上的接地图案; 以及覆盖密封部和电路基板的金属膜。 金属膜具有覆盖密封部的上表面的顶面部， 侧表面部分，其从顶表面部分延伸并覆盖电路板的侧表面; 以及从侧面部延伸设置在地面图案上的底面部。 底表面部分在距离侧部分更远的距离处具有较小的厚度。 在模块组件中，电路板上的布线图案可以与金属膜电连接，可靠性高。

公开(公告)号：WO2005041250A2

公开(公告)日：2005-05-06

申请号：PCT/US2003/041515

申请日：2003-12-30

Applicant: COOKSON ELECTRONICS, INC. ,  GILLEO, Kenneth, B.

Inventor： GILLEO, Kenneth, B.

IPC: H01L

CPC classification number: H01L24/97 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/163 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package for protecting an integrated circuit device having an active side. The package includes a substrate for mounting the integrated circuit device and a plastic cap mounted on the substrate to form an enclosed space for the active side of the integrated circuit device. A thermal bond is formed between the substrate and the plastic cap to effectively seal the enclosed space so as to prevent the ingress of moisture or particulate.

Abstract translation: 一种用于保护具有有源侧的集成电路器件的封装。 封装包括用于安装集成电路器件的基板和安装在基板上的塑料盖，以形成用于集成电路器件的有源侧的封闭空间。 在基板和塑料盖之间形成热粘合，以有效地密封封闭空间，以防止湿气或微粒的进入。

公开(公告)号：WO2004093505A2

公开(公告)日：2004-10-28

申请号：PCT/US2004/011992

申请日：2004-04-15

Applicant: WAVEZERO, INC. ,  ARNOLD, Rocky R. ,  ZARGANIS, John C. ,  MONTAUTI, Fabrizio

Inventor： ARNOLD, Rocky R. ,  ZARGANIS, John C. ,  MONTAUTI, Fabrizio

IPC: H05K

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provide methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract translation: 本发明提供了用于屏蔽电子部件封装的方法和装置。 在一个实施例中，EMI屏蔽件（42）在邻近管芯（12）的封装内整体形成并接地。 EMI屏蔽（42）可以是金属化形状的聚合物层（34），并且可以完全设置在封装内，或者它可以延伸出封装。

公开(公告)号：WO9622669A3

公开(公告)日：1996-09-26

申请号：PCT/US9600309

申请日：1996-01-16

Applicant: SPACE ELECTRONICS INC

Inventor： STROBEL DAVID J ,  CZAJKOWSKI DAVID R

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/06 ,  H01L23/08 ,  H01L23/18 ,  H01L23/552 ,  H01L25/04 ,  H01L25/065 ,  H05K

CPC classification number: H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The radiation shielded and packaged integrated circuit semiconductor device (400) includes a lid (470) secured to a base (410) to enclose the integrated circuit die (480) within, wherein the lid (470) and the base (410) are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment (700) includes a die attach slug (790) constructed from a high-Z material disposed between the integrated circuit die (780) and a base (710), in combination with a high-Z material lid (770) to substantially block incident radiation.

公开(公告)号：WO2008157214A1

公开(公告)日：2008-12-24

申请号：PCT/US2008/066677

申请日：2008-06-12

Applicant: RAYTHEON COMPANY ,  COLOMB, Francois, Y. ,  ADLERSTEIN, Michael, G.

Inventor： COLOMB, Francois, Y. ,  ADLERSTEIN, Michael, G.

IPC: H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/00

Abstract: A method for packaging a semiconductor device. The method includes: providing a dielectric layer over the semiconductor device; determining patterns and placement of material on the dielectric layer to provide a predetermined magnetic or electric effect for the device, such effects being provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between such material and the device; and forming the material in the determined patterns and placement to provide the predetermined effects.

Abstract translation: 一种用于封装半导体器件的方法。 该方法包括：在半导体器件上提供介电层; 确定材料在电介质层上的图案和放置以为器件提供预定的磁或电效应，这种效果仅通过耦合在这种材料和器件之间的电或磁波从这种图案化和放置的材料提供在器件上; 并以确定的图案和放置形成材料以提供预定的效果。

公开(公告)号：WO2003023852A1

公开(公告)日：2003-03-20

申请号：PCT/US2002/027553

申请日：2002-08-30

Applicant: SILICON BANDWIDTH INC. ,  CRANE, Stanford, W. ,  JEON, Myoung-Soo ,  ALCARIA, Vicente, D.

Inventor： CRANE, Stanford, W. ,  JEON, Myoung-Soo ,  ALCARIA, Vicente, D.

IPC: H01L23/12

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaged semiconductor device (10) that is fabricated with a plurality of conductive leads (30) defined in a strip that beneficially includes a radio frequency shield box (16). The conductive contacts are located in a housing (12), beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can receives another semiconductor device. Bonding conductors (53) electrically connect at least one semiconductor device (14) to another semiconductor device (18) and/or to the conductive contacts. A conductive cover (28) is disposed over the housing. The cavity (20) beneficially includes a beveled wall (38) and the conductive leads and the radio frequency shield are beneficially comprised of copper.

Abstract translation: 一种封装的半导体器件（10），其被制造成具有限定在条带中的多个导电引线（30），其有利地包括射频屏蔽盒（16）。 导电触头位于壳体（12）中，有利地是通过嵌入成型或通过夹在底部件和顶部件之间。 壳体可以接收另一半导体器件。 接合导体（53）将至少一个半导体器件（14）电连接到另一半导体器件（18）和/或导电触点。 导电盖（28）设置在壳体上。 腔（20）有利地包括斜面壁（38），并且导电引线和射频屏蔽有利地由铜组成。

公开(公告)号：WO2002071547A1

公开(公告)日：2002-09-12

申请号：PCT/IB2002/000566

申请日：2002-02-25

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.

Inventor： BUIJSMAN, Adrianus, A., J. ,  VERSPEEK, Johannes, M., C. ,  DE GRAAUW, Antonius, J., M.

IPC: H01Q23/00

CPC classification number: H01Q1/2291 ,  H01L23/552 ,  H01L24/48 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q23/00 ,  H04B1/38 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A radio module (10) suitable for RF applications, especially for Bluetooth, comprises a substrate (1) with a semiconductor device (11), a shield (21), and an antenna (31). The shield (21) is located between the antenna (31) and the semiconductor device (11), and is present on the same side (2) of the substrate (1) as the semiconductor device (11) and the antenna (31). By preference, the antenna (31) and the shield (21) are connected to one another by support means (32, 42).

Abstract translation: 适用于射频应用，特别是蓝牙的无线电模块（10）包括具有半导体器件（11），屏蔽（21）和天线（31）的衬底（1）。 屏蔽层21位于天线31和半导体器件11之间，与半导体器件11和天线31一起存在于基板1的同一侧（2）上。 。 优选地，天线（31）和屏蔽（21）通过支撑装置（32,42）彼此连接。

公开(公告)号：WO98047340A1

公开(公告)日：1998-10-22

申请号：PCT/SE1998/000654

申请日：1998-04-08

IPC: H05K1/18 ,  H05K9/00 ,  G12B17/02

CPC classification number: H05K9/003 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1617 ,  Y10S174/34

Abstract: A shielding housing (11) for electrically shielding at least one component on a printed circuit board (12), comprises a layer (14) of a non-shielding material having at least one cavity (15) for receiving said at least one component. An elastic gasket (16) is provided on the rim of said at least one cavity (15). A layer (17) of an electrically shielding material covers the gasket (16) as well as one or both surfaces of said layer (14) of a non-shielding material. In operation, the shielding housing (11) is pressed with its gasket (16) against a conductor (13) located on the printed circuit board (12) around said at least one component to be shielded.

Abstract translation: 用于电屏蔽印刷电路板（12）上的至少一个部件的屏蔽壳体（11）包括具有用于接收所述至少一个部件的至少一个空腔（15）的非屏蔽材料层（14）。 弹性垫圈（16）设置在所述至少一个空腔（15）的边缘上。 电屏蔽材料的层（17）覆盖所述垫片（16）以及所述非屏蔽材料层（14）的一个或两个表面。 在操作中，围绕围绕所述至少一个待屏蔽部件的位于印刷电路板（12）上的导体（13）将屏蔽壳体（11）用垫圈（16）按压。

公开(公告)号：WO1992000605A1

公开(公告)日：1992-01-09

申请号：PCT/US1991002497

申请日：1991-04-12

Applicant: OLIN CORPORATION

Inventor： OLIN CORPORATION ,  MAHULIKAR, Deepak ,  BRADEN, Jeffrey, S. ,  NOE, Stephen, P.

IPC: H01L23/02

CPC classification number: H01L23/10 ,  H01L23/552 ,  H01L23/60 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

公开(公告)号：WO2004093505A3

公开(公告)日：2004-12-09

申请号：PCT/US2004011992

申请日：2004-04-15

Applicant: WAVEZERO INC ,  ARNOLD ROCKY R ,  ZARGANIS JOHN C ,  MONTAUTI FABRIZIO

Inventor： ARNOLD ROCKY R ,  ZARGANIS JOHN C ,  MONTAUTI FABRIZIO

IPC: H01L23/04 ,  H01L23/31 ,  H01L23/433 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provide methods and devices for shielding an electronic component package. In one embodiment, an EMI shield (42) is integrally formed within the package adjacent the die (12) and grounded. The EMI shield (42) may be a metallized shaped polymer layer (34) and may be disposed fully within the package or it may extend out of the package.

Abstract translation: 本发明提供了用于屏蔽电子元件封装的方法和装置。 在一个实施例中，EMI屏蔽件（42）在邻近管芯（12）的封装内整体形成并接地。 EMI屏蔽件（42）可以是金属化成形聚合物层（34），并且可以完全布置在封装内，或者其可以延伸出封装。