Abstract:
Organic compounds showing the ability to inhibit effector toxin secretion or translocation mediated by bacterial type III secretion systems are disclosed. The disclosed type III secretion system inhibitor compounds are useful for combating infections by Gram-negative bacteria such as Salmonella spp., Shigella flexneri, Psendomonas spp., Yersinia spp., en tero pathogenic and enteroinvasive Escherichia co!i, and Chlamydia spp. having such type III secretion systems.
Abstract:
The present invention is related to the development of compounds and methods for inhibiting viral infection in a mammal. A pseudotype virus was developed for use in a high throughput assay for identifying nonpeptidic small molecule inhibitors that prevent viral entry into a host cell.
Abstract:
Organic compounds showing the ability to inhibit effector toxin secretion or translocation mediated by bacterial type III secretion systems are disclosed. The disclosed type III secretion system inhibitor compounds are useful for combating infections by Gram-negative bacteria such as Salmonella spp., Shigella flexneri, Pseudomonas spp., Yersinia spp., enteropathogenic and enteroinvasive Escherichia coli, and Chlamydia spp. having such type III secretion systems.
Abstract:
Organic compounds showing the ability to inhibit effector toxin secretion or translocation mediated by bacterial type III secretion systems are disclosed. The disclosed type III secretion system inhibitor compounds are useful for combating infections by Gram-negative bacteria such as Salmonella spp., Shigella flexneri, Pseudomonas spp., Yersinia spp., enteropathogenic and enteroinvasive Escherichia coli, and Chlamydia spp. having such type III secretion systems.
Abstract:
The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.
Abstract:
The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.
Abstract:
A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive layers and holes through the substrate. The first and second conductive layers are adhered to opposite sides of the flexible substrate and have a plurality of raised contact elements in registration with at least a subset of the holes. At least some contact elements on the first and second conductive layers that oppose each other are in electrical communication with one another by way of the plating.
Abstract:
An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.