公开(公告)号：WO2004049436A1

公开(公告)日：2004-06-10

申请号：PCT/US2003/035964

申请日：2003-11-12

Applicant: MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE

Inventor： DOWNEY, Susan H. ,  HARPER, Peter R. ,  HESS, Kevin ,  LEONI, Michael, V. ,  TRAN, Tu-Anh

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L22/32 ,  H01L24/03 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0392 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49431 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A bond pad (200) has a first wire bond region (202) and a second wire bond region (204). In one embodiment, the first wire bond region (202) extends over a passivation layer (18). In an alternate embodiment, a bond pad has a probe region , a first wire bond region , and a second wire bond region . In one embodiment, the probe region and the wire bond region extend over a passivation layer (18). The bond pads may have any number of wire bond and probe regions and in any configuration. The ability for the bond pads to have multiple wire bond regions allows for multiple wire connections to a single bond pad, such as in multi-chip packages. The ability for the bond pads to extend over the passivation layer also allows for reduced integrated circuit die area.

Abstract translation: 接合焊盘（200）具有第一引线接合区域（202）和第二引线接合区域（204）。 在一个实施例中，第一引线接合区域（202）在钝化层（18）上延伸。 在替代实施例中，接合焊盘具有探针区域，第一引线接合区域和第二引线接合区域。 在一个实施例中，探针区域和引线接合区域在钝化层（18）上延伸。 接合焊盘可以具有任何数量的引线键合和探针区域并且具有任何构造。 接合焊盘具有多个引线接合区域的能力允许多个电线连接到单个接合焊盘，例如在多芯片封装中。 接合焊盘在钝化层上延伸的能力也允许减小集成电路管芯面积。