Abstract:
A memory device includes a bottom electrode above a substrate, a first switching layer on the bottom electrode, a second switching layer including aluminum on the first switching layer, an oxygen exchange layer on the second switching layer and a top electrode on the oxygen exchange layer. The presence of the second switching layer including aluminum on the first switching layer enables a reduction in electro-forming voltage of the memory device.
Abstract:
A method is provided that includes forming a vertical bit line disposed in a first direction above a substrate, forming a multi-layer word line disposed in a second direction above the substrate, the second direction perpendicular to the first direction, and forming a memory cell including a nonvolatile memory material at an intersection of the vertical bit line and the multi-layer word line. The multi-layer word line includes a first conductive material layer and a second conductive material layer disposed above the first conductive material layer. The memory cell includes a working cell area encompassed by an intersection of the first conductive material layer and the nonvolatile memory material.
Abstract:
A nonvolatile memory cell includes a volatile selector electrically coupled in series with a nonvolatile resistance memory device. The nonvolatile resistance memory device may be a switching material sandwiched between a first bottom electrode and a first top electrode. The volatile selector may be a selector oxide matrix sandwiched between a second bottom electrode and a second top electrode. The selector oxide matrix includes silicon dioxide, while one or both of the second bottom electrode and the second top electrode includes copper. A memory array utilizing the memory cell and a method for manufacturing the memory array are also provided.
Abstract:
A variable resistance memory device (100, 200, 300, 400) includes a first electrode (110, 210, 310) and a second electrode (160, 260, 360). The device may includes a chalcogenide glass (140, 240, 340) layer between the first electrode and the second electrode. The chalcogenide glass layer may include a chalcogenide glass material co-deposited with a metal material. The device also includes a metal ion source structure (150, 250, 350) between the chalcogenide glass layer and the second electrode. The device may include a buffer layer (120, 220) between the first electrode and the chalcogenide glass layer.
Abstract:
Some embodiments include a switching component which includes a selector region between a pair of electrodes. The selector region contains silicon doped with one or more of nitrogen, oxygen, germanium and carbon. Some embodiments include a memory unit which includes a memory cell and a select device electrically coupled to the memory cell. The select device has a selector region between a pair of electrodes. The selector region contains semiconductor doped with one or more of nitrogen, oxygen, germanium and carbon. The select device has current versus voltage characteristics which include snap-back voltage behavior.
Abstract:
A resistive RAM device, comprising a first electrode, a second electrode, an electrolyte layer located between the first electrode and the second electrode. The first electrode has a central region surrounded by a peripheral region in a plane parallel to the electrolyte layer, and the first electrode comprises a protrusion extending into the electrolyte layer by a greater extent in the central region than in the peripheral region so that the electrolyte layer is thinner in the central region than in the peripheral region.
Abstract:
A resistive switching device comprises a bottom electrode (115), a switching layer (130) disposed over the bottom electrode (115), and a electrode (150) disposed over the switching layer (130). The top electrode (150) comprises an alloy of a memory metal and an alloying element. The top electrode (150) provides a source of the memory metal. The memory metal is configured to change a state of the switching layer (130).
Abstract:
Die Erfindung betrifft ein Dreitorbauelement, welches durch die Bewegung von Ionen schaltbar ist. Dieses umfasst eine Source-Elektrode (3), eine Drain-Elektrode (3) und einen zwischen die Source-Elektrode und die Drain-Elektrode geschalteten Kanal (2) aus einem Material, dessen elektronische Leitfähigkeit durch Zu- und/oder Abführung von Ionen veränderlich ist. Erfindungsgemäß umfasst das Dreitorbauelement ein mit einer Gate-Elektrode (6) kontaktiertes lonenreservoir (5), welches derart in Verbindung mit dem Kanal steht, dass es bei Beaufschlagung der Gate-Elektrode mit einem Potential Ionen mit dem Kanal auszutauschen vermag. Es wurde erkannt, dass in der Verteilung der insgesamt in lonenreservoir und Kanal vorhandenen Ionen auf lonenreservoir und Kanal Information in dem Dreitorbauelement gespeichert werden kann. Die Verteilung der Ionen auf den Kanal und auf das lonenreservoir ändert sich dann und nur dann, wenn ein entsprechendes treibendes Potential an der Gate-Elektrode angelegt wird. Im Gegensatz zu RRAMs existiert daher kein "time-voltage dilemma".