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公开(公告)号:CN103403864B
公开(公告)日:2016-07-06
申请号:CN201280010020.6
申请日:2012-02-23
Applicant: 德克萨斯仪器股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L21/56 , H01L21/4821 , H01L21/568 , H01L23/3107 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83001 , H01L2224/83101 , H01L2224/83855 , H01L2224/85001 , H01L2224/85439 , H01L2224/92247 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/12044 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: 一种塑料封装体(100),在其中半导体芯片(101)通过粘合剂(102)附连到具有凝聚结构的金属条带(110a),并且电气连接到具有粒子结构的可键合且可焊接的金属条带(120);金属条带(120)接触凝聚结构的金属条带(110b),以形成垂直堆叠。焊料涂层(140)被焊接到凝聚金属条带(110a和110b)。
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公开(公告)号:CN103403864A
公开(公告)日:2013-11-20
申请号:CN201280010020.6
申请日:2012-02-23
Applicant: 德克萨斯仪器股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L21/56 , H01L21/4821 , H01L21/568 , H01L23/3107 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/48839 , H01L2224/73265 , H01L2224/83001 , H01L2224/83101 , H01L2224/83855 , H01L2224/85001 , H01L2224/85439 , H01L2224/92247 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/12044 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: 一种塑料封装体(100),在其中半导体芯片(101)通过粘合剂(102)附连到具有凝聚结构的金属条带(110a),并且电气连接到具有粒子结构的可键合且可焊接的金属条带(120);金属条带(120)接触凝聚结构的金属条带(110b),以形成垂直堆叠。焊料涂层(140)被焊接到凝聚金属条带(110a和110b)。
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