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公开(公告)号:CN104603923B
公开(公告)日:2017-08-11
申请号:CN201280073634.9
申请日:2012-05-07
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
IPC: H01L21/67
CPC classification number: H01L24/75 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3121 , H01L23/544 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2224/753 , H01L2224/75301 , H01L2224/75702 , H01L2224/75753 , H01L2224/7598 , H01L2224/83132 , H01L2224/83193 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2224/83 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: 公开了一种用于将半导体裸芯(220)层叠在基板面板(200)的基板上的层叠装置(230)和方法。层叠装置(230)包括层叠单元(234、236、238、240),它们彼此独立操作,从而成行或成列的半导体裸芯(220)可同时独立地层叠到成行或成列的基板上。
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公开(公告)号:CN104603923A
公开(公告)日:2015-05-06
申请号:CN201280073634.9
申请日:2012-05-07
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
IPC: H01L21/67
CPC classification number: H01L24/75 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/3121 , H01L23/544 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2224/753 , H01L2224/75301 , H01L2224/75702 , H01L2224/75753 , H01L2224/7598 , H01L2224/83132 , H01L2224/83193 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2224/83 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: 公开了一种用于将半导体裸芯(220)层叠在基板面板(200)的基板上的层叠装置(230)和方法。层叠装置(230)包括层叠单元(234、236、238、240),它们彼此独立操作,从而成行或成列的半导体裸芯(220)可同时独立地层叠到成行或成列的基板上。
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