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公开(公告)号:CN104619799A
公开(公告)日:2015-05-13
申请号:CN201380048543.4
申请日:2013-09-17
申请人: 迪睿合电子材料有限公司
CPC分类号: H01L24/28 , B29C59/02 , B29C71/04 , B29C2035/0827 , B29C2059/028 , B29K2063/00 , B29L2009/003 , B29L2031/34 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/36 , B32B27/38 , B32B33/00 , B32B2255/205 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/202 , B32B2307/412 , B32B2307/706 , B32B2457/00 , B32B2457/202 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , G02F1/13452 , G02F1/13454 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27334 , H01L2224/29076 , H01L2224/2908 , H01L2224/29083 , H01L2224/2919 , H01L2224/29195 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/29394 , H01L2224/29395 , H01L2224/294 , H01L2224/29486 , H01L2224/29494 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/75301 , H01L2224/81488 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83488 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2224/83907 , H01L2924/01006 , H01L2924/01049 , H01L2924/0105 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H01L2924/07802 , H01L2924/07811 , H01L2924/351 , H01L2924/3511 , H01L2924/381 , Y10T156/1039 , Y10T428/24562 , H01L2924/00012 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2924/07025 , H01L2924/066 , H01L2924/06 , H01L2924/00014 , H01L2924/0615
摘要: 本发明目的在于在利用各向异性导电膜的连接中,谋求降低连接后的基板翘曲。各向异性导电膜(23)包括:第1绝缘性粘接剂层(30);第2绝缘性粘接剂层(31);以及被第1绝缘性粘接剂层(30)及第2绝缘性粘接剂层(31)挟持并在绝缘性粘接剂(33)含有导电性粒子(32)的含导电性粒子层(34),在含导电性粒子层(34)与第1绝缘性粘接剂层(30)之间含有气泡(41),含导电性粒子层(34)中,与第2绝缘性粘接剂层(31)相接的导电性粒子(32)的下部的硬化度低于其他部位的硬化度。
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公开(公告)号:CN104619799B
公开(公告)日:2016-10-12
申请号:CN201380048543.4
申请日:2013-09-17
申请人: 迪睿合电子材料有限公司
CPC分类号: H01L24/28 , B29C59/02 , B29C71/04 , B29C2035/0827 , B29C2059/028 , B29K2063/00 , B29L2009/003 , B29L2031/34 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/36 , B32B27/38 , B32B33/00 , B32B2255/205 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/202 , B32B2307/412 , B32B2307/706 , B32B2457/00 , B32B2457/202 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , G02F1/13452 , G02F1/13454 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27334 , H01L2224/29076 , H01L2224/2908 , H01L2224/29083 , H01L2224/2919 , H01L2224/29195 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/29394 , H01L2224/29395 , H01L2224/294 , H01L2224/29486 , H01L2224/29494 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/75301 , H01L2224/81488 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83488 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2224/83907 , H01L2924/01006 , H01L2924/01049 , H01L2924/0105 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H01L2924/07802 , H01L2924/07811 , H01L2924/351 , H01L2924/3511 , H01L2924/381 , Y10T156/1039 , Y10T428/24562 , H01L2924/00012 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2924/07025 , H01L2924/066 , H01L2924/06 , H01L2924/00014 , H01L2924/0615
摘要: 本发明目的在于在利用各向异性导电膜的连接中,谋求降低连接后的基板翘曲。各向异性导电膜(23)包括:第1绝缘性粘接剂层(30);第2绝缘性粘接剂层(31);以及被第1绝缘性粘接剂层(30)及第2绝缘性粘接剂层(31)挟持并在绝缘性粘接剂(33)含有导电性粒子(32)的含导电性粒子层(34),在含导电性粒子层(34)与第1绝缘性粘接剂层(30)之间含有气泡(41),含导电性粒子层(34)中,与第2绝缘性粘接剂层(31)相接的导电性粒子(32)的下部的硬化度低于其他部位的硬化度。
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公开(公告)号:CN106981431A
公开(公告)日:2017-07-25
申请号:CN201611204414.1
申请日:2016-12-23
申请人: 株式会社吉帝伟士
IPC分类号: H01L21/60 , H01L21/56 , H01L23/488 , H01L23/31
CPC分类号: H01L23/49827 , H01L21/4853 , H01L21/486 , H01L23/49816 , H01L23/49838 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/30 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/24195 , H01L2224/29195 , H01L2224/32225 , H01L2224/83005 , H01L2224/83192 , H01L2224/92144 , H01L2224/96 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H01L21/568 , H01L23/3128 , H01L24/24 , H01L24/29 , H01L24/82 , H01L2224/0401 , H01L2224/24226 , H01L2224/73267
摘要: 本发明提供一种半导体封装件的制造方法,其与现有的制造方法相比,能够减少用于形成通孔的材料而形成通孔。所述半导体封装件的制造方法包括:在支承板之上形成绝缘材料层;在所述绝缘材料层中形成通孔;在所述绝缘材料层之上配置半导体元件,使得所述半导体元件的电极位于所述通孔之上;去除所述支承板;在所述绝缘材料层的与所述半导体元件的一侧相反的面、所述通孔及所述半导体元件的所述电极的面上形成种子层;以及在所述通孔中形成金属层。
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公开(公告)号:CN106939146A
公开(公告)日:2017-07-11
申请号:CN201610840005.4
申请日:2013-09-17
申请人: 迪睿合电子材料有限公司
IPC分类号: C09J7/00 , C09J9/02 , B29C71/04 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/30 , B32B27/36 , B32B27/38 , G02F1/1345 , H01L23/00
CPC分类号: H01L24/28 , B29C59/02 , B29C71/04 , B29C2035/0827 , B29C2059/028 , B29K2063/00 , B29L2009/003 , B29L2031/34 , B32B3/08 , B32B3/30 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/36 , B32B27/38 , B32B33/00 , B32B2255/205 , B32B2264/102 , B32B2264/104 , B32B2270/00 , B32B2307/202 , B32B2307/412 , B32B2307/706 , B32B2457/00 , B32B2457/202 , C08K3/08 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2203/326 , C09J2205/102 , G02F1/13452 , G02F1/13454 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/2711 , H01L2224/2712 , H01L2224/27334 , H01L2224/29076 , H01L2224/2908 , H01L2224/29083 , H01L2224/2919 , H01L2224/29195 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29391 , H01L2224/29393 , H01L2224/29394 , H01L2224/29395 , H01L2224/294 , H01L2224/29486 , H01L2224/29494 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/75301 , H01L2224/81488 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83488 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2224/83907 , H01L2924/01006 , H01L2924/01049 , H01L2924/0105 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H01L2924/07802 , H01L2924/07811 , H01L2924/351 , H01L2924/3511 , H01L2924/381 , Y10T156/1039 , Y10T428/24562 , H01L2924/00012 , H01L2924/0665 , H01L2924/0635 , H01L2924/069 , H01L2924/07025 , H01L2924/066 , H01L2924/06 , H01L2924/00014 , H01L2924/0615 , C09J2203/318
摘要: 本发明目的在于在利用各向异性导电膜的连接中,谋求降低连接后的基板翘曲。各向异性导电膜(23)包括:第1绝缘性粘接剂层(30);第2绝缘性粘接剂层(31);以及被第1绝缘性粘接剂层(30)及第2绝缘性粘接剂层(31)挟持并在绝缘性粘接剂(33)含有导电性粒子(32)的含导电性粒子层(34),在含导电性粒子层(34)与第1绝缘性粘接剂层(30)之间含有气泡(41),含导电性粒子层(34)中,与第2绝缘性粘接剂层(31)相接的导电性粒子(32)的下部的硬化度低于其他部位的硬化度。
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