公开(公告)号：EP1255797B1

公开(公告)日：2012-06-13

申请号：EP00992510.8

申请日：2000-11-16

Applicant: OMG Electronic Chemicals, Inc

Inventor： BERNARDS, Roger ,  GONZALEZ, Hector ,  KUCERA, Al ,  SCHANHAAR, Mike

IPC: C23F1/18 ,  H05K3/38 ,  C23C22/68

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. The adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier (Fig.1), and a uniformity enhancer (Fig.2). A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate.

公开(公告)号：EP2460765A1

公开(公告)日：2012-06-06

申请号：EP10804247.4

申请日：2010-07-09

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： MATSUMOTO, Takahiro ,  TSURUYA, Hirotaka ,  BAN, Hajime ,  AKITA, Reiki

IPC: C01B31/02 ,  C01B31/04 ,  C08K9/04 ,  C08L101/00 ,  H01B3/00 ,  H01B17/00 ,  H05K1/03

CPC classification number: C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

Abstract translation: 本发明提供在通过将液态金属醇盐，其中将含有碳材料的导电性超微粉末分散含甲醇的有机溶剂和另外往其中加入水和用于生产其的方法获得的绝缘超微粉末。 这样，提供了在通过将液态金属醇盐，其中将含有碳材料的导电性超微粉末分散含甲醇的有机溶剂中，进一步添加具有在醇盐团的偶联剂获得的绝缘超细粉末，然后往其中加入水和 制造方法是相同的。 此外，提供的是一种高介电常数树脂复合由本发明的绝缘超微粉末与体积比（绝缘超微粉末/树脂）的树脂共混得到的范围内的5/95下降至50/50的材料。

公开(公告)号：EP2180019A1

公开(公告)日：2010-04-28

申请号：EP09177928.0

申请日：2005-08-05

Applicant: Nippon Shokubai Co., Ltd.

Inventor： Sugioka, Takuo ,  Tsujino, Yasunori

IPC: C08L83/02

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.

Abstract translation: 本发明的目的是提供一种能够形成具有各种优异性能如绝缘性，耐热冲击性，成型性/成形性和强度的固化剂的树脂组合物，并且显示出优异的透明性的外观， 其固化的薄膜具有优异的阻燃性，良好的机械性能和耐热性的树脂组合物，含有能够赋予无机微粒子的树脂阻燃性的无机微粒子的分散元件，并且可以减少吸湿性 特性，其制备方法和使用该树脂组合物得到的固化剂。 本发明涉及包含具有缩水甘油基和/或环氧基中的至少一种的化合物和无机微粒的树脂组合物，包含酚类化合物的三种组分的树脂组合物，具有至少一种 缩水甘油基和/或环氧基和无机微粒，包含多元酚和无机微粒的阻燃树脂组合物和含有通过醇盐和/或金属的水解缩合反应得到的无机微粒的分散体 羧酸酯在分散介质中。

公开(公告)号：EP1667503B1

公开(公告)日：2010-03-10

申请号：EP05703506.5

申请日：2005-01-13

Applicant: Panasonic Corporation

Inventor： NAKAGAWA, Tohru

IPC: H05K3/06 ,  H01L21/3213 ,  H01L21/033

CPC classification number: C25D5/022 ,  C23F1/02 ,  C23F1/14 ,  C23F1/18 ,  C23F1/30 ,  C23F1/40 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/32139 ,  H01L51/0019 ,  H01L51/0022 ,  H05K3/061 ,  H05K2201/015 ,  H05K2201/0239 ,  H05K2203/013 ,  H05K2203/0582 ,  H05K2203/0585 ,  H05K2203/122

公开(公告)号：EP2014797A3

公开(公告)日：2009-08-05

申请号：EP08252007.3

申请日：2008-06-11

Applicant: Samsung SDI Co., Ltd.

Inventor： Kim, Chul-Hong

IPC: C23F11/02 ,  C07F7/08 ,  C08K3/22 ,  C08K5/3472 ,  C09D5/08 ,  C09D183/00 ,  C09D183/06 ,  H05K3/36 ,  H01J17/49 ,  H01J17/34

CPC classification number: H01J11/48 ,  C08K3/22 ,  C08K5/3472 ,  C08K5/54 ,  C09D1/00 ,  C09D7/60 ,  C09D183/04 ,  H01J11/12 ,  H01J11/46 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0769 ,  H05K2203/124

Abstract: Provided are a coating composition for an interconnection part of an electrode and a plasma display panel including the same. Specifically, the coating composition for an interconnection part of an electrode, comprising 0.05 to 2.0 parts by weight of a compound containing a triazole group, 3.5 to 7.5 parts by weight of a silane based compound, and 0.5 to 2.0 parts by weight of a transition metal oxide, is used to effectively prevent opens and short circuits of an electrode due to damage of an interconnection unit caused by gases and humidity in the surrounding environment and due to a migration phenomenon.

公开(公告)号：EP1517595A3

公开(公告)日：2008-04-02

申请号：EP04021368.8

申请日：2004-09-08

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Amou, Satoru, Hitachi, Ldt. ,  Umino, Morimichi, Hitachi, Ldt. ,  Nagai, Akira, Hitachi, Ldt. ,  Nakamura, Yoshihiro ,  Minami, Nobuyuki

IPC: H05K1/03 ,  H05K3/46 ,  C08F12/08

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a, plurality of styrene groups and represented by the following formula:

wherein R is a hydrocarbon skeleton, each of R 1 s is a hydrogen atom or a hydrocarbon group, each of R 2 , R 3 and R 4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

公开(公告)号：EP1835512A4

公开(公告)日：2008-02-20

申请号：EP05790645

申请日：2005-10-07

Applicant: MITSUI MINING & SMELTING CO

Inventor： KAMIKORIYAMA YOICHI ,  OGATA SUMIKAZU ,  ANAI KEI ,  SAWAMOTO HIROKI

IPC: H01B1/22 ,  C09D11/00 ,  H01B1/00 ,  H05K1/09

CPC classification number: H01B1/22 ,  C09D11/30 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0239 ,  H05K2203/013

Abstract: Disclosed is a conductive metal ink which has excellent adhesion to various bases such as glass substrates and enables formation of fine wiring or electrodes. Also disclosed is a conductive ink which can be used in inkjet systems. Specifically disclosed is a conductive ink containing a solvent, a metal powder and an adhesion improver which is characterized in that the adhesion improver is composed of one or more substances selected from the group consisting of silane coupling agents, titanium coupling agents, zirconia coupling agents and aluminum coupling agents. By adjusting the surface tension of the solvent to be within the range from 15 mN/m to 50 mN/m using a surface tension regulator, the conductive ink is formed into an ink which can be suitably used in inkjet systems or the like.

公开(公告)号：EP1858950A1

公开(公告)日：2007-11-28

申请号：EP06714350.3

申请日：2006-02-16

Applicant: SHOWA DENKO KABUSHIKI KAISHA

Inventor： MIYAJIMA, Yoshio ,  WADA, Tetsuo ,  NAKAMURA, Ayako

IPC: C08G59/42 ,  C08G59/20 ,  H01L23/00 ,  C08L63/00

CPC classification number: C08G59/4207 ,  C08G59/20 ,  C08L63/00 ,  H05K3/285 ,  H05K2201/0239 ,  H05K2203/124

Abstract: There is provided a novel thermosetting composition for a solder resist with excellent flexibility, low warping upon curing, soldering heat resistance, PCT resistance and HHBT resistance, which is suitable as a thermosetting solder resist ink for printed circuit boards and particularly FPC boards. The thermosetting composition for a solder resist according to the invention comprises as essential components: (A) an epoxy resin having two or more epoxy groups in the molecule, (B) a polyacid anhydride represented by general formula (I) as defined in claims, wherein R represents a divalent organic group and n represents an integer of 2-30, and (C) a coupling agent.

公开(公告)号：EP1835512A1

公开(公告)日：2007-09-19

申请号：EP05790645.5

申请日：2005-10-07

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： KAMIKORIYAMA, Yoichi c/o MITSUI MINING & SMELTING ,  OGATA, Sumikazu c/o MITSUI MINING & SMELTING CO., ,  ANAI, Kei c/o MITSUI MINING & SMELTING CO., LTD. ,  SAWAMOTO, Hiroki c/o MITSUI MINING & SMELTING CO.,

IPC: H01B1/22 ,  H01B1/00 ,  H05K1/09 ,  C09D11/00

CPC classification number: H01B1/22 ,  C09D11/30 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0239 ,  H05K2203/013

Abstract: An object of the invention is to provide a conductive metal ink having an excellent adhesion to various kinds of substrates such as a glass substrate, and making it possible to form fine wiring or electrodes. Another object is to provide a conductive ink which can be used for ink jet printing system etc. For the purpose of achieving the objects, "a conductive ink comprising a solvent, a metal powder, and an adhesion improver, which is characterized in that the adhesion improver is one or mixture selected from the group consisting of a silane coupling agent, a titanium coupling agent, a zirconium coupling agent, and an aluminum coupling agent." is adopted. Furthermore, a surface tension of the solvent is adjusted to be in the range of 15 mN/m to 50 mN/m with a surface tension adjustor to provide conductive ink suitable for ink jet printing system etc.

Abstract translation: 本发明的目的是提供一种对玻璃基板等各种基板具有优异粘接性的导电性金属墨水，能够形成精细的布线或电极。 另一个目的是提供可用于喷墨打印系统等的导电油墨。为了实现目的，“包含溶剂，金属粉末和粘合改进剂的导电油墨的特征在于， 粘合改进剂是选自由硅烷偶联剂，钛偶联剂，锆偶联剂和铝偶联剂组成的组中的一种或其混合物。 被采纳。 此外，使用表面张力调节器将溶剂的表面张力调节在15mN / m至50mN / m的范围内，以提供适合于喷墨打印系统等的导电油墨。

公开(公告)号：EP1658327A1

公开(公告)日：2006-05-24

申请号：EP04763812.7

申请日：2004-08-05

Applicant: LANXESS Deutschland GmbH

Inventor： VAN MULLEKOM, Robert, Hubertus ,  JOACHIMI, Detlev ,  KARBACH, Alexander ,  PERSIGEHL, Peter ,  DE BOCK, Maarten

IPC: C08K9/08 ,  C03C25/36

CPC classification number: C08K7/14 ,  C03C25/36 ,  C08K9/08 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/09118

Abstract: The invention relates to moulding materials consisting of thermoplastic polymers, sized glass fibres and additional conventional additives and auxiliary agents, in addition to the use of said materials.