公开(公告)号：EP2433474B1

公开(公告)日：2014-02-12

申请号：EP10724280.2

申请日：2010-05-19

Applicant: Eutegra AG

Inventor： GRAUVOGEL, Ulrich

IPC: H05K1/02 ,  F21V29/00

CPC classification number: F21V19/001 ,  F21V14/06 ,  F21V14/08 ,  F21V17/02 ,  F21V19/042 ,  F21V29/74 ,  F21Y2115/10 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00

公开(公告)号：EP2658354A1

公开(公告)日：2013-10-30

申请号：EP12861057.3

申请日：2012-10-26

Applicant: Huawei Technologies Co., Ltd

Inventor： YAO, Kai ,  ZHU, Yongfa ,  HUANG, Yingpei

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

Abstract: Embodiments of the present invention provide a golden finger and a board edge interconnecting device, where the golden finger includes a printed circuit board PCB surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

公开(公告)号：EP1864561B1

公开(公告)日：2013-05-08

申请号：EP06722701.7

申请日：2006-03-28

Applicant: Conti Temic microelectronic GmbH

Inventor： BINDER, Markus ,  SCHLENKER, Roberto ,  HOFFMANN, Richard ,  DORFINGER, Georg

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/142 ,  H05K7/205 ,  H05K2201/0382 ,  H05K2201/10416 ,  H05K2201/10689

公开(公告)号：EP2330639A1

公开(公告)日：2011-06-08

申请号：EP08877018.5

申请日：2008-09-28

Applicant: Chang, Yihui

Inventor： CHANG, Yi-Hui, ,  HAO, Ching-Chien,

IPC: H01L33/00

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V19/003 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: The present invention relates to an alternating current driven light emitting diode module. The alternating current driven light emitting diode module includes an alternating current driven light emitting diode chip, a first thermal conduction plate, and a ceramic substrate. The first thermal conduction plate is arranged on the ceramic substrate. The alternating current driven light emitting diode chip is arranged on the first thermal conduction plate. The alternating current driven light emitting diode module has better heat dissipating property and better insulation property.

公开(公告)号：EP2224794A4

公开(公告)日：2011-03-23

申请号：EP08870655

申请日：2008-12-10

Applicant: HUAWEI TECH CO LTD

Inventor： YANG RUIQUAN ,  SHENG HAIQIANG ,  LI HONGCAI

IPC: H05K1/11

CPC classification number: H05K1/0243 ,  H05K1/021 ,  H05K1/024 ,  H05K1/025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/11 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/4688 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2203/063

公开(公告)号：EP2283715A1

公开(公告)日：2011-02-16

申请号：EP09753870.6

申请日：2009-05-26

Applicant: Continental Teves AG & Co. oHG

Inventor： HEISE, Andreas

IPC: H05K1/02

CPC classification number: H05K1/0263 ,  H05K1/0204 ,  H05K2201/10416 ,  Y10T29/4913

Abstract: Circuit board arrangement, in particular multiple layer circuit board arrangement (16) with at least one low-power circuit path, wherein the circuit board arrangement is suitable for population with at least one electronic circuit board element to be cooled, wherein the circuit board consisting of a nonconductive material comprises at least one cooling inlay (22, 21, 22’) embedded in the circuit board for cooling of the power component, wherein the cooling inlay forms at least in part, a high power guide element for the at least one electronic power component, wherein the line cross section or the power carry capacity of the high power guide element is significantly greater than the line cross section or the current carry capacity of the low power circuit path, and wherein the high power guide element is used and/or is also used for electrical contacting of the power component.

Abstract translation: 电路板布置，特别是具有至少一个低功率电路路径的多层电路板布置，其中电路板布置适合具有至少一个要冷却的电子电路板元件的群体，其中由不导电的电路板组成的电路板 材料包括嵌入在电路板中用于冷却功率部件的至少一个冷却嵌入件，其中冷却嵌体至少部分地形成用于至少一个电子功率部件的高功率引导元件，其中，线截面或 高功率引导元件的功率承载能力明显大于低功率电路路径的线路横截面积或当前承载能力，并且其中使用高功率引导元件和/或还用于功率的电接触 零件。

公开(公告)号：EP2225807A1

公开(公告)日：2010-09-08

申请号：EP08864519.7

申请日：2008-12-11

Applicant: Continental Automotive GmbH

Inventor： LOIBL, Josef ,  ROBIN, Hermann-Josef ,  SMIRRA, Karl

IPC: H01R43/02 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01L2924/0002 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/10416 ,  H05K2203/107 ,  H01L2924/00

Abstract: The invention relates to a method for producing an electrical connection between a rigid circuit board (1) and a metal contact partner (2), having the following steps: -preparing the rigid circuit board (1) comprising at least one copper layer (3) and at least one prepreg layer (5) - bringing the metal contact partner (2) and the circuit board (1) together, such that the metal contact partner (2) is brought into contact with a contact pad (7) on the copper layer (3) of the circuit board (1); - forming a recess in the circuit board (1) by removing the prepreg layer (5) in at least one partial region of the contact pad (7), and - irradiating with laser light (9), wherein a weld connection is formed between the contact partner (2) and the contact pad (7). The invention further relates to an arrangement of a rigid circuit board (1), a metal contact partner (2) and an electrical connection point, and a module comprising such an arrangement.

公开(公告)号：EP1913436A4

公开(公告)日：2010-01-13

申请号：EP06835509

申请日：2006-12-28

Applicant: LG INNOTEK CO LTD

Inventor： PARK JUN SEOK ,  CHOI YONG SEOK

IPC: G02F1/13357 ,  H01L33/64

CPC classification number: H05K1/0206 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16 ,  H05K1/0204 ,  H05K3/4069 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10727

公开(公告)号：EP1976350A3

公开(公告)日：2009-09-09

申请号：EP07076025.1

申请日：2007-11-27

Applicant: THE BOEING COMPANY

Inventor： O'Connell, John B. ,  Heisen, Peter T. ,  Fahley, Stephen L. ,  Bostwick, Richard N. ,  Navarro, Julio A.

IPC: H05K1/18

CPC classification number: H01Q1/38 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/429 ,  H05K7/205 ,  H05K2201/09981 ,  H05K2201/10416 ,  Y10T156/10 ,  H01L2924/00014

Abstract: Method and structure for a microwave antenna module is provided. The method includes, creating a laminate structure by laminating a plurality of conductive layers and dielectric layers; creating a plurality of layers within the laminate structure to interconnect the plurality of conductive layers and dielectric layers; laminating a base plate to a bottom of the laminate structure; wherein the baseplate operates as a heat sink; and laminating a seal ring to a top periphery of the laminate structure.

公开(公告)号：EP2023706A2

公开(公告)日：2009-02-11

申请号：EP08104842.3

申请日：2008-07-23

Applicant: Continental Automotive GmbH

Inventor： Decker, Michael

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/0373 ,  H05K2201/10416 ,  H01L2924/00

Abstract: Die Erfindung betrifft einen Schaltungsträgeraufbau (1) mit mindestens einen elektronischen Bauelement (3) in SMD-Bauweise, wobei unterhalb des mindestens einen elektronischen Bauelements (3) eine durchgehende Ausnehmung (5) im Schaltungsträger (2) angeordnet ist, ein Stempel (6) aus wärmeleitendem Material mit einem Ende eines Fügebereichs (6a) in die Ausnehmung (5) eingeführt und mit einer Wärmeleitkleberschicht (7) befestigt wird und mit dem Bauelement (3) wärmeleitend verbunden wird und weiterhin der Stempel (6) an seiner anderen Seite einen Anbindungsbereich (6b) aufweist, dessen Querschnittsfläche mindestens teilweise größer dimensioniert ist als die Ausnehmung (5) im Schaltungsträger (2) und dessen Ende mit einem Kühlkörper (8) wärmeleitend verbunden wird.

Abstract translation: 组件（1）具有布置在电路载体（2）中的电子部件下方的连续凹部，例如， 印刷电路板。 将热导电材料的模具插入到凹部中的接合区域（6a）的端部，并附着有导热粘合剂层（7），并与该部件热连接。 模具的一侧具有接合区域（6b），其中区域（6b）的横截面面积部分地大于电路载体中的凹部。 区域（6b）的端部与冷却元件（8）热连接。 模具设置有电绝缘涂层，例如 阳极氧化涂层，漆涂层，搪瓷涂层或电绝缘箔涂层，并由陶瓷材料组成。 还包括用于制造电路载体组件的方法的独立权利要求。