公开(公告)号：EP2645408A1

公开(公告)日：2013-10-02

申请号：EP11842826.7

申请日：2011-05-13

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： KURITA Satoru ,  ENDOH Keiichi ,  SAITO Yu ,  HISAEDA Yutaka ,  UEYAMA Toshihiko

IPC: H01L21/60 ,  B22F1/00 ,  B23K20/00 ,  H05K3/32

CPC classification number: B23K31/02 ,  B22F1/0014 ,  B22F1/0062 ,  B22F1/0096 ,  B22F2999/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K2101/36 ,  B32B3/26 ,  B32B15/018 ,  G10L2019/0002 ,  G10L2019/0011 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/203 ,  Y10T428/12479 ,  H01L2224/832 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  B22F1/0018 ,  H01L2924/0002

Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.

Abstract translation: 提供了能够在诸如氮气氛的惰性气体气氛下形成接合体的接合材料，并且即使不在高温下施加热处理也能够表现出耐用性的接合强度， 是含有碳数为8以下，平均一次粒径为1nm以上且200nm以下的脂肪酸的银纳米粒子的平均粒径为0.5μm以上的银粒子， 10μm以下，以及具有2个以上羧基的有机材料。

公开(公告)号：EP2158057A2

公开(公告)日：2010-03-03

申请号：EP08801455.0

申请日：2008-06-09

Applicant: SEW-EURODRIVE GmbH & Co. KG

Inventor： LAUER, Christian

IPC: B23K9/02 ,  B23K26/24

CPC classification number: B23K31/022 ,  B23K2101/36 ,  B23P19/10 ,  F16M1/08 ,  F16M5/00 ,  F16M7/00

Abstract: In a transmission-engine unit, a transmission (2) is mounted on a first spacer (18, 19, 24, 25, 51, 52, 74) while an engine is mounted on a second spacer (6, 7, 8, 22, 51, 52, 74). Both spacers are welded to a profiled tube (32), an engine rocker, or a base frame. A compensating element (42, 54) is inserted into at least one spacer (18, 19, 52, 74) before said spacer is welded to the profiled tube (32) in order to align the transmission (2) with the engine (1). The welded seam (57) connects the spacer (52, 74) to the profiled tube (32) and bridges the compensating element (42, 54).

Abstract translation: 在变速器发动机单元中，当发动机安装在第二间隔件（6,7,8,22）上时，变速器（2）安装在第一间隔件（18,19,24,25,51,52,74）上 ，51,52,74）。 两个间隔件焊接到成型管（32），发动机摇臂或基架上。 在将所述间隔件焊接到成型管（32）之前，将补偿元件（42,54）插入至少一个间隔件（18,19,52,74）中，以使变速器（2）与发动机（1）对准 ）。 焊缝（57）将间隔件（52,74）连接到成形管（32）并桥接补偿元件（42,45）。

公开(公告)号：EP3417984A1

公开(公告)日：2018-12-26

申请号：EP18171901.4

申请日：2018-05-11

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： KOBAYASHI, Hiroomi ,  TATEYAMA, Nozomi ,  UCHIDA, Keisuke ,  OHASHI, Fuminori ,  SHIBATA, Yoshinori ,  KOIKE, Masaki

IPC: B23K26/03 ,  B23K26/22 ,  B23K33/00 ,  B23K26/60 ,  H01M2/26 ,  B23K101/36 ,  B23K103/10 ,  B23K103/16

CPC classification number: B23K33/002 ,  B23K9/1274 ,  B23K11/185 ,  B23K26/032 ,  B23K26/037 ,  B23K26/22 ,  B23K26/60 ,  B23K35/0238 ,  B23K2101/36 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/166 ,  H01M2/26 ,  H01M2/266

Abstract: Provided is a method of welding laminated metal foils that can prevent blowholes and spatter from being formed. It is a method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates. The method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates includes locally pressing and crimping the laminated metal foils sandwiched between the pair of metal plates at a welding point in a laminating direction, and welding the crimped pair of metal plates and laminated metal foils at the welding point.

公开(公告)号：EP3395490A1

公开(公告)日：2018-10-31

申请号：EP18168790.6

申请日：2018-04-23

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： TSUKUI, Akira

IPC: B23K26/06 ,  B23K26/067 ,  B23K26/24 ,  B23K26/064 ,  B23K26/082 ,  H01M2/04 ,  H01M10/058 ,  B23K101/36 ,  B23K103/10

CPC classification number: B23K26/24 ,  B23K26/0608 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/704 ,  B23K2101/36 ,  B23K2101/38 ,  B23K2103/10 ,  H01M2/0426 ,  H01M10/058

Abstract: A laser welding method includes a welding process of irradiating a multiple laser beam (LB) so as to weld together a first member (11) and a second member (12) at a boundary (BD). The multiple laser beam (LB) includes a first beam (L1) that is advanced while forming a first molten pool (11KM) in which the first member (11) is melted, a second beam (L2) that is advanced while forming a second molten pool (12PM) in which the second member (12) is melted, and a main beam (LM) that is advanced subsequently to the first beam (L1) and the second beam (L2) and irradiated to an integrated molten pool (14M) formed by integration of the first molten pool (11KM) and the second molten pool (12PM). The first beam (L1) and the second beam (L2) do not swing, while the main beam (LM) swings with respect to the boundary (BD).

公开(公告)号：EP2158057B1

公开(公告)日：2018-08-22

申请号：EP08801455.0

申请日：2008-06-09

Applicant: SEW-EURODRIVE GmbH & Co. KG

Inventor： LAUER, Christian

IPC: B23K9/02 ,  B23K26/24 ,  B23P19/10 ,  B23K31/02 ,  B23K101/36

CPC classification number: B23K31/022 ,  B23K2101/36 ,  B23P19/10 ,  F16M1/08 ,  F16M5/00 ,  F16M7/00

公开(公告)号：EP3183090B1

公开(公告)日：2018-04-25

申请号：EP15747401.6

申请日：2015-07-23

Applicant: Murrplastik Systemtechnik GmbH

Inventor： BIER, Klaus-Dieter ,  BRÄUSS, Marco ,  UTESCH, Rainer ,  BRIEGE, Stephan

IPC: B23K26/00 ,  B41J3/407 ,  B65G47/06 ,  B65G59/06 ,  B65H1/06 ,  G09F3/00 ,  H01R13/46 ,  B23K26/364 ,  B23K103/00 ,  B23K101/36

CPC classification number: B41M5/24 ,  B23K26/355 ,  B23K26/359 ,  B23K26/364 ,  B23K2101/36 ,  B23K2103/30 ,  B23K2103/42 ,  B41J2/442 ,  B41J3/407 ,  B41J3/50 ,  B41J3/60 ,  B41J13/103 ,  B41M5/26

公开(公告)号：EP2675764B1

公开(公告)日：2018-04-04

申请号：EP12704708.2

申请日：2012-02-17

Applicant: Schott AG

Inventor： GOEDEKE, Dieter ,  BACKNAES, Linda

IPC: C03C29/00 ,  B23K15/00 ,  B23K26/32 ,  C03C8/00 ,  C03C27/02 ,  H01M2/24 ,  H01M2/30 ,  H01M10/0525 ,  B23K1/19 ,  H01M2/08 ,  H01M10/0569 ,  B23K101/36 ,  B23K103/10 ,  C03C3/19 ,  C03C4/20 ,  C03C8/24 ,  H01M2/06

CPC classification number: B23K15/0093 ,  B23K1/19 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/10 ,  C03C3/19 ,  C03C4/20 ,  C03C8/00 ,  C03C8/24 ,  C03C27/02 ,  C03C29/00 ,  C03C2204/00 ,  C03C2207/08 ,  H01M2/06 ,  H01M2/065 ,  H01M2/08 ,  H01M2/24 ,  H01M2/305 ,  H01M10/0525 ,  H01M10/0569 ,  H01M2220/20 ,  H01M2300/0037 ,  Y02E60/122 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49115

公开(公告)号：EP2334728B1

公开(公告)日：2018-03-21

申请号：EP09793030.9

申请日：2009-09-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： HARIHARAN, Rajan ,  HURLEY, James ,  KANAGAVEL, Senthil ,  QUINONES, Jose ,  SOBCZAK, Martin ,  MAKITA, Deborah

IPC: C08K5/09 ,  H01B1/22 ,  H01L23/498 ,  B23K35/36

CPC classification number: C08K5/09 ,  B23K35/3612 ,  B23K2101/36 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/0837 ,  C08K2003/085 ,  H01B1/22 ,  H01L23/04 ,  H01L23/3178 ,  H01L23/4928 ,  H01L23/49883 ,  H01L24/80 ,  H01L2224/03332 ,  H01L2224/03442 ,  H01L2224/80011 ,  H01L2924/0002 ,  H05K7/02 ,  H01L2924/00

Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.

公开(公告)号：EP3280577A1

公开(公告)日：2018-02-14

申请号：EP16719224.4

申请日：2016-04-07

Applicant: Siltectra GmbH

Inventor： SCHILLING, Franz ,  DRESCHER, Wolfram ,  RICHTER, Jan

IPC: B28D1/22 ,  B81C1/00

CPC classification number: B28D5/0011 ,  B23K26/53 ,  B23K2101/36 ,  B28D1/221 ,  B81C1/00357 ,  B81C1/0038 ,  B81C2201/0192 ,  H01L21/76251 ,  H01L31/1804 ,  H01L31/1896

Abstract: The invention relates to a method for producing a multi-layer assembly. The method according to the invention comprises at least the following steps: providing a donor substrate (2) for removing a solid layer (4), in particular a wafer; producing modifications (12), in particular by means of laser beams (10), in the donor substrate (2) in order to specify a crack course; providing a carrier substrate (6) for holding the solid layer (4); bonding the carrier substrate (6) to the donor substrate (2) by means of a bonding layer (8), wherein the carrier substrate (6) is provided for increasing the mechanical strength of the solid layer (4) for the further processing, which solid layer is to be removed; arranging or producing a stress-producing layer (16) on the carrier substrate (6); thermally loading the stress-producing layer (16) in order to produce stresses in the donor substrate (2), wherein a crack is triggered by the stress production, which crack propagates along the specified crack course in order to remove the solid layer (4) from the donor substrate (2) such that the solid layer (4) is removed together with the bonded carrier substrate (6).

公开(公告)号：EP3278919A1

公开(公告)日：2018-02-07

申请号：EP17180635.9

申请日：2017-07-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KUMAZAWA, Seiji ,  ASHIDA, Takayuki ,  MORI, Shinya ,  TAKANO, Hiroaki

IPC: B23K26/323 ,  H01M2/20 ,  B23K26/244 ,  B32B15/01 ,  B23K9/23 ,  B23K11/20 ,  B23K103/18

CPC classification number: H01M2/206 ,  B23K9/232 ,  B23K11/20 ,  B23K26/244 ,  B23K26/282 ,  B23K26/323 ,  B23K35/0255 ,  B23K35/286 ,  B23K35/302 ,  B23K2101/36 ,  B23K2103/18 ,  B32B15/017 ,  C22C9/01 ,  H01M2220/20

Abstract: A welded metal component includes: a first component (1); a second component (2) that is stacked on the first component (1) and that is made of a material different from the first component; and at least one welded part (3) that passes through the second component (2) so as to reach the first component (1), wherein a proportion of an intermetallic compound present in the at least one welded part is from 15% to 60%, and the intermetallic compound includes a metal element that constitutes the first component, and a metal element that constitutes the second component. Further disclosed is a battery (5) comprising the above welded metal component, wherein the second component serves as a bus bar (12), and the first component (1, 11A) serves as an electrode for the battery.

Abstract translation: 一种焊接金属部件包括：第一部件（1）; 第二部件（2），所述第二部件（2）堆叠在所述第一部件（1）上并且由与所述第一部件不同的材料制成; 和至少一个焊接部分（3），所述焊接部分（3）穿过所述第二部件（2）以到达所述第一部件（1），其中存在于所述至少一个焊接部分中的金属间化合物的比例为15％至60 ％，金属间化合物包含构成第一成分的金属元素和构成第二成分的金属元素。 还公开了包括上述焊接金属部件的电池（5），其中第二部件用作汇流条（12），第一部件（1,11A）用作电池的电极。