公开(公告)号：EP2773685B1

公开(公告)日：2018-11-21

申请号：EP12783795.3

申请日：2012-10-29

申请人： SABIC Global Technologies B.V.

发明人： GALLUCCI, Robert, Russell ,  ODLE, Roy Ray

IPC分类号： C08G73/10 ,  D01F6/74 ,  D01F6/78 ,  D04H1/4326 ,  D03D15/00 ,  D01D5/08

CPC分类号： C08G73/1071 ,  C08G73/10 ,  C08G73/1017 ,  C08G73/1028 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G75/23 ,  C08G77/382 ,  C08L79/08 ,  D01D5/08 ,  D01F6/74 ,  D01F6/78 ,  D04H1/4326 ,  Y10T428/249921 ,  Y10T428/2933 ,  Y10T428/2969

摘要： The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.

公开(公告)号：EP2744851B1

公开(公告)日：2018-09-19

申请号：EP12825153.5

申请日：2012-08-17

申请人： Akron Polymer Systems, Inc.

发明人： SUN, Limin ,  ZHANG, Dong ,  JING, Jiaokai ,  HARRIS, Frank W.

IPC分类号： C08J5/18 ,  C08L79/08 ,  C08G73/10 ,  B32B17/06 ,  C08J5/04 ,  C08G69/48 ,  H05K1/03 ,  H01L31/0392 ,  G02F1/1333

CPC分类号： C08G69/48 ,  B32B17/064 ,  B32B17/1055 ,  C08G73/1042 ,  C08G73/1078 ,  C08J5/043 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/14 ,  C08L63/00 ,  C08L79/08 ,  G02F1/133305 ,  H01L31/0392 ,  H01L31/03926 ,  H05K1/0393 ,  Y02E10/50 ,  Y10T428/24975 ,  Y10T428/31623

摘要： A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (

公开(公告)号：EP3368607A1

公开(公告)日：2018-09-05

申请号：EP16794463.6

申请日：2016-10-19

申请人： SABIC Global Technologies B.V.

发明人： CHAKRAVARTI, Shreyas ,  YANG, Yuzhen ,  ZHOU, Hao

IPC分类号： C08L53/02 ,  C08L67/02 ,  C08L69/00 ,  C08L79/08 ,  C08L83/10

CPC分类号： C08L79/08 ,  C08G77/448 ,  C08L53/02 ,  C08L67/02 ,  C08L69/00 ,  C08L69/005 ,  C08L83/10 ,  C08L2203/206 ,  C08L2205/035

摘要： Compositions formed from a blend of polyetherimide, siloxane/bisphenol-A polyester/polycarbonate copolymer, polycyclohexylenedimethylene terephthalate, polycarbonate/siloxane copolymer, and styrene-ethylene-butadiene-styrene are disclosed that provide superior performance in terms of notched Izod impact, glass transition temperature (Tg), strength after aging, ability to withstand secondary processing conditions, and in other respects. Such compositions exceed critical-to-quality requirements for use in manufacturing components for electronic communication devices.

公开(公告)号：EP3363845A1

公开(公告)日：2018-08-22

申请号：EP17802981.5

申请日：2017-04-12

申请人： LG Chem, Ltd.

发明人： YUN, Cheolmin ,  SUH, Jun Sik ,  KIM, Kyungjun

IPC分类号： C08G73/14 ,  C08G73/10 ,  C08L79/08 ,  C08J5/18

CPC分类号： C08G73/14 ,  C08G18/341 ,  C08G73/1035 ,  C08G73/1039 ,  C08G73/1067 ,  C08J5/18 ,  C08L79/08

摘要： The present invention provides a polyamide-imide, a method for preparing same, and a polyimide film using same. The polyamide-imide film exhibits excellent transparency, heat resistance, mechanical strength and flexibility, and thus may be used in various fields such as substrates for device, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPCs), tapes, touch panels and protective films for optical discs.

公开(公告)号：EP3158016B1

公开(公告)日：2018-08-15

申请号：EP15728575.0

申请日：2015-06-16

申请人： Solvay Specialty Polymers Italy S.p.A.

发明人： POLASTRI, Fabio ,  KAPELYUSHKO, Valeriy ,  COLAIANNA, Pasqua

IPC分类号： C09D127/18 ,  C08K5/357 ,  C08L79/08 ,  C08L79/04 ,  C08L81/06

CPC分类号： C09D127/18 ,  C08G14/06 ,  C08G73/16 ,  C08L27/18 ,  C08L61/34 ,  C08L79/08 ,  C09D179/08 ,  C08K5/357 ,  C08L79/04 ,  C08L81/06

摘要： The invention pertains to a fluoropolymer composition comprising: - at least one fluoropolymer [polymer (A)]; - at least one benzoxazine compound [compound (B)] of formula (I), wherein each of Ra, equal to or different at each occurrence, is H or a C1-C12 alkyl group; Rb is a C1-C36 hydrocarbon group, possibly comprising heteroatoms, optionally comprising at least one benzoxazine group; j is zero or an integer of 1 to 4; each of Rc, equal or different at each occurrence, is a halogen or a C1-C36 hydrocarbon group, possibly comprising heteroatoms, optionally comprising at least one benzoxazine group; - at least one aromatic polyimide polymer [polymer (PI)]; - at least one organic solvent [solvent (S)], and to a method for coating a surface, specifically a metal surface, with a fluoropolymer, using said fluoropolymer composition.

公开(公告)号：EP3018124B1

公开(公告)日：2018-07-25

申请号：EP14191710.4

申请日：2014-11-04

申请人： LANXESS Deutschland GmbH

发明人： Laufer, Wilhelm ,  Wenzel, Volker

IPC分类号： C07C271/28 ,  C07C275/40 ,  C08L67/00 ,  C08L79/08 ,  C08K5/29

CPC分类号： C07C275/40 ,  C07C263/06 ,  C07C267/00 ,  C07C271/28 ,  C07C2601/14 ,  C08K5/29 ,  C08L67/00 ,  C08L79/08

公开(公告)号：EP3348598A1

公开(公告)日：2018-07-18

申请号：EP17851095.4

申请日：2017-09-08

申请人： LG Chem, Ltd.

发明人： KIM, Sang Gon ,  CHOI, Sung Yeol ,  JANG, Duk Hun ,  CHOI, Hyung Sam

IPC分类号： C08G73/10 ,  C08L79/08 ,  C08J5/18 ,  C08G18/64

CPC分类号： C08G73/14 ,  C08G18/64 ,  C08G73/10 ,  C08G73/1042 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08

摘要： The present disclosure relates to a polyimide-based block copolymer and a polyimide-based film including the same. The polyimide-based block copolymer according to the present disclosure makes it possible to provide a polyimide-based film exhibiting excellent mechanical properties while having a high molecular weight, and being colorless and transparent.

公开(公告)号：EP3347430A1

公开(公告)日：2018-07-18

申请号：EP16844900.7

申请日：2016-08-30

申请人： Pepsico, Inc.

发明人： WILCZAK, Wojciech A. ,  NICHOLSON, Lee M.

IPC分类号： C09K5/14

CPC分类号： C08G63/183 ,  B65D1/0215 ,  B65D85/72 ,  C08G2390/00 ,  C08K3/38 ,  C08K9/00 ,  C08L67/00 ,  C08L77/00 ,  C08L79/08 ,  C08L75/00 ,  C08L69/00

摘要： Provided herein are polymer (e.g., PET) compositions comprising exfoliated hexagonal boron nitride (h-BN), methods of preparing and methods of using thereof. The methods for preparing the polymer (e.g., PET) compositions include providing a reactant mixture comprising exfoliated hexagonal boron nitride (h-BN) and a first monomeric or oligomeric reactant, and polymerizing the first monomeric or oligomeric reactant. Also provided are containers (e.g., bottles) prepared using the polymer (e.g., PET) compositions comprising exfoliated h-BN.

公开(公告)号：EP3187559A4

公开(公告)日：2018-07-18

申请号：EP15830699

申请日：2015-08-05

申请人： TORAY INDUSTRIES

发明人： ARIMOTO SHINJI ,  FUJIWARA TAKENORI ,  TOMIKAWA MASAO

IPC分类号： C09J179/08 ,  C08G73/10 ,  C08K5/544 ,  C08L79/08 ,  C08L83/04 ,  C09J7/00 ,  C09J11/06 ,  C09J183/04 ,  C11D7/50 ,  H01L21/02 ,  H01L21/304

CPC分类号： H01L21/6835 ,  B32B7/12 ,  B32B43/006 ,  B32B2457/14 ,  C08G73/10 ,  C08K5/544 ,  C08L79/08 ,  C08L83/04 ,  C09J5/00 ,  C09J7/00 ,  C09J11/06 ,  C09J179/08 ,  C09J183/04 ,  C09J183/14 ,  C09J2203/10 ,  C09J2205/302 ,  C09J2400/10 ,  C09J2483/00 ,  C11D7/50 ,  C11D7/5013 ,  C11D7/5022 ,  H01L21/02 ,  H01L21/0206 ,  H01L21/304 ,  H01L21/76898 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y02P20/582

摘要： The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention is a temporary-bonding adhesive characterized by being a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol% of the (A1) residue and 0.01-60 mol% of the (B1) residue.

公开(公告)号：EP3344703A1

公开(公告)日：2018-07-11

申请号：EP16763964.0

申请日：2016-08-25

申请人： SABIC Global Technologies B.V.

发明人： SHAN, Wei ,  SHEN, Liang

IPC分类号： C08L79/08 ,  H01B3/42 ,  H01B7/295

CPC分类号： H01B3/427 ,  C08G73/106 ,  C08G73/1067 ,  C08L67/00 ,  C08L79/08 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/202 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/06 ,  C08L2207/04 ,  H01B3/28 ,  H01B3/303 ,  H01B3/306 ,  H01B3/423 ,  H01B3/46 ,  H01B7/0275 ,  H01B7/24 ,  H01B7/295 ,  C08L67/025 ,  C08L23/06 ,  C08L63/00 ,  C08L67/02

摘要： A thermoplastic composition includes a polyetherimide, a thermoplastic polyester elastomer comprising a hard segment comprising a polyester block, and a soft segment comprising a polyether block or a polyester block, and optionally, a polyester, one or more flame retardants, and one or more additives. Articles including the composition can include an extruded part, an injection molded part, or a hot-compressed part. Also described herein is an electrical wire including a conductor wire and a covering disposed over the conductor wire, wherein the covering includes the thermoplastic composition. Articles including the electrical wire are also discussed.