公开(公告)号：EP2485572A2

公开(公告)日：2012-08-08

申请号：EP12000671.3

申请日：2012-02-01

Applicant: Sony Corporation

Inventor： Kajiya, Shunichi ,  Hayashibe, Kazuya

IPC: H05K3/00 ,  H05K3/06

CPC classification number: H05K3/0014 ,  G02F1/134336 ,  G02F1/13439 ,  H05K3/06 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2203/0143

Abstract: A conduction element includes a substrate which has a first wave surface and a second wave surface, and a laminate film which is formed on the first wave surface and where two or more layers are laminated, where the laminate film forms a conduction pattern, and the first wave surface and the second wave surface satisfy a relationship below. 0 ≤ Am ⁢ 1 / λm ⁢ 1 Am ⁢ 2 / λm ⁢ 2 ≤ 1.8
(Here, Am1: average width of vibration in the first wave surface, Am2: average width of vibration in the second wave surface, λm1: average wavelength of the first wave surface, λm2: average wavelength of the second wave surface)

Abstract translation: 导电元件包括​​具有第一波面和第二波面的基板和形成在第一波面上并且层叠有两层或多层的叠层膜，其中层压膜形成导电图案，并且 第一波面和第二波面满足以下关系。 0‰¤ ¢1 /»m ¢1

公开(公告)号：EP2194548A2

公开(公告)日：2010-06-09

申请号：EP09014026.0

申请日：2009-11-10

Applicant: Greatbatch Ltd.

Inventor： Stevenson, Robert A. ,  Dabeny, Warren S. ,  Brendel, Richard L. ,  Roberts, John ,  Frysz, Christine A.

IPC: H01G4/35 ,  A61N1/37 ,  H01R13/719 ,  A61N1/375 ,  H05K3/32 ,  A61N1/05 ,  H01R13/66

CPC classification number: A61N1/37 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/0556 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/35 ,  H01R13/7197 ,  H01R2201/12 ,  H05K3/321 ,  H05K2201/0326

Abstract: An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip. A biocompatible and non-migratable adhesive is utilized to conductively couple components of the individual components of the electronic network, such as the conductive surface, circuit trace, lead or electrode.

Abstract translation: 一种可植入的被动或主动电子网络部件或部件网络所有这些是适合长时间直接体液暴露和可附接到导电表面，电路迹线，铅或电极提供。 电子网络部件或元件网络包括（1）生物相容的和非迁移的材料制成的非导电体，（2）生物相容的和非迁移的材料制成的导电终端面，与主体相关联的，和（3）的连接 生物相容的和非迁移的材料的材料，对于终端面电性耦合到所述导电表面，电路迹线，导线或电极。 电子网络组件可以包括电容器，电阻器，电感器，二极管，晶体管，电子开关，微机电系统装置，或微芯片。 生物相容性的和非迁移的粘合剂被用于电子网络,:的各个组件的导电连接组件，如导电表面，电路迹线，导线或电极。

公开(公告)号：EP2172087A2

公开(公告)日：2010-04-07

申请号：EP08784565.7

申请日：2008-06-30

Applicant: Schott AG

Inventor： KRACHT, Peter ,  ALBRECHT, Bernd ,  GRIMM, Daniel ,  ULLMANN, Angelika ,  WALTHER, Marten ,  DUESING, Ernst-Friedrich ,  SCHILLERT, Horst ,  ANTON, Matthias ,  NICKUT, Andreas ,  DOEPPNER, Christoph, Lothar ,  MOEHL, Wolfgang ,  SCHNEIDER, Rolf, A., O. ,  HENN, Christian

IPC: H05K1/09 ,  G09F9/33 ,  H01L33/00 ,  H05K3/24 ,  H05K1/03

CPC classification number: H05K3/24 ,  B32B17/10045 ,  B32B17/10055 ,  B32B17/10174 ,  F21K9/00 ,  G09F9/33 ,  G09F19/22 ,  G09F19/226 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0391 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Large-area display device, in particular multimedia façade comprising at least one transparent element, in which the transparent element comprises at least one transparent substrate on which one or more lighting elements is/are arranged.

Abstract translation: 大面积显示装置，特别是多媒体外观，包括至少一个透明元件，其中透明元件包括至少一个透明基板，一个或多个照明元件布置在该透明基板上。

公开(公告)号：EP2095434A2

公开(公告)日：2009-09-02

申请号：EP07849429.1

申请日：2007-12-11

Applicant: Koninklijke Philips Electronics N.V.

Inventor： PEETERS, Martinus P. J. ,  MERCIER, Virginie

IPC: H01L33/00 ,  H05K1/02

CPC classification number: H01L33/62 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05599

Abstract: Proposed is a lighting device (100), comprising LEDs (130) mounted on a transparent substrate (110), provided with a transparent electrically conductive layer (120) and a contact pad (140). The contact pad has a second part (142), extending away from a first part (141), for further reducing the current density in the conductive layer (120). This is advantageous for making the lighting device robust to large power dissipation, especially under high current testing conditions. Moreover, as the voltage drop over transparent conductive layer is reduced, the efficiency of the lighting device is increased.

公开(公告)号：EP1965976A1

公开(公告)日：2008-09-10

申请号：EP06841503.3

申请日：2006-12-20

Applicant: AGC Flat Glass Europe SA

Inventor： LEFEVRE, Hugues

IPC: B32B17/10 ,  F21S8/00 ,  B60Q3/02 ,  F21V29/00 ,  A47F3/00

CPC classification number: B32B17/10761 ,  B32B17/10 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10192 ,  B32B17/10541 ,  F21K9/00 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  B32B2367/00

Abstract: The present invention relates to illumination means in which the light output generator elements are light-emitting diodes. The diode illumination means according to the invention includes a laminated assembly consisting of at least one organic or inorganic glass sheet combined with at least one thermoplastic sheet incorporating the diodes. The individual power features of each diode, the operating conditions thereof and the diode distribution over the surface of the sheets are such that the generated light output is of at least 300 lm.

Abstract translation: 本发明涉及照明装置，其中光输出发生器元件是发光二极管。 根据本发明的二极管照明装置包括由至少一个有机或无机玻璃板组成的层叠组件，该玻璃板与至少一个结合有二极管的热塑性片组合。 每个二极管的各个功率特征，其工作条件和片材表面上的二极管分布使得所产生的光输出为至少300lm。

公开(公告)号：EP1559296B1

公开(公告)日：2006-04-12

申请号：EP03778393.3

申请日：2003-10-15

Applicant: SAINT-GOBAIN GLASS FRANCE

Inventor： CRUMBACH, Richard ,  REUL, Bernhard ,  SZNERSKI, Andreas

IPC: H05B3/86 ,  H01Q1/32 ,  C03C17/36 ,  B32B17/06

CPC classification number: B32B17/10036 ,  B23K1/0008 ,  B32B17/10174 ,  B32B17/10761 ,  H01R4/02 ,  H01R2201/26 ,  H05B3/84 ,  H05B2203/016 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/363 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0969

Abstract: The invention concerns a transparent window (1.1), in particular a glass window, having at least one electrically conductive non-transparent contact surface (3), provided on one of its surfaces, for its being bonded by soldering to a connection piece (4). The invention is characterized in that in the region of the soldering site, the contact surface is provided with at least one cutout (3A) whereby the soldering input metal (5) is visible through the window (1) after the connection piece (4) has been soldered at the contact surface (3). Such a configuration enables reliable visual verification of the soldering sites, even when the soldering site is incorporated inside a composite glazing and has been soldered, as the case may be by input of induction heat.

公开(公告)号：EP1387367A4

公开(公告)日：2005-04-27

申请号：EP02710342

申请日：2002-01-24

Applicant: JSR CORP

Inventor： ITO NOBUYUKI ,  MASUKO HIDEAKI ,  HASEGAWA SATOMI ,  YOSHIMURA NAKAATSU

IPC: C04B35/00 ,  C08K9/02 ,  C09C1/36 ,  C09C3/06 ,  C09C3/08 ,  C09D5/00 ,  C09D5/44 ,  C09D179/08 ,  H01B3/00 ,  H01B3/12 ,  H01G4/20 ,  H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K3/46 ,  C08K3/22 ,  C08K9/00 ,  C08K9/04

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

公开(公告)号：EP1450416A1

公开(公告)日：2004-08-25

申请号：EP04012665.8

申请日：2001-03-17

Applicant: Schott Glas ,  CARL-ZEISS-STIFTUNG trading as SCHOTT GLAS

Inventor： Zenker, Thomas ,  Thiemann, Christian

IPC: H01L33/00

CPC classification number: G09F9/33 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/42 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0284 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein Bauelement, insbesondere LED-Modul mit
einem transparenten Substrat (1),
einer auf das transparente Substrat (1) aufgebrachten leitfähigen Schicht, wobei die leitfähige Schicht im sichtbaren Wellenlängenbereich transparent oder quasi transparent und beliebig strukturierbar ist, wenigstens einem Leuchtmittel, das auf eine Fläche des transparenten Substrates aufgebracht ist,
dadurch gekennzeichnet, dass das transparente Bauelement wenigstens ein weiteres transparentes Substrat umfasst,
das über den auf dem Trägersubstrat wenigstens einen aufgebrachten Leuchtmittel angeordnet ist, so dass das Leuchtmittel geschützt zwischen dem Trägersubstrat und dem weiteren transparenten Substrat liegt.

Abstract translation: 本发明涉及一种组件，尤其是LED模块，其包括一透明基片（1），一个在透明基板（1）上施加的导电层，在可见光波长区上的导电层是透明的或准透明和任何可配置的，至少一个发光装置， 被施加到所述透明基板的表面，其特征在于，所述透明元件包括至少一个另外的透明基板被布置在所述载体基片上的至少一个施加的灯，使得保护的载体基板与所述另外的透明基板之间的发光装置 是。

公开(公告)号：EP1284590A1

公开(公告)日：2003-02-19

申请号：EP02405656.6

申请日：2002-07-28

Applicant: Swissvoice AG

Inventor： Baiker, Stefan

IPC: H05K3/32 ,  H01R12/22

CPC classification number: H01R13/2414 ,  H01R12/62 ,  H05K1/11 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/0326 ,  H05K2201/0373 ,  H05K2201/10136

Abstract: Die Vorrichtung dient zur gegenseitigen Kontaktierung von Anschlussleitungen (21, 31) von wenigstens zwei elektronischen Modulen (4, 5) mittels eines alternierend leitfähige und isolierende Schichten (10, 11) aufweisenden Zebraleitgummis (1), welches zwischen mit den Anschlussleitungen (21, 31) verbundenen Anschlusskontakten (2, 3) derart komprimiert wird, dass die einander zugehörigen Anschlusskontakte (2, 3) mittels leitfähigen Schichten (10) miteinander verbunden werden. Erfindungsgemäss sind die Anschlusskontakte (2, 3) eines oder beider Module (4, 5) mit Vertiefungen und/oder Rinnen (23) versehen, die zur Aufnahme und gegebenenfalls zur Ableitung von Flüssigkeit geeignet sind, die aus dem Zebraleitgummi (1) austreten und Kontaktprobleme verursachen kann.

Abstract translation: 为至少两个电子模块（4.5）通过交替导通的装置和绝缘层的连接引线/电缆的相互接触（21,31）的装置（10; 11）的橡胶导电块（1），所有这些是 连接到在寻求一种方式线或电缆（21,31）的端子触点（2,3）之间被压缩并相互关联的终端触点由导电层（10）的方式彼此连接。 一项所述的终端触头（2,3）或两个模块（4,5）设置有凹部或槽（23）。

公开(公告)号：EP0995199B1

公开(公告)日：2002-08-21

申请号：EP98937547.2

申请日：1998-06-25

Applicant: Glas Platz

Inventor： PLATZ, Karl-Otto

IPC: H01B5/14

CPC classification number: H01B5/14 ,  H05K1/02 ,  H05K1/0306 ,  H05K2201/0108 ,  H05K2201/0326