公开(公告)号：EP0722264B1

公开(公告)日：2007-02-28

申请号：EP96300028.6

申请日：1996-01-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yamamoto, Osamu

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/20

CPC classification number: H01R9/2466 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/142 ,  H05K1/184 ,  H05K3/202 ,  H05K3/325 ,  H05K3/3447 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/0969

公开(公告)号：EP1661053A2

公开(公告)日：2006-05-31

申请号：EP04780522.1

申请日：2004-08-06

Applicant: Shapira, Shmuel

Inventor： Shapira, Shmuel

IPC: G06K1/00

CPC classification number: H05K3/041 ,  H05K1/165 ,  H05K3/107 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A system and method of forming a circuit. The system and method includes layering an impressionable material and a conductive material, defining adjacent charge paths on the conductive material, and shaping the impressionable material to increase a gap between adjacent charge paths.

公开(公告)号：EP1329144B1

公开(公告)日：2004-06-02

申请号：EP01988009.5

申请日：2001-10-16

Applicant: ROBERT BOSCH GMBH

Inventor： SCHMID, Roland ,  UHLAND, Thomas ,  BECKBISSINGER, Kai ,  SCHINZEL, Ralf ,  HENNEL, Udo

IPC: H05K3/34 ,  H05K1/11 ,  H05K7/08

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/0969

Abstract: The invention relates to a module support (1), for electrical/electronic components (7), comprising a conductor arrangement with several metallic conductors (2), formed from a stamped grid and an insulating material shell (3) in which the metallic conductors (2) are at least partly embedded. At least one contact section (10) of a metallic conductor (2), for contacting a connector element (8) on an electrical/electronic component (7), is arranged in a through recess (6) in the insulating material shell (3). According to the invention, damage to the insulating material shell (3), on soldering the contact section (10), may be avoided, whereby the at least one contact section (10) of the metallic conductor (2) is completely removed from the shell of insulating material and is only electrically connected to a section (12) of the conductor (2), arranged on the inner wall of the recess (6), by means of at least one connector bridge (11), arranged in said recess (6). The heat-conducting cross-sectional area of the at least one connector bridge (11) is small, in such a way that, on a strong heating of the contact section (10), the connector bridge (11) causes a reduction in the flow of heat to the section (12) of the conductor (2) arranged on the inner wall of the recess (6), which has a larger heat-conducting cross-sectional area.

公开(公告)号：EP1315780A2

公开(公告)日：2003-06-04

申请号：EP01968695.5

申请日：2001-09-07

Applicant: 3M Innovative Properties Company

Inventor： KAWATE, Kohichiro ,  HIRASAWA, Yuji

IPC: C09J7/02 ,  C09J5/06 ,  H01R4/04

CPC classification number: H05K3/321 ,  C09J5/06 ,  C09J7/28 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2461/00 ,  C09J2463/00 ,  H01R4/04 ,  H05K3/4015 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2203/1189

Abstract: A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.

公开(公告)号：EP1229771A1

公开(公告)日：2002-08-07

申请号：EP01921986.4

申请日：2001-04-23

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： YAMAMOTO, Takuya, c/o MITSUI MIN. & SMELT. CO. LTD ,  KATAOKA, Takashi, c/o MITSUI MIN. & SMELT. CO. LTD ,  HIRASAWA, Yutaka, c/o MITSUI MIN. & SMELT. CO.LTD

IPC: H05K3/00 ,  H05K3/46 ,  B23K26/00

CPC classification number: H05K3/025 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0382

Abstract: A printed wiring board manufacturing method is provided which is so constituted that when a carbon dioxide laser is used to form holes such as via holes in a copper clad laminate, copper foils and resin layers may be processed at the same time, without having to perform an etching treatment on the copper foil. Namely, a carbon dioxide laser is used to form recess portions such as via holes in a copper clad laminate, followed by plating to form interlayer electrical connections, forming etching resist layers, and exposing and developing the etching resist layers, thereby effecting a circuit etching treatment. In particular, the copper clad laminate is a laminate formed by using waved copper foils to form external copper foils.

公开(公告)号：EP0806127B1

公开(公告)日：2002-06-05

申请号：EP95943682.5

申请日：1995-12-07

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： ROBERTS, Joseph, A.

IPC: H05K3/04

CPC classification number: H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K7/1451 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: A process and apparatus for producing supported conductive networks (1) which can be flexible or rigid, having densely packed circuits (3). The process and apparatus for making the conductive network (1) involves forming a conductive material (8) supported on a 'dynamic pressure cushion' into a non-planar pattern defining the desired conductive circuits (3) in relation to a fixed reference plane (32). The 'dynamic pressure cushion' is a material having suitable viscosity and flow characteristics to flow out from under the conductive material (8) as it is being formed and fill up any voids. To ensure that the 'dynamic pressure cushion' properly flows without deforming the desired circuits (3), the die (6) used to form the conductive material (8) is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane (32) leaving the desired conductive circuits (3).

公开(公告)号：EP0871568A4

公开(公告)日：2002-05-08

申请号：EP96918387

申请日：1996-06-07

Applicant: DEXTER CORP

Inventor： GEBHARDT WILLIAM F ,  PAPALIA ROCCO

IPC: H05K1/03 ,  B32B15/08 ,  H05K3/04 ,  H05K3/10 ,  H05K3/38 ,  B32B9/00

CPC classification number: B32B15/08 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/08 ,  H05K3/045 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2203/0108 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A thin film printed board precursor containing a laminate of a dielectric thermosetting resin film layer (6) and a heat and electrically conductive metal foil layer (5) in direct adhesive bonding with a side of the resin film (6), optionally containing a supporting layer (22) comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer (6), wherein the dielectric thermosetting resin layer (6) has an unimpeded thickness that is at least equal to that of the foil layer (5) bonded to it.

Abstract translation: 一种薄膜印刷电路板前体，其包含介电热固性树脂薄膜层和导热金属箔层之间的层压体，其与树脂薄膜的一侧直接粘接，任选地包含一个支撑层，该支撑层包括纤维，织物 以及与树脂层的另一侧接触的热塑性聚合物，其中所述介电热固性树脂层具有至少等于与其粘合的箔层的厚度的无阻碍厚度。

公开(公告)号：EP0591761B1

公开(公告)日：2002-01-30

申请号：EP93115257.3

申请日：1993-09-22

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kawakita, Kouji ,  Tsukamoto, Masahide ,  Horio, Yasuhiko ,  Nakatani, Seiichi ,  Hatakeyama, Akihito

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4046 ,  H01L2224/16237 ,  H05K1/0366 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165

公开(公告)号：EP1005086A3

公开(公告)日：2001-01-03

申请号：EP99309372.3

申请日：1999-11-24

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Muramatsu, Shigetsugu, Shinko Elect. Ind. Co. Ltd. ,  Ogawa, Yoshihiko, Shinko Elect. Ind. Co. Ltd. ,  Kojima, Norio

IPC: H01L23/495 ,  H01L23/498

CPC classification number: H05K3/4007 ,  H01L23/3114 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49861 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/28 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/10977 ,  H05K2203/1572 ,  H01L2224/05099

Abstract: A semiconductor device wherein a circuit substrate of a single or multiple layer is composed in such a manner that bumps (22), which are electrically connected to connection electrodes (12) provided on one face of a surface mount device (10), are arranged in the same planar arrangement as that of the connection electrodes (12). The bumps (22) protrude from one side of a sheet of metal foil (20) on which wiring patterns (16) electrically connected to the bumps (22) are formed. An insulating adhesive agent layer (18) is adhered to the side of the sheet of metal foil (20) having the bumps (22) and is also adhered to one face of the surface mount device (10) while the tips of the bumps (22) come into contact with respective connection electrodes (12).

公开(公告)号：EP0969706A2

公开(公告)日：2000-01-05

申请号：EP99119308.7

申请日：1995-07-19

Applicant: TESSERA, INC.

Inventor： Distefano, Thomas H. ,  Smith, John W. ,  Karavakis, Konstantine ,  Kovak, Zlata ,  Fjelstad, Joseph

IPC: H05K3/46 ,  H05K3/42 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

Abstract translation: 用于微电子电路板（260）之间的互连的插入器在其表面具有触点（250）。 每个触点具有垂直于表面的中心轴线，以及适于根据由接合电路板上的焊盘（262）施加的力从中心轴线径向向外扩张的周边部分。 因此，当电路板（260）用插入件压缩时，触头径向膨胀并擦拭穿过焊盘（262）。 擦拭动作有助于将接触件接合到焊盘，如通过接触件本身承载的导电接合材料（246）。