公开(公告)号：EP2489248A1

公开(公告)日：2012-08-22

申请号：EP10704608.8

申请日：2010-01-28

Applicant: Telefonaktiebolaget L M Ericsson (PUBL)

Inventor： OLSÉN, Conny

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/112 ,  H05K1/0224 ,  H05K1/025 ,  H05K2201/09236 ,  H05K2201/09381

Abstract: The present invention concerns a printed circuit board, PCB. The PCB comprises a number of signal layers comprising routing channels and at least one ground layer being adjacent to at least one signal layer. A number of via holes (220) connects different signal layers of the PCB. In the signal layers the via holes are connected to pads (1505) and in the ground layers they are be surrounded by anti-pads (225). The pads are shaped such that at least a part of a via hole connected to the pad is on the outside of, or in close proximity to, the edge of the pad, irrespective of where on the pad the centre of the via hole is positioned.

Abstract translation: 本发明涉及印刷电路板PCB。 该PCB包括多个信号层，该多个信号层包括布线通道以及与至少一个信号层相邻的至少一个接地层。 多个通孔（220）连接PCB的不同信号层。 在信号层中，通孔连接到焊盘（1505）并且在接地层中它们被防焊垫（225）围绕。 焊盘的形状使得连接到焊盘的通孔的至少一部分位于焊盘的边缘的外部或靠近焊盘的边缘，而与通孔的中心位于焊盘上的位置无关 。

公开(公告)号：EP2480055A2

公开(公告)日：2012-07-25

申请号：EP12000868.5

申请日：2004-08-13

Applicant: Intel Corporation

Inventor： McCall, James ,  Shykind, Shawn, W.

IPC: H05K1/03

CPC classification number: H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

Abstract: A circuit board comprising: a resin; first and second fiberglass fibers; and first and second signal line traces capable of transmitting electrical signals, wherein: wherein the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

Abstract translation: 一种电路板，包括：树脂; 第一和第二玻璃纤维; 以及能够传输电信号的第一和第二信号线迹线，其中：其中：所述第一和第二玻璃纤维光纤以锯齿形图案在所述第一和第二信号线迹线附近交叉。

公开(公告)号：EP2109092A3

公开(公告)日：2012-05-30

申请号：EP09450073.3

申请日：2009-04-03

Applicant: I & T GmbH

Inventor： Reiszner, Harald, Dr.

IPC: G09G3/32 ,  G09F9/33 ,  H05B37/02 ,  H05K1/18

CPC classification number: H05K1/189 ,  G09F9/30 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/02 ,  H05B37/0254 ,  H05K2201/09236 ,  H05K2201/10106 ,  H05K2201/10356 ,  H05K2201/10689 ,  H05K2203/173 ,  H05K2203/175

Abstract: Die Erfindung betrifft ein Flachbandkabel mit einer Vielzahl von Leitungen (1), umfassend zwei Leitungen (15) zum Führen einer Versorgungsspannung und eine, insbesondere eine einzige, Busleitung (11) zum Führen eines Bussignals, und zumindest eine Ausgangsleitung (12) für die Ansteuerung von mit der jeweiligen Ausgangsleitung (12) elektrisch verbundenen Leuchtmittel (2).
Erfindungsgemäß ist vorgesehen, dass auf dem Flachbandkabel Treiberbausteine (3) angeordnet sind, wobei einer der Eingänge eines jeden Treiberbausteins (3) mit der Busleitung (11) verbunden ist, die Treiberbausteine (3) zumindest einen schaltbaren Ausgang (31) aufweisen, welcher mit jeweils einer Ausgangsleitung (12) verbunden ist, und die Ausgangsleitung (12) einzelne gegeneinander isolierte Abschnitte (121) aufweist, welche mit jeweils einem schaltbaren Ausgang (31) eines Treiberbausteins (3) elektrisch verbunden sind, und welche gegeneinander isoliert sind (Fig. 1).

公开(公告)号：EP2373590A1

公开(公告)日：2011-10-12

申请号：EP09828731.1

申请日：2009-11-30

Applicant: Xjet Ltd.

Inventor： DOVRAT, Michael ,  PELEG, Ran, Asher ,  HADAR, Amir ,  GOTHAIT, Hanan

IPC: C03C15/00

CPC classification number: H01L21/288 ,  B41J2/155 ,  B41J3/543 ,  B41J25/001 ,  B41J2202/04 ,  B41J2202/21 ,  B41M1/22 ,  B41M5/0047 ,  C23C4/01 ,  H01L31/0504 ,  H05K3/125 ,  H05K2201/09236

Abstract: Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.

公开(公告)号：EP2282620A4

公开(公告)日：2011-08-17

申请号：EP09750642

申请日：2009-05-21

Applicant: MEISEI GAKUEN ,  SHINETSU POLYMER CO

Inventor： OTSUKA KANJI ,  AKIYAMA YUTAKA ,  KAWAGUCHI TOSHIYUKI ,  TAHARA KAZUTOKI

IPC: H05K1/02 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09236

公开(公告)号：EP2187715B1

公开(公告)日：2011-05-04

申请号：EP09252440.4

申请日：2009-10-19

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Naitou, Toshiki ,  Honjo, Mitsuru

IPC: H05K1/00 ,  G11B5/48

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

公开(公告)号：EP1427061B1

公开(公告)日：2011-04-20

申请号：EP04002034.9

申请日：1999-11-24

Applicant: Amphenol Corporation

Inventor： Cohen, Thomas S. ,  Gailus, Mark W. ,  Stokoe, Philip T.

IPC: H01R12/00

CPC classification number: H01R12/724 ,  H01R12/727 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6587 ,  H01R24/44 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189

公开(公告)号：EP2258023A1

公开(公告)日：2010-12-08

申请号：EP09721571.9

申请日：2009-02-19

Applicant: Sony Corporation ,  Sony Electronics, Inc.

Inventor： SHINTANI, Peter ,  TOYOSHIMA, Kenichiro

IPC: H01R12/14

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K1/141 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A controlled impedance bus includes a pair of bus traces that carry a transmission minimized differential signal (TMDS). Two or more buffer output terminals. Each output terminal includes a pair of pads connected to the pair of bus traces such that unused pads create minimal stubs on the pair of bus traces. Two or more buffer input terminals are provided. Each of the buffer input terminals includes a pair of connector traces that extend substantially perpendicular to the bus traces. At least one connector is connected to a first end of the pair of connector traces of one of the buffer input terminals. At least one buffer device is connected to a second end of the pair of connector traces and to the pair of pads of one of the buffer output terminals. The buffer device provides signals on the pair of bus traces when enabled by an enable input.

公开(公告)号：EP1959280A3

公开(公告)日：2010-11-17

申请号：EP07254768.0

申请日：2007-12-10

Applicant: OpNext Japan, Inc.

Inventor： Takamatsu, Hisashi ,  Yamashita, Takeshi ,  Kuwano, Hideyuki ,  Kagaya, Osamu ,  Arima, Hiroyuki

IPC: G02B6/42 ,  H05K1/00

CPC classification number: G02B6/4201 ,  G02B6/4271 ,  G02B6/4277 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09663 ,  H05K2201/10121 ,  H05K2201/10446

Abstract: An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.

公开(公告)号：EP2187715A1

公开(公告)日：2010-05-19

申请号：EP09252440.4

申请日：2009-10-19

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Naitou, Toshiki ,  Honjo, Mitsuru

IPC: H05K1/00 ,  G11B5/48

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

Abstract translation: 第一写入布线图案的第一行的末端和第二行的末端布置在第二写入布线图案的第三行的两侧。 在第一行和第二行的末端提供圆形连接部分。 通孔分别形成在连接部分上方的覆盖绝缘层的部分中。 例如，由铜制成的第一连接层被形成为填充覆盖绝缘层的通孔。 例如，由铜制成的基本矩形的第二连接层被形成为整体地覆盖连接层的上端。 这使得第一和第二线路通过第一和第二连接层彼此电连接。