公开(公告)号：EP1825525A4

公开(公告)日：2009-06-17

申请号：EP05780713

申请日：2005-07-21

Applicant: LG INNOTEK CO LTD

Inventor： PARK JUN SEOK

IPC: H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package, comprising: a base layer (350) having an flat top surface; a light emitting device (360) located directly on the flat top surface of the base layer; an electrical circuit layer (330) located above the flat top surface of the base layer and including at least one end portion placed adjacent to the light emitting device; an electrode layer (322) disposed above a tip portion of each of said end portion of the electrical circuit layer; and a lens (380) extending at least over the light emitting device and the end portion of the electrical circuit layer and covering the electrode layer.

公开(公告)号：EP3143849B1

公开(公告)日：2019-07-03

申请号：EP15709451.7

申请日：2015-03-05

Applicant: Auto-Kabel Management GmbH ,  Tazarine, Wacim ,  Betscher, Simon ,  Gronwald, Frank ,  Rafati, Sohejl

Inventor： TAZARINE, Wacim ,  BETSCHER, Simon ,  GRONWALD, Frank ,  RAFATI, Sohejl

IPC: H05K1/14 ,  H05K1/05 ,  H05K1/02 ,  B60R16/03 ,  F02N11/08

CPC classification number: H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

公开(公告)号：EP3313155A3

公开(公告)日：2018-08-29

申请号：EP17197067.6

申请日：2017-10-18

Applicant: Hamilton Sundstrand Corporation

Inventor： PERLEY, David ,  TROTMAN, Kenneth J.

IPC: H05K1/02 ,  H01L23/34 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L23/34 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/306 ,  H05K7/02 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2203/17

Abstract: A circuit component arrangement (105) includes a base (102) and a plurality of circuit components (104) mounted to the base (102). A bonding agent (106) adheres the circuit components (104) in intimate contact to the base (102). The bonding agent (106) is disposed in a respective open channel (108) defined in an outward facing surface (110) of the base (102) in contact with each of the circuit components (104). A method of assembling a circuit component arrangement (100) includes temporarily fastening a plurality of circuit components (104) to a base (102). A bonding agent (106) is injected into a respective open channel (108) defined in the base (102) to adhere each of the plurality of circuit components (104) to the base. The plurality of circuit components (104) are unfastened from the base (102). Injecting a bonding agent (106) can include ceasing injection of bonding agent (106) upon appearance of bonding agent (106) in a window opening (118) in fluid communication with the open channel.

公开(公告)号：EP3313155A2

公开(公告)日：2018-04-25

申请号：EP17197067.6

申请日：2017-10-18

Applicant: Hamilton Sundstrand Corporation

Inventor： PERLEY, David ,  TROTMAN, Kenneth J.

IPC: H05K1/02 ,  H01L23/34 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L23/34 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/306 ,  H05K7/02 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2203/17

Abstract: A circuit component arrangement (105) includes a base (102) and a plurality of circuit components (104) mounted to the base (102). A bonding agent (106) adheres the circuit components (104) in intimate contact to the base (102). The bonding agent (106) is disposed in a respective open channel (108) defined in an outward facing surface (110) of the base (102) in contact with each of the circuit components (104). A method of assembling a circuit component arrangement (100) includes temporarily fastening a plurality of circuit components (104) to a base (102). A bonding agent (106) is injected into a respective open channel (108) defined in the base (102) to adhere each of the plurality of circuit components (104) to the base. The plurality of circuit components (104) are unfastened from the base (102). Injecting a bonding agent (106) can include ceasing injection of bonding agent (106) upon appearance of bonding agent (106) in a window opening (118) in fluid communication with the open channel.

Abstract translation: 电路组件装置（105）包括基座（102）和安装到基座（102）的多个电路组件（104）。 结合剂（106）将电路元件（104）与基座（102）紧密接触。 结合剂（106）设置在限定在与每个电路部件（104）接触的基部（102）的面向外的表面（110）中的相应开放通道（108）中。 一种组装电路元件装置（100）的方法包括将多个电路元件（104）临时固定到基座（102）。 将结合剂（106）注入到限定在基部（102）中的相应开放通道（108）中以将多个电路部件（104）中的每一个粘附到基部。 多个电路部件（104）从底座（102）解开。 注入粘合剂（106）可以包括在粘合剂（106）出现在与开放通道流体连通的窗口（118）中时停止注入粘合剂（106）。

公开(公告)号：EP3002563B1

公开(公告)日：2017-07-26

申请号：EP15187502.8

申请日：2015-09-29

Applicant: Honeywell International Inc.

Inventor： NOVYSEDLAK, Peter ,  HAJEK, Ondrej ,  KONECNY, Martin ,  VASICEK, Milan

IPC: G01D11/24 ,  G01P1/02 ,  B81B7/00

CPC classification number: H05K5/0239 ,  B81B7/0032 ,  G01D3/028 ,  G01D11/245 ,  G01P1/023 ,  H05K1/0212 ,  H05K5/0013 ,  H05K5/0213 ,  H05K2201/06

公开(公告)号：EP3168868A1

公开(公告)日：2017-05-17

申请号：EP16198323.4

申请日：2016-11-11

Applicant: Covidien LP

Inventor： RUPP, Steven C. ,  FRIEDRICHS, Daniel A. ,  SMITH, Robert B.

IPC: H01L23/36 ,  H01L23/40 ,  H05K1/02 ,  H01L23/367

CPC classification number: H05K7/205 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/40 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0213 ,  H05K13/0486 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10151

Abstract: A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.

Abstract translation: 提供了一种用于电子设备的热管理系统和方法。 该系统包括电子设备，散热器以及介于电子设备和散热器之间的导热且电绝缘的热桥。 热桥将电子设备热耦合至散热器并将电子设备与散热器电隔离。 电子设备，散热器和热桥安装在印刷电路板的同一平面上。

公开(公告)号：EP3143848A1

公开(公告)日：2017-03-22

申请号：EP15729831.6

申请日：2015-06-17

Applicant: Siemens Aktiengesellschaft

Inventor： KNOFE, Rüdiger ,  MÜLLER, Bernd ,  PRIHODOVSKY, Andrey

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/34 ,  H05K3/32 ,  H05K1/09 ,  H01B1/22

CPC classification number: H05K1/0212 ,  H05K1/095 ,  H05K1/11 ,  H05K1/167 ,  H05K3/30 ,  H05K3/321 ,  H05K3/325 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/06 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1115 ,  H05K2203/165

Abstract: The invention relates to a method for producing an electronic assembly or for disassembling same. The invention additionally relates to an electronic assembly. The assembly has a heating device (16) which is integrated into a substrate (11). The heating device can be heated via an external power supply (19) during the assembly process so that for example solder connections (25) of an electric component (23) can be melted. According to the invention, the heating device (16) can also be used when operating the electronic assembly, said heating device then being directly actuated by the component (23). For this purpose, an electric connection must then be established between the component (23) and the heating device (16), said connection not yet being provided during the thermal assembly process in order to protect the electronic components (23) of the circuit from being damaged.

Abstract translation: 提供一种用于制造或电子组件的拆卸方法。 该组件可以具有集成到基板的加热装置。 加热装置可以经由外部电源在组装过程中被加热，使得，例如，电气部件的焊料连接可以被熔化。 因此，该加热装置可用于当操作所述电子组件，并且所述加热装置然后可以通过将成分直接致动。 为了这个目的，在电连接，则该组件和加热装置，尚未被以保护该电路的电子元件被损坏时的热组装过程中提供的连接之间建立。

公开(公告)号：EP2851913A4

公开(公告)日：2016-01-27

申请号：EP13803427

申请日：2013-06-09

Applicant: SCHNEIDER TOSHIBA INVERTER

Inventor： CHEN JING

IPC: H01G2/06 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K5/02 ,  H05K7/14

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G2/065 ,  H05K1/111 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0239 ,  H05K7/1432 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/06 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/2018 ,  H05K2201/2036

公开(公告)号：EP2622972B1

公开(公告)日：2015-05-20

申请号：EP13153170.9

申请日：2013-01-30

Applicant: HAUNI Maschinenbau AG

Inventor： Roßfeldt, Niko

IPC: A24C5/28

CPC classification number: H05K1/0306 ,  A24C5/28 ,  H01L35/30 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155

公开(公告)号：EP2862422A1

公开(公告)日：2015-04-22

申请号：EP13730851.6

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： YANG, Jianghui ,  ZHONG, Chuanpeng ,  LI, Hao ,  CHEN, Xiaomian

IPC: H05K1/03 ,  H05K1/05 ,  H05K1/14

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.