公开(公告)号：EP0397747A1

公开(公告)日：1990-11-22

申请号：EP89901918.0

申请日：1989-01-17

Applicant: TROVE TECHNOLOGY INCORPORATED

Inventor： BERHOLD, G. Mark

IPC: H01R12 ,  H01L23 ,  H01L25 ,  H05K1 ,  H05K7 ,  H05K3

CPC classification number: H05K1/189 ,  H05K3/3447 ,  H05K7/023 ,  H05K2201/046 ,  H05K2201/09018 ,  H05K2201/09418 ,  H05K2201/10515

Abstract: Une pluralité de modules de composants de circuit (71) ayant la même dimension et la même forme sont empilés adjacents les uns aux autres avec leurs faces (72, 74) en contact pour former un assemblage de modules (40) se présentant sous la forme d'un solide prismatique ou cylindrique. Chaque module abrite un ou plusieurs composants de circuit électrique (110) et est pourvu, au niveau de portions de ses faces, de contacts électriques (84, 86) qui coopèrent avec des contacts situés de manière similaire sur les faces de modules adjacents afin d'interconnecter électriquement les composants de circuit. Cet assemblage de modules s'utilise avec une carte de circuits imprimés (50), souple et présentant sur l'une de ses faces un réseau de sites de contact (52) interconnectés sélectivement par des parcours imprimés (54). Des contacts électriques sur les surfaces périphériques des modules sont couplés avec les composants de circuit que ces derniers abritent, et s'engagent dans les sites de contact de la carte de circuits lorsque celle-ci est enroulée autour de l'assemblage de modules.

公开(公告)号：EP0238929A3

公开(公告)日：1988-12-21

申请号：EP87103376

申请日：1987-03-10

Applicant: International Business Machines Corporation

Inventor： Donson, William Arthur ,  Ellerson, James Vernon ,  Hammer, Richard Benjamin ,  Lafer, William ,  Snyder, Keith Alan

IPC: H01L21/48

CPC classification number: H05K3/0079 ,  H05K1/0284 ,  H05K3/064 ,  H05K3/1216 ,  H05K3/388 ,  H05K2201/09018 ,  H05K2203/0588 ,  H05K2203/0723 ,  H05K2203/0759

Abstract: A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material in a liquid form to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photo­resist material, and providing electrical conductive pattern on the substrate.

公开(公告)号：EP0065154A3

公开(公告)日：1984-03-28

申请号：EP82103672

申请日：1982-04-29

Applicant: KRONE GMBH

Inventor： BECKER, PETER

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/28 ,  H05K2201/057 ,  H05K2201/09018 ,  H05K2201/10651 ,  H05K2203/302

Abstract: Gegenstand der Erfindung ist eine entsprechend der Kontur des Einbaugerätes gebogen ausgebildete Leiterplat te (1) aus dünnem Basismaterial, deren elektronische Bau elemente (2) vorzugsweise längs einer Richtung parallel zu einer Biegeachse (3) ausgerichtet sind.
Zur Vermeidung von Rißbildungen beim Biegen ist die Leiterplatte (1) mit Lötstoplack überzogen.

公开(公告)号：EP3375256A1

公开(公告)日：2018-09-19

申请号：EP17810491.5

申请日：2017-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： KIM, Jung-min ,  SHIN, Ho-seong ,  JANG, Kyoung-hwan

IPC: H05B33/12 ,  H05B33/10 ,  B05C5/02 ,  B05C13/02 ,  H01L33/44

CPC classification number: H05B33/04 ,  H05B33/10 ,  H05B33/12 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/007 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

公开(公告)号：EP3374194A1

公开(公告)日：2018-09-19

申请号：EP16777820.8

申请日：2016-09-01

Applicant: Exatec, LLC.

Inventor： NELSON, Mark Kevin ,  SHULER, Stephen ,  SCHOUWENAAR, Richard

IPC: B41M5/00 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05B3/84 ,  B41J3/4073 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  B41M5/0023 ,  B41M5/0047 ,  B41M5/0064 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0212 ,  H05K1/0284 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10272 ,  H05K2203/013 ,  H05K2203/0139

Abstract: In an embodiment, a printing method for forming a conductive line on a plastic substrate for use in an automobile, comprises one or both of inkjet printing and screen printing the conductive line on the plastic substrate while the plastic substrate is fixed in a fixture of an automatic printing machine; the conductive mixture comprises a conductive paste; a solvent; and an adhesion agent; and wherein the conductive line is a busbar, a grid line, or an antenna line in the automobile.

公开(公告)号：EP3195705A2

公开(公告)日：2017-07-26

申请号：EP15816863.3

申请日：2015-09-18

Applicant: Hueck Folien GmbH

Inventor： SCHMIDEGG, Klaus ,  TRASSL, Stephan ,  TANDA, Mag. DI Andreas ,  RAMSAUER, Christoph ,  WEISSEL, Philipp

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0284 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/09018 ,  H05K2203/1545

Abstract: The invention relates to a method for producing a deformable printed-circuit substrate in the form of a laminate consisting of an adhesion promoter film (1), optionally an adhesive layer (2), a printed-circuit film substrate (3) and a purely metallic conductor track (4), the latter having a preferred thickness of the order of magnitude of 1000 atomic layers. The invention also relates to a deformable printed-circuit substrate (1-4). In the method according to the invention, the printed-circuit substrate (1-4) is shaped by means of a gaseous pressure medium, at a temperature above the glass transition temperature and below the melting temperature of the printed-circuit film substrate (3) being shaped, under a sudden, high gas pressure. Thanks to the invention, sharply deformed printed-circuit substrates, in particular freely or spherically shaped printed-circuit substrates can be produced, even with purely metallic conductor tracks. Optional back-moulding (9) and application of decorative layers (11) and/or coating layers (10) allow producing multifunctional, seamlessly and freely shaped plastic components with integrated electronic elements.

Abstract translation: 本发明涉及一种用于制造由粘合促进剂膜（1），可选的粘合剂层（2），印刷电路膜基底（3）和纯粹地 （4），后者具有1000个原子层数量级的优选厚度。 本发明还涉及可变形的印刷电路基板（1-4）。 在根据本发明的方法中，印刷电路基板（1-4）通过气压介质在高于玻璃化转变温度且低于印刷电路薄膜基板（3）的熔化温度的温度下成形 ）在突然的高气压下成形。 由于本发明，即使在纯金属导体轨道的情况下，也可以制造特别是自由或球形的印刷电路基板的变形很快的印刷电路基板。 可选的背部成型（9）以及装饰层（11）和/或涂层（10）的应用允许生产具有集成电子元件的多功能，无缝且自由形状的塑料部件。

公开(公告)号：EP3149769A1

公开(公告)日：2017-04-05

申请号：EP14893556.2

申请日：2014-05-28

Applicant: Intel Corporation

Inventor： HU, Chuan ,  ELSHERBINI, Adel A. ,  TOMITA, Yoshihiro ,  LIFF, Shawna

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/60

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于可弯曲和可拉伸装置的波浪互连以及相关联的技术和构造。 在一个实施例中，互连组件包括限定平面的柔性衬底和设置在柔性衬底上的波纹互连，并且被配置为沿与平面共面的第一方向布置集成电路（IC）器件的电信号， 互连件具有从垂直于第一方向并与该平面共面的第二方向的波状轮廓。 可以描述和/或要求保护其他实施例。

公开(公告)号：EP3001780A1

公开(公告)日：2016-03-30

申请号：EP15186438.6

申请日：2015-09-23

Applicant: Osram Sylvania Inc.

Inventor： GROSSMAN, Kenneth ,  SPEER, Richard S. ,  PEREYRA, Rodrigo M.

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0284 ,  F21K9/90 ,  H05K3/0014 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10106

Abstract: A method of manufacturing a curved component of a lamp or luminaire comprising forming a sheet segment into a curved portion after forming an electrically conductive trace on the sheet segment and after placing a plurality of LEDs on the sheet segment is described. A luminaire provided by the method of manufacturing is also described herein.

Abstract translation: 一种制造灯或灯具的弯曲部件的方法，包括在片段上形成导电迹线之后并且在片段上放置多个LED之后，将片段形成为弯曲部分。 本文还描述了通过制造方法提供的灯具。

公开(公告)号：EP1819963B1

公开(公告)日：2010-04-21

申请号：EP05799479.0

申请日：2005-10-24

Applicant: Panasonic Corporation

Inventor： MATSUI, Nobuyuki, c/o Panasonic Corp.Intel.Prop.Rights Op.Comp. ,  NAGAI, Hideo, c/o Panasonic Corp.Intel.Prop.Rights Op.Comp. ,  NISHIMOTO, Keiji, c/o Panasonic Corp.Intel.Prop.Rights Op. Comp. ,  OGATA, Toshifumi, c/o panasonic Corp.Intel.Prop. Rights Op. Comp.

IPC: F21V29/00 ,  F21V19/00 ,  H05K1/02 ,  G09F9/33 ,  F21Y101/02

CPC classification number: F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

公开(公告)号：EP2008021A4

公开(公告)日：2009-05-27

申请号：EP07719540

申请日：2007-04-16

Applicant: INTIER AUTOMOTIVE INC

Inventor： DIXON MARK E

IPC: F21V99/00 ,  B60Q3/00 ,  F21K99/00 ,  F21V7/10 ,  F21V23/00 ,  F21V29/00 ,  H01R12/50 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01R33/08 ,  F21K9/00 ,  F21V23/005 ,  F21V23/06 ,  F21Y2115/10 ,  H01R33/0827 ,  H01R33/0845 ,  H01R33/0863 ,  H01R33/945 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/118 ,  H05K3/326 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/302

Abstract: An illuminator (10) includes a circuit board (12) having a planar board portion (44) and a board portion non-planar to said planar board portion (44). The board portion non-planar to said planar board portion (44) defines one of a board interface (14) and a reflector (50). A method for manufacturing an illuminator (10) is also disclosed.

Abstract translation: 照明器（10）包括具有平面板部分（44）和与所述平面板部分（44）非平面的板部分的电路板（12）。 与所述平面板部分（44）不平面的板部分限定板接口（14）和反射器（50）中的一个。 还公开了一种制造照明器（10）的方法。