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    Integral edge connection of circuit cards
    22.
    发明公开
    Integral edge connection of circuit cards 失效
    积分器RandverbinderfürLeiterkarten。

    公开(公告)号：EP0497473A1

    公开(公告)日：1992-08-05

    申请号：EP92300399.0

    申请日：1992-01-17

    Applicant: International Business Machines Corporation

    Inventor： Beaman, Brian Samuel

    IPC: H05K3/40

    CPC classification number: H01R13/2414 ,  H01R12/714 ,  H01R43/007 ,  H05K1/0298 ,  H05K3/0017 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0397 ,  H05K2201/044 ,  H05K2201/0919 ,  H05K2201/10393 ,  Y10T29/49126

    Abstract: An integral elastomeric card edge connector provides shorter signal paths through the contact with reduced interference. The card edge contact allows high density interconnection between several layers of multi-layer circuit card without routing signal paths to the card surface. Elastomeric contact tab supports provide positive contact pressure and the necessary wipe action to ensure electrical contact. The process for forming the integral contacts begins with a standard multi-layer card which is then beveled, etched to expose the contact tabs, filled with elastomeric material and processed to expose the tabs supported by elastomeric columns. The connector may be used in card-on-board technologies or for the connection of multi-chip organic substrates to boards or to other substrates.

    Abstract translation: 整体弹性卡边缘连接器通过接触提供更短的信号路径，减少干扰。 卡片边缘接触允许多层电路卡之间的高密度互连，而无需路由到卡表面的信号路径。 弹性接触片支撑件提供正向接触压力和必要的擦拭动作，以确保电气接触。 用于形成整体接触的过程开始于标准的多层卡，然后对其进行斜切，蚀刻以暴露接触片，填充有弹性体材料并加工以暴露由弹性体柱支撑的翼片。 连接器可以用于板上卡技术或用于将多芯片有机基板连接到板或其它基板。

    Method of mounting a substrate structure to a circuit board
    23.
    发明公开
    Method of mounting a substrate structure to a circuit board 失效
    将基板结构安装到电路板的方法

    公开(公告)号：EP0276062A3

    公开(公告)日：1990-01-03

    申请号：EP88300153.9

    申请日：1988-01-08

    Applicant: TEKTRONIX, INC.

    Inventor： Berg, William E.

    IPC: H05K7/10

    CPC classification number: H05K7/1061 ,  H01L2224/48091 ,  H05K3/325 ,  H05K2201/10303 ,  H05K2201/10393 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2203/167 ,  Y10T29/49121 ,  Y10T29/49133 ,  H01L2924/00014

    Abstract: A substrate structure (10) having contact pads (14) is mounted to a circuit board (70) which has pads (74) of con­ductive material exposed at one main face of the board and has registration features (78) which are in predetermined positions relative to the contact pads of the circuit board. The substrate structure (10) is provided with leads (34) which are electrically con­nected to the contact pads (14) of the substrate struc­ture and project from the substrate structure in cantilever fashion. A registration element has a plate portion and also has registration features (78) which are distributed about the plate portion and are engageable with the registration features (76) of the circuit board, and when so engaged, maintain the registration element against movement parallel to the general plane of the circuit board. The substrate structure is attached to the plate por­tion of the registration element so that the leads are in predetermined positions relative to the registration features of the registration element. The registration features of the registration ele­ment are brought into engagement with the registra­tion features of the circuit board, and in this position of the registration element the leads of the substrate structure (34) overlie the contact pads (74) of the circuit board. A clamp member (90) maintains the leads in electrically conductive pressure contact with the contact pads of the circuit board.

    Mounting a hybrid circuit to a circuit board
    24.
    发明公开
    Mounting a hybrid circuit to a circuit board 失效
    在电路板上的混合电路的安装。

    公开(公告)号：EP0216447A2

    公开(公告)日：1987-04-01

    申请号：EP86304915.1

    申请日：1986-06-25

    Applicant: TEKTRONIX, INC.

    Inventor： Berg, William E.

    IPC: H05K7/10

    CPC classification number: H05K7/1053 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/325 ,  H05K2201/10393 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10727 ,  H01L2924/00014

    Abstract: A unitary electronic circuit element has an interconnect surface at which it is provided with contact pads and is mounted on a circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material supported by the dielectric material in mutually electrically insu­lated relationship. Each conductor run extends between a contact pad that is exposed at a first main face of the interconnect member and a termina­tion point that is exposed at a second main face of the interconnect member. The contact pads of the interconnect member correspond in their layout to that of the contact pads of the circuit board, and the termination points correspond in their layout to that of the contact pads of the electronic circuit element. The interconnect surface of the electronic circuit element and the second main face of the interconnect member are placed in mutually confronting relationship, and the circuit element is attached to the second main face of the inter­connect member by way of its interconnect surface, whereby electrically conductive contact is es­tablished between the contact pads of the circuit element and the corresponding termination points of the interconnect member. The circuit element is attached by way of its back face to a thermally conductive plate that has, at one main face, pres­sure pads that at least partially surround a cir­cuit element receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member touching the corre­ sponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect mem­ber in electrically conductive pressure contact with the corresponding contact pads of the circuit board.

    ELECTRIC CONNECTING PIECE AND LED LAMP USING SAME
    29.
    发明授权
    ELECTRIC CONNECTING PIECE AND LED LAMP USING SAME 有权

    公开(公告)号：EP2937628B1

    公开(公告)日：2018-05-23

    申请号：EP13865211.0

    申请日：2013-12-16

    Applicant: Leeleds Lighting (Xiamen) Co., Ltd.

    Inventor： WANG, Linhua ,  ZHU, Xiaolei ,  ZHOU, Lin ,  ZHAO, Han

    IPC: F21V23/00 ,  F21V23/06 ,  F21K9/23 ,  F21Y115/10

    CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

    Abstract: An electric connecting piece (30) and an LED lamp using the electric connecting piece (30) are provided. The electric connecting piece (30) is used for the electric connection between a light source substrate (20) and a driving board (40) of the LED lamp (100), and comprises an input terminal (32) and an output terminal (34). The LED lamp (100) comprises the driving board (40) and the light source substrate (20). The output terminal (34) is provided on the driving board (40) of the LED lamp (100), and the light source substrate (20) is provided with a fixing hole (22) corresponding to the input terminal (32). The input terminal (32) is fixed in the fixing hole (22) of the light source substrate (20) and is electrically connected with the light source substrate (20). The output terminal (34) comprises two contacts (342), and one end of each of the two contacts (342) is electrically connected with the driving board (40) respectively. The input terminal (32) comprises two connection heads which are respectively provided corresponding to the two contacts (342). One end of each of the two connection heads is electrically connected with the light source substrate (20) respectively. During assembling, the two contacts (342) of the output terminal (34) are respectively inserted into the two corresponding connection heads of the input terminal (32), and the two connection heads are elastically propped against the two contacts (342) respectively. The electric connecting piece (30) has the advantage of convenience in automatic assembling.

    AN IMPROVED METHOD AND APPARATUS
    30.
    发明公开
    AN IMPROVED METHOD AND APPARATUS 无效
    一种改进的方法和设备

    公开(公告)号：EP3302008A1

    公开(公告)日：2018-04-04

    申请号：EP16275144.0

    申请日：2016-09-30

    Applicant: BAE Systems PLC

    Inventor： The designation of the inventor has not yet been filed

    IPC: H05K1/03 ,  H05K3/32 ,  H05K3/36 ,  H05K5/06

    CPC classification number: H05K1/038 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2203/1327 ,  H05K2203/167

    Abstract: A method of electrically connecting an electronic textile (108, 110) to an electronic device (300), the electronic textile (108, 110) comprising an electrically insulating textile carrier (400) and one or more electrical conductor lines (402), the method comprising: positioning the electronic textile (108, 110) relative to the electronic device (300) such that each conductor line (402) is in contact with an electrical conductor (304) of the electronic device (300), thereby providing an assembly; and fixing a clamp member (500) to the assembly such that each conductor line (402) is sandwiched between the clamp member (500) and an electrical conductor (304) of the electronic device (300). The clamp member (500) may comprise one or more grooves (600), and fixing the clamp member (500) to the assembly may be such that each conductor line (402) is located within a respective groove (600).

    Abstract translation: 一种将电子纺织品（108,110）电连接到电子设备（300）的方法，所述电子纺织品（108,110）包括电绝缘纺织品载体（400）和一个或多个导电线（402），所述电子纺织品 方法，包括：相对于电子设备（300）定位电子纺织品（108,110），使得每条导线（402）与电子设备（300）的电导体（304）接触，由此提供组件 ; 以及将夹具构件（500）固定到所述组件，使得每个导体线（402）夹在所述夹具构件（500）和所述电子装置（300）的电导体（304）之间。 夹具构件500可以包括一个或多个凹槽600，并且将夹具构件500固定到组件可以使得每个导体线路402位于相应的凹槽600内。

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