STRUCTURE FOR INTERCONNECTING CONDUCTORS AND CONNECTING METHOD
    21.
    发明公开
    STRUCTURE FOR INTERCONNECTING CONDUCTORS AND CONNECTING METHOD 审中-公开
    维多利亚·维尔本·冯·维特

    公开(公告)号:EP1307076A1

    公开(公告)日:2003-05-02

    申请号:EP01949949.0

    申请日:2001-07-11

    申请人: Rohm Co., Ltd.

    发明人: NAKAMURA, Satoshi

    IPC分类号: H05K3/34 B23K35/26 H01R4/02

    摘要: A first conductor having a surface formed with an Au layer is connected, via a Zn-containing solder, to a second conductor which is conductive at least at a surface thereof. The first conductor may be, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), whereas the second conductor may be a terminal (20a, 21a) of an electronic component (20, 21) or a terminal plate (22). The first conductor is connected to the second conductor via an Au-Zn alloy layer which is formed as a result of the diffusion of Zn from the Zn-containing solder into the Au layer of the first conductor.

    摘要翻译: 具有形成有Au层的表面的第一导体经由含Zn焊料连接到至少在其表面导电的第二导体。 第一导体可以是例如构成电路板(1)上的布线图形的一部分的端子焊盘(11a,11b,11c),而第二导体可以是电子部件(1)的端子(20a,21a) 部件(20,21)或端子板(22)。 第一导体经由Au-Zn合金层连接到第二导体,Au-Zn合金层由于Zn从含Zn焊料扩散到第一导体的Au层而形成。

    DECORATIVE ARTICLE HAVING WHITE FILM AND PRODUCTION METHOD THEREFOR
    22.
    发明公开
    DECORATIVE ARTICLE HAVING WHITE FILM AND PRODUCTION METHOD THEREFOR 有权
    Dekorativer Gegenstand mitweißemÜberzug

    公开(公告)号:EP1295961A1

    公开(公告)日:2003-03-26

    申请号:EP01938693.7

    申请日:2001-06-15

    IPC分类号: C23C14/06 C23C28/02

    摘要: A personal ornament having a white coating layer comprises a base article made of a metal, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the base article. Another personal ornament having a white coating layer comprises a base article made of a nonferrous metal, an underlying plating layer formed on the surface of the base article, and a white-colored stainless steel coating layer formed by a dry plating process on at least a part of the surface of the underlying plating layer.
    A process for producing a personal ornament having a white outermost layer comprises steps of forming a base article of the personal ornament by machining a metal; washing and degreasing the surface of the base article; cleaning the base article by bombard cleaning in the dry plating apparatus; and forming a white-colored stainless steel coating layer on the base article surface by a dry plating process. Another process for producing a personal ornament having a white outermost layer comprises steps of forming a base article of the personal ornament from a nonferrous metal by machining; washing and degreasing the surface of the base article; forming on the surface of the base article an underlying plating layer by a wet plating process or a dry plating process; cleaning the surface of the underlying plating layer by bombard cleaning in a dry plating apparatus; and forming a white-colored stainless steel coating layer by a dry plating process on the surface of the underlying plating layer.
    The present invention provides a low-priced personal ornament which has a white-colored inexpensive stainless steel outermost coating layer having a long-term corrosion resistance, and also provides a process for producing the personal ornament.

    摘要翻译: 具有白色涂层的个人装饰品包括由金属制成的基底制品和通过干电镀工艺在基底制品的至少一部分表面上形成的白色不锈钢涂层。 具有白色涂层的另一个个人装饰品包括由有色金属制成的基底制品,在基底制品的表面上形成的底部镀层,以及通过干法电镀工艺形成的白色不锈钢涂层,至少在 底层镀层表面的一部分。 一种具有白色最外层的个人饰品的制造方法,其特征在于,包括以下步骤:通过机械加工金属形成个人装饰品的基底制品; 洗涤和脱脂基底制品的表面; 在干电镀设备中通过轰击清洗清洁基底物品; 并通过干电镀工艺在基底制品表面上形成白色不锈钢涂层。 用于生产具有白色最外层的个人饰品的另一种方法包括通过机械加工从有色金属形成个人饰品的基底制品的步骤; 洗涤和脱脂基底制品的表面; 通过湿式电镀工艺或干式电镀工艺在基底制品的表面上形成下面的镀层; 在干电镀设备中通过轰击清洗来清洁下面镀层的表面; 并通过干法电镀工艺在底层镀层的表面上形成白色不锈钢涂层。 本发明提供一种具有长期耐腐蚀性的白色廉价不锈钢最外涂层的低价个人装饰品,并且还提供了一种制造个人装饰品的方法。

    Article comprising creep-resistant and stress-reducing solder
    24.
    发明公开
    Article comprising creep-resistant and stress-reducing solder 审中-公开
    Gegenstand,der einkriechbeständigesund spannungsreduzierendes Lotenthält

    公开(公告)号:EP1153698A1

    公开(公告)日:2001-11-14

    申请号:EP00309571.8

    申请日:2000-10-30

    IPC分类号: B23K35/30 C22C5/02

    摘要: The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The invention uses a solder containing 82 to 85 wt.% Au, 12 to 14 wt.% Sn, and 3 to 4 wt.% Ga (optionally with up to 2 wt.% additional elements). The small amount of added Ga induces a significant depression in the liquidus temperatures of both Au and Sn, and thus a depressed melting point (about 27°C less than eutectic Au-Sn solder), and also provides an enhanced temperature-sensitivity of the solder's creep resistance.

    摘要翻译: 本发明涉及在典型工作温度下表现出高耐蠕变性和在形成的焊点中低应力的期望组合的焊料组合物的用途。 本发明使用包含82至85重量%的Au,12至14重量%的Sn和3至4重量%的Ga(任选具有至多2重量%的附加元素)的焊料。 少量添加的Ga在Au和Sn的液相线温度下引起明显的凹陷,因此熔点低(比共晶Au-Sn焊料低约27℃),并且还提供了增强的温度敏感性 焊料的抗蠕变性。

    Reflector
    25.
    发明公开
    Reflector 审中-公开
    反光

    公开(公告)号:EP1103758A2

    公开(公告)日:2001-05-30

    申请号:EP00810851.6

    申请日:2000-09-19

    发明人: Ueno, Takashi

    IPC分类号: F21V7/22

    摘要: The object of the invention is to provide a reflector in which a reduction in high reflection factor of Ag is restricted, a stable wheatherability can be attained in a continuous manner even if it is exposed in a severe environment of high temperature and high humidity and further a high practical effect with the connecting characteristic being effectively enforced can be attained and also a high reliability is provided. The alloy reflective film 3 made of AgPdCu alloy or AgPdTi alloy with Ag being applied as major component, with Pd being added in a range of 0.5 to 3.0wt%, with either Cu or Ti, for example, in Al, Au, Pt, Cu, Ta, Cr, Ti, Ni, Co, Si as the third element being added in a range of 0.1 to 3.0 wt% is formed on the substrate 2 in a predetermined film thickness (nm). As its pre-treatment, the organic ground film 8 is applied on the substrate 2 and the reflective film 3 is formed on the film to enforce effectively the connecting characteristic.

    摘要翻译: 本发明的目的是提供一种反射器,其中Ag的高反射系数的降低受到限制,即使暴露在高温高湿的恶劣环境中也能够连续地获得稳定的小麦生长能力 可以实现有效实施连接特性的高实用效果,并且还提供高可靠性。 Ag或AgPdTi合金制成的合金反射膜3以Ag作为主要成分,其中Pd以0.5-3.0wt%的范围添加,例如在Cu,Ti中添加Al,Au,Pt, 在基板2上以规定的膜厚(nm)形成Cu,Ta,Cr,Ti,Ni,Co,Si作为第三元素,添加量为0.1〜3.0重量%。 作为其预处理,将有机基底膜8施加在基底2上,并且在膜上形成反射膜3以有效地增强连接特性。