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    Mems gyroscope and fabrication method thereof
    31.
    发明公开
    Mems gyroscope and fabrication method thereof 审中-公开
    Mems-Kreisel und sein Herstellungsverfahren

    公开(公告)号：EP1434031A2

    公开(公告)日：2004-06-30

    申请号：EP03258036.7

    申请日：2003-12-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kang, Seok-jin ,  Lee, Moon-chul ,  Chung, Seok-whan ,  Jung, Kyu-dong ,  Hong,, Seog-woo

    IPC: G01C19/56 ,  G01P9/04

    CPC classification number: G01C19/5762 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053

    Abstract: A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.

    Abstract translation: 通过水平驱动操作的垂直MEMS陀螺仪包括：基板，固定在基板区域的上表面上的支撑层，浮动在基板上方的驱动结构，并且具有固定到支撑层上表面的部分和另一部分 与固定部分平行地，驱动结构具有能够在平行于基板的预定方向上振动的预定区域，在与驱动结构相同的平面上固定到驱动结构的检测结构，并且具有能够 相对于基板在垂直方向上振动，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测 检测结构在垂直方向的位移。

    GYROSCOPE AND FABRICATION METHOD THEREOF
    32.
    发明公开
    GYROSCOPE AND FABRICATION METHOD THEREOF 有权
    陀螺仪和方法生产同样

    公开(公告)号：EP1360144A1

    公开(公告)日：2003-11-12

    申请号：EP02711501.3

    申请日：2002-01-30

    Applicant: Intellimicrons Co., LTD. ,  Kim, Yong-Kweon

    Inventor： KIM, Yong-Kweon ,  KIM, Seong-Hyok

    IPC: B81C1/00 ,  G01C19/56

    CPC classification number: B81B3/0078 ,  B81B3/0062 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2203/04 ,  G01C19/5755

    Abstract: A gyroscope which comprises: a driving fixed electrode (26) being fixed; a driving displacement electrode (24) being opposite to the driving fixed electrode, and being able to be displaced in a first direction; an inertial mass (23) being connected to the driving displacement electrode (24), being displaced in the first direction according to the first directional displacement of the driving displacement electrode (24), and being displaced in a second direction when an angular rate is applied; a sensing displacement electrode (22) being connected to the inertial mass (23), and being able to be displaced in the second direction according to the second directional displacement of the inertial mass (23); and a sensing fixed electrode (25) being opposite to the sensing displacement electrode and being fixed. The driving displacement electrode (24) is supported by a folded spring (31) movable in the first direction, and the sensing displacement electrode is supported by a folded spring (32) movable in the second direction.

    A MEM GYROSCOPE AND A METHOD OF MAKING SAME
    34.
    发明公开
    A MEM GYROSCOPE AND A METHOD OF MAKING SAME 审中-公开
    MEM陀螺仪和方法生产同样

    公开(公告)号：EP1305256A2

    公开(公告)日：2003-05-02

    申请号：EP01959532.1

    申请日：2001-07-31

    Applicant: HRL LABORATORIES, LLC

    Inventor： KUBENA, Randall, L. ,  CHANG, David, T.

    IPC: B81B1/00

    CPC classification number: B81C1/0015 ,  B81B2201/0242 ,  B81C2201/014 ,  B81C2201/0191 ,  B81C2203/036 ,  G01C19/5656 ,  G01P15/0802 ,  G01P15/0894

    Abstract: A method of making a micro electro-mechanical gyroscope. A cantilevered beam structure, firstportions of side drive electrodes and a mating structure are defined on a first substrate or wafer;and at least one contact structure, second portions of the side drive electrodes and a matingstructure are defined on a second substrate or wafer, the mating structure on the second substrateor wafer being of a complementary shape to the mating structure on the first substrate or waferand the first and second portions of the side drive electrodes being of a complementary shape to each other. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures and one or the first and second portions of the side drive electrodes. The matingstructure of the first substrate is moved into a confronting relationship with the mating structureof the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer and alsobetween the first and second portions of the side drive electrodes to cause a bond to occurtherebetween. Then the first substrate or wafer is removed to free the cantilevered beam structurefor movement relative to the second substrate or wafer. The bonds are preferably eutectic bonds.

    VERFAHREN ZUR HERSTELLUNG EINER TORSIONSFEDER
    35.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINER TORSIONSFEDER 有权
    一种用于生产扭簧

    公开(公告)号：EP1198695A1

    公开(公告)日：2002-04-24

    申请号：EP00951413.4

    申请日：2000-07-20

    Applicant: LITEF GmbH

    Inventor： WIEMER, Maik ,  HILLER, Karla ,  BILLEP, Detlef ,  BRENG, Uwe ,  RYRKO, Bruno ,  HANDRICH, Eberhard

    IPC: G01C19/56 ,  G01P15/08

    CPC classification number: B81B3/0051 ,  B81B2201/0242 ,  B81C2201/0133 ,  G01C19/56 ,  G01P15/0888

    Abstract: The invention relates to a method for the production of a silicon torsion spring, whereby, for instance, the rotational speed in a microstructured torsion spring-mass system can be read. The invention aims at providing low torsional stiffness in comparison with a relatively high transversal stiffness in lateral and vertical direction. According to the invention, a wafer or wafer composite is used to produce a spring having a V-shaped cross section after masking by means of anisotropic wet-chemical etching, said spring extending preferably over the entire thickness of the wafer and being defined laterally by the [111] surfaces only. Two wafers or wafer composites thus prestructured are rotated by 180° and bonded to one another by aligning them in a mirror-inverted manner in such a way that the desired X-shaped cross section is obtained. One advantage provided by the invention is that the technology used in the production of the laterally and vertically rigid rotational spring is comparatively simple.

    ANTI-GETTER: EXPANDABLE POLYMER MICROSPHERES FOR MEMS DEVICES
    39.
    发明公开
    ANTI-GETTER: EXPANDABLE POLYMER MICROSPHERES FOR MEMS DEVICES 审中-公开

    公开(公告)号：EP3230200A4

    公开(公告)日：2018-07-04

    申请号：EP15866598

    申请日：2015-12-10

    Applicant: BOSCH GMBH ROBERT

    Inventor： SAMARAO ASHWIN K ,  O'BRIEN GARY ,  FEYH ANDO

    IPC: B81B7/02 ,  B81C1/00 ,  B81C3/00

    CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00285

    Abstract: A method of fabricating a MEMS device includes depositing an expandable material into a first recess of a cap wafer. The cap wafer includes a plurality of walls that surround and define the first recess and a second recess. The cap wafer is bonded to a MEMS wafer including a first MEMS device and a second MEMS device. The first MEMS device is encapsulated in the first recess, and the second MEMS device is encapsulated in the second recess. The expandable material is then heated to at least an activation temperature to cause the expandable material to expand after the first recess has been sealed. The expansion of the expandable material causes a reduction in volume of the first recess.

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