公开(公告)号：EP3030873A4

公开(公告)日：2017-07-05

申请号：EP14835387

申请日：2014-08-05

申请人： MC10 INC

发明人： GUPTA SANJAY ,  DOWLING KEVIN J ,  KACYVENSKI ISAIAH ,  CERUOLO MELISSA ,  IVES BARRY G ,  LI XIA

IPC分类号： G01K13/00 ,  A61B5/00 ,  F24F11/00 ,  G01K1/14 ,  H04L12/28

CPC分类号： G08B21/02 ,  A61B5/0004 ,  A61B5/0008 ,  A61B5/01 ,  A61B5/015 ,  A61B5/02055 ,  A61B5/053 ,  A61B5/0531 ,  A61B5/0537 ,  A61B5/1118 ,  A61B5/6833 ,  A61B5/7246 ,  A61B5/7282 ,  A61B5/74 ,  A61B5/746 ,  A61B2560/0242 ,  A61B2560/0412 ,  A61B2562/02 ,  A61B2562/0219 ,  A61B2562/0271 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/166 ,  G01K1/14 ,  G01K1/143 ,  G01K13/002 ,  G01K2213/00 ,  G08B3/10 ,  G08B17/06 ,  H04L12/2827

公开(公告)号：EP3111477A1

公开(公告)日：2017-01-04

申请号：EP15752579.1

申请日：2015-02-24

申请人： MC10, INC.

发明人： KEEN, Bryan ,  FENUCCIO, Jacob ,  CERUOLO, Melissa ,  GUPTA, Sanjay ,  WHITE, Ryan

IPC分类号： H01L27/04

CPC分类号： G01L1/16 ,  G01M5/0025 ,  G01M5/0041 ,  G01M5/0083 ,  G01R31/2855 ,  G08B7/06 ,  H05K7/06

摘要： A conformal electronic device with a deformation indicator is disclosed. The conformal electronic device includes electronics operable to measure one or more parameters of an object on which the conformal device is disposed on or proximate to, a conformal layer that encapsulates the electronics, and a deformation indicator configured to indicate a deformation threshold of the electronics, the conformal layer, the conformal device, or a combination thereof.

摘要翻译： 公开了具有变形指示器的保形电子装置。 保形电子设备包括可操作的电子装置，用于测量在其上将适形装置设置在其上或附近的对象的一个​​或多个参数，所述保形层封装电子器件;以及变形指示器，其被配置为指示电子设备的变形阈值， 保形层，保形装置或其组合。

公开(公告)号：EP3089686A2

公开(公告)日：2016-11-09

申请号：EP14876487.1

申请日：2014-12-19

申请人： MC10, INC.

发明人： GHAFFARI, Roozbeh ,  LEE, Stephen ,  WORK, John ,  WRIGHT, JR., John, A. ,  KLINKER, Lauren

IPC分类号： A61B18/12 ,  A61B18/18

CPC分类号： A61B5/14503 ,  A61B5/028 ,  A61B17/320068 ,  A61B18/02 ,  A61B18/1492 ,  A61B18/1815 ,  A61B18/20 ,  A61B2018/00434 ,  A61B2018/00577 ,  A61N1/3605 ,  A61N1/36057

摘要： Devices and methods are provided for performing procedure on tissue with flow monitoring using flow sensors. The devices include an elongated member, and at least one flow sensor disposed on the elongated member. The flow sensor includes at least one temperature sensor and at least one heating element having a cavity. At least a portion of the at least one temperature sensor is housed in the cavity. A temperature measurement of the temperature sensor provides an indication of the flow rate of a fluid proximate to the flow sensor.

公开(公告)号：EP2959755A4

公开(公告)日：2016-11-09

申请号：EP14754143

申请日：2014-02-24

申请人： MC10 INC

发明人： HSU YUNG-YU

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

摘要： Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：EP2959755A2

公开(公告)日：2015-12-30

申请号：EP14754143.7

申请日：2014-02-24

申请人： MC10, INC.

发明人： HSU, Yung-Yu

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

摘要： Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：EP2902293A3

公开(公告)日：2015-10-14

申请号：EP15157469.6

申请日：2009-11-12

申请人： Mc10, Inc.

发明人： Arora, William ,  Ghaffari, Roozbeth

IPC分类号： B60W40/00 ,  B60W40/06 ,  B60W40/12 ,  B60C23/00 ,  B60C23/04

CPC分类号： H05K1/189 ,  A61F2/958 ,  H01L23/4985 ,  H01L23/52 ,  H01L23/528 ,  H01L23/564 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K3/326 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00

摘要： A method, comprising:
attaching at least two isolated electronic components to an elastomeric substrate;
arranging an electrical interconnection between said components in a boustrophedonic pattern;
interconnecting the at least two isolated electronic components with said electrical interconnection; and
stretching the elastomeric substrate such that components separate relative to one another, wherein said electrical interconnection maintains substantially identical electrical performance characteristics that said electrical interconnection had in a pre- stretched form.

公开(公告)号：EP2712491A4

公开(公告)日：2015-09-09

申请号：EP12793583

申请日：2012-05-27

申请人： MC10 INC

发明人： GHAFFARI ROOZBEH ,  DE GRAFF BASSEL ,  ARORA WILLIAM ,  HU XIAOLONG ,  ELOLAMPI BRIAN

IPC分类号： H05K1/00

CPC分类号： H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

公开(公告)号：EP2786131A1

公开(公告)日：2014-10-08

申请号：EP12827709.2

申请日：2012-09-04

申请人： Mc10, Inc.

发明人： DICKSON, Alexander ,  CARBECK, Jeffrey ,  KACYVENSKI, Isaiah ,  SCHLATKA, Ben

IPC分类号： G01N27/00

CPC分类号： A61B5/0537 ,  A61B5/0002 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/024 ,  A61B5/0245 ,  A61B5/04 ,  A61B5/04012 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0531 ,  A61B5/0533 ,  A61B5/112 ,  A61B5/4266 ,  A61B5/441 ,  A61B5/442 ,  A61B5/443 ,  A61B5/6831 ,  A61B5/6832 ,  A61B5/6833 ,  A61B5/7282 ,  A61B8/4416 ,  A61B2562/16

摘要： Apparatus are provided for monitoring a condition of a tissue based on a measurement of an electrical property of the tissue. In an example, the electrical property of the tissue is performed using an apparatus disposed above the tissue, where the apparatus includes at least two conductive structures, each having a non-linear configuration, where the at least two conductive structures are disposed substantially parallel to each other. In another example, the electrical property of the tissue is performed using an apparatus disposed above the tissue, where the apparatus includes at least one inductor structure.

摘要翻译： 提供了用于基于组织的电性质的测量来监测组织的状况的装置。 在一个示例中，使用设置在组织上方的装置来执行组织的电特性，其中该装置包括至少两个导电结构，每个导电结构具有非线性构造，其中至少两个导电结构基本上平行于 彼此。 在另一示例中，组织的电性能是使用设置在组织上方的装置进行的，其中装置包括至少一个电感器结构。

公开(公告)号：EP2764335A1

公开(公告)日：2014-08-13

申请号：EP12835576.5

申请日：2012-09-28

申请人： Mc10, Inc.

发明人： RAFFERTY, Conor ,  HSU, Yung-Yu ,  SCHLATKA, Ben ,  CALLSEN, Gilman

IPC分类号： G01J1/42

CPC分类号： A61B5/441 ,  A61B5/002 ,  A61B5/0531 ,  A61B5/443 ,  A61B5/6833 ,  A61B2560/0209 ,  A61B2560/0214 ,  A61B2560/0242 ,  A61B2562/0214 ,  A61B2562/125 ,  A61B2562/164 ,  A61B2562/187 ,  G01J1/429 ,  H04Q9/00 ,  H04Q2209/47 ,  H04Q2209/84

摘要： Apparatus are provided for monitoring a condition of a surface based on a measurement of a property of the surface using a sensor. In an example, the property is performed using an apparatus disposed above the tissue, where the apparatus includes at least one coil structure formed from a conductive material, at least one other component, and at least one cross-link structure physically coupling a portion of the at least one coil structure to a portion of the at least one other component, the at least one cross-link structure being formed from a flexible material. The at least one other component can be a sensor component or a processor unit.

公开(公告)号：EP2712491A2

公开(公告)日：2014-04-02

申请号：EP12793583.1

申请日：2012-05-27

申请人： Mc10, Inc.

发明人： GHAFFARI, Roozbeh ,  DE GRAFF, Bassel ,  ARORA, William ,  HU, Xiaolong ,  ELOLAMPI, Brian

IPC分类号： H05K1/00

CPC分类号： H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

摘要： Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.