公开(公告)号：EP2302083A4

公开(公告)日：2012-03-07

申请号：EP08810074

申请日：2008-08-29

Applicant: NIPPON JOINT CO LTD

Inventor： ISHIKAWA HISAO ,  YOKOYAMA MASANORI

IPC: C22B25/08 ,  B23K1/00 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2201/42 ,  B23K2203/12 ,  C22B25/08 ,  H05K3/3468

公开(公告)号：EP2416632A1

公开(公告)日：2012-02-08

申请号：EP10178052.6

申请日：2010-09-21

Applicant: Subtron Technology Co., Ltd.

Inventor： Huang, Tzu-Wei

IPC: H05K3/30 ,  H01L23/48

CPC classification number: H05K3/4682 ,  B23K11/11 ,  B23K2201/42 ,  B32B37/0084 ,  B32B37/02 ,  B32B37/04 ,  B32B38/04 ,  B32B38/10 ,  B32B2038/047 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2457/00 ,  B32B2457/08 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/46 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/09918 ,  H05K2203/1536 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract translation: 电路基板的制造方法包括以下步骤。 两个金属层的周边被粘合以形成密封区域。 在两个金属层上形成两个绝缘层。 包括上，下导电层的两个形成在两个绝缘层上。 然后，将两个绝缘层和两个导电层层叠，使得彼此接合的两个金属层嵌入在两个绝缘层之间。 去除两个绝缘层的一部分和两个导电层的一部分以形成暴露两个金属层的多个盲孔。 在盲孔和剩余的两个导电层上形成导电材料。 两个金属层的密封区域被分离以形成两个分开的电路基板。

公开(公告)号：EP2082630B1

公开(公告)日：2012-01-25

申请号：EP07830129.8

申请日：2007-10-12

Applicant: Showa Denko K.K.

Inventor： SHOJI, Takashi ,  SAKAI, Takekazu

IPC: H05K3/34 ,  B23K3/06

CPC classification number: H05K3/3484 ,  B23K3/0638 ,  B23K2201/42 ,  H05K2203/0126 ,  H05K2203/124

Abstract: A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.

Abstract translation: 一种在印刷线路板上的导电电路的表面上形成焊料层的方法包括：将含有焊料粉末的浆料排放到表面上并且加热衬底。 浆液通过用于浆液的罐中的压力排出。 在该方法中使用的排出装置中，用于储存浆料的罐设置有用于浆料的排出管（2）和用于调节罐中的压力的​​气体或溶剂的输送管（1） 。 在这种装置中，可以使用一个普通的管子来从罐中排出浆液并将浆液输送到罐中，并且可以使用一个共同的管将气体输送到罐中并从罐中抽吸气体。

公开(公告)号：EP2384254A2

公开(公告)日：2011-11-09

申请号：EP09831484.2

申请日：2009-12-08

Applicant: Werthschützky, Roland

Inventor： MEISS, Thorsten ,  ROSSNER, Tim

IPC: B23K20/00 ,  H01R43/02 ,  H01R43/28 ,  H02G1/14 ,  H01L21/60

CPC classification number: B23K20/004 ,  B23K2201/42 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention makes it possible for electrical wires (100) to be used for the contacting of components preferably on a micro scale (104). Growing metallic microdepositions (102) on cut surfaces of microcables (100) has the effect of creating a contact region which make it easier for a contact promoter that allows ultrasonic bonding to be provided in a metered amount and applied, has a defined size of the electrically conductive area and allows the contacting of very stably insulated wires (100). The method can be favourably used for multiple repeats and for series.

Abstract translation: 本发明允许使用电线优选微部件的接触。 通过在微电缆的切口表面上生长的金属微沉积，产生一个接触区域，这简化的接触辅助的给药和应用程序并允许超声波结合，其包括限定的导电区域的大小，并允许非常稳定绝缘电线的接触。 此方法在拼板方式和串联中的应用是便宜的。

公开(公告)号：EP2275224A4

公开(公告)日：2011-11-09

申请号：EP09734301

申请日：2009-04-23

Applicant: SENJU METAL INDUSTRY CO

Inventor： KAWAMATA YUJI ,  UESHIMA MINORU ,  KANG MIN ,  NAKAGAWA KAYAKO ,  KOKUBU YASUAKI

IPC: B23K35/26 ,  B23K1/00 ,  B23K1/20 ,  B23K35/02 ,  B23K35/362 ,  B23K101/42 ,  C22C13/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/488 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2201/42 ,  C22C13/02 ,  H01L23/488 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3484 ,  H01L2924/00

公开(公告)号：EP2022590B1

公开(公告)日：2011-09-14

申请号：EP07740811.0

申请日：2007-04-02

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： ZEN, Mitsuo ,  ICHIKAWA, Hirokazu ,  OZAWA, Satoshi

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K3/0653 ,  B23K1/0016 ,  B23K1/085 ,  B23K2201/42 ,  H05K3/3468

Abstract: [PROBLEMS] Conventional jet solder baths using screw pumps have a problem that molten solder jetted from a jet nozzle pulsates up and down. The pulsation in the screw pump is due to a reverse flow caused by a wide gap between the screw pump and the casing. One possible solution for this problem is to narrow the gap; however, doing so causes contact between the screw pump and the casing when the screw pump is eccentric. [MEANS FOR SOLVING PROBLEMS] In the jet solder bath of the invention, the diameter of an inflow hole at the lower part of a casing is set smaller than the diameter of a screw pump to prevent a back flow even if the gap between the screw pump and the casing is large. Also, a diverging guide wall is provided at an outflow opening of the casing to stabilize the flow of solder.

Abstract translation: 常见的使用螺杆泵的喷射焊料浴具有从喷嘴喷射的熔融焊料上下跳动的问题。 螺杆泵中的脉动是由于螺杆泵与壳体之间的宽间隙引起的逆流造成的。 这个问题的一个可能的解决办法是缩小差距; 然而，当螺旋泵偏心时，这样做会导致螺杆泵与壳体之间的接触。 在本发明的喷射焊料槽中，壳体下部的流入孔的直径被设定为小于螺杆泵的直径，以防止回流，即使螺杆之间的间隙 泵和外壳很大。 而且，在壳体的流出开口处设置分叉引导壁以稳定焊料的流动。

公开(公告)号：EP2308632A1

公开(公告)日：2011-04-13

申请号：EP10008336.9

申请日：2010-08-10

Applicant: Linde Aktiengesellschaft

Inventor： Laumen, Christoph ,  Hiew, Pang Ling

IPC: B23K20/00 ,  B23K35/38 ,  C01B3/02 ,  C01B3/50 ,  C01B21/02 ,  C01B21/04 ,  H01L21/00 ,  H01L21/60

CPC classification number: B23K20/004 ,  B23K35/38 ,  B23K2201/42 ,  C01B3/042 ,  C01B3/047 ,  C01B3/24 ,  C01B3/34 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/78 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  Y02E60/364 ,  H01L2924/01001 ,  H01L2924/00

Abstract: The present invention relates to a device for wire bonding comprising a guidance for a bond wire and a melt inducing device for melting the surface of a definite region of the bond wire surface, whereby the bond wire guidance is adapted to guide the definite region of the bond wire into a bonding area (1) and connect it to at least one bond pad, whereby the bonding area (1) comprises a process gas inlet (3), wherein the process gas inlet (3) is connected to an on-site gas generator (5) which generates the process gas. In addition, the present invention relates to a method of wire bonding comprising the steps of: connecting a definite region of a guided bond wire to a bond pad, whereby the surface of the definite region is previously melted and the whole process takes place within a bonding area (1), which contains a process gas, which is led into the bonding area prior or during the bonding process, wherein at least a part of the process gas is generated by an on-site gas generator (5).

Abstract translation: 导线接合装置技术领域本发明涉及一种用于引线接合的装置，其包括用于接合线的引导和用于熔化接合线表面的确定区域的表面的熔体引导装置，由此，接合线引导适于引导接合线的确定区域 将接合线连接到接合区域（1）并将其连接到至少一个接合焊盘，由此接合区域（1）包括工艺气体入口（3），其中工艺气体入口（3）连接到现场 气体发生器（5），其产生处理气体。 另外，本发明涉及一种引线接合方法，包括以下步骤：将引导接合线的确定区域连接到接合焊盘，由此预定区域的熔融表面，并且整个过程发生在 接合区域（1），其包含处理气体，其在接合过程之前或期间被引入接合区域，其中至少一部分工艺气体由现场气体发生器（5）产生。

公开(公告)号：EP2302083A1

公开(公告)日：2011-03-30

申请号：EP08810074.8

申请日：2008-08-29

Applicant: Nippon Joint Co., Ltd.

Inventor： ISHIKAWA, Hisao ,  YOKOYAMA, Masanori

IPC: C22B25/08 ,  B23K1/08

CPC classification number: B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2201/42 ,  B23K2203/12 ,  C22B25/08 ,  H05K3/3468

Abstract: A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350°C containing 1 to 80 weight% of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid. The mixed solution is introduced into a reservoir of the organic fatty acid solution, and the purified molten tin solution or molten solder alloy liquid separated according to the specific gravity difference in the reservoir of the organic fatty acid solution is returned from the bottom of the organic fatty acid solution reservoir to the reservoir of the molten tin or molten solder liquid by a pump for circulation use. By means of this, copper is prevented from accumulating in the molten tin or molten solder liquid, and thus it is possible to continuously perform a stable soldering process for a long term.

Abstract translation: 通过将喷射状态的熔融锡液体或熔融焊料合金液体喷射到电子部件的铜表面上来形成锡或焊料合金膜。 将溢出的熔融锡或熔融的焊料合金液体输送到搅拌器。 然后，在溢出的熔融锡或熔融的焊料合金液中混合的铜酸盐等通过在与180℃的温度下与溶液接触的熔融锡或熔融焊料合金液体进行剧烈搅拌和混合而被吸入有机脂肪酸溶液 350℃，含有1至80重量％的具有12至20个碳数的有机脂肪酸，其在搅拌器中循环以净化溢出的熔融锡或熔融的焊料合金液体。 将混合溶液引入有机脂肪酸溶液的储存器中，并且根据有机脂肪酸溶液的储存器中的比重差分离的纯化的熔融锡溶液或熔融焊料合金液体从有机脂肪酸溶液的底部返回 通过用于循环使用的泵将脂肪酸溶液储存在熔融锡或熔融焊料液体的储存器中。 借此，防止了铜在熔融锡或熔融焊料液中积聚，从而可以长期地连续进行稳定的焊接工艺。

公开(公告)号：EP2189235A1

公开(公告)日：2010-05-26

申请号：EP09014522.8

申请日：2009-11-20

Applicant: ASM Assembly Automation Ltd.

Inventor： Cheng, Chi Wah ,  Mak, Tim Wai, Tony ,  Ng, Hon Kam, Boris

IPC: B23K20/00 ,  B23K20/10 ,  H01L21/00 ,  H01L21/60

CPC classification number: B23K20/004 ,  B23K20/106 ,  B23K2201/42 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/7855 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bonding apparatus (10) for bonding a length of wire comprises a first module (14) which is drivable along a linear axis towards and away from a bonding point and a second module (16) slidably mounted to the first module (14). A wire cutter (36) is mounted to the first module (14) and a bonding tool (32) is mounted to the second module (16). A coupling mechanism is operative to lock the second module (16) in fixed relative position to the first module (14), and to unlock the second module (16) from its fixed relative position to the first module (14) so that the second module (16) is slidable relative to the first module (14) in directions parallel to the linear axis.

Abstract translation: 对于接合线的长度的接合装置（10）包括第一模块（14），所有这些是沿着线性轴线朝向和从接合点和第二模块（16）可滑动地安装到所述第一模块（14）远离驱动。 电线切割器（36）被安装到所述第一模块（14）和一个接合工具（32）被安装到所述第二模块（16）。 的连接机构可操作以在固定的相对位置的第二模块（16）锁定到所述第一模块（14），并从它的固定的相对位置的第二模块（16）解锁所述第一模块（14）象在第二 模块（16）是可相对滑动，以在方向上的第一模块（14）平行于所述线性轴。

公开(公告)号：EP2151148A2

公开(公告)日：2010-02-10

申请号：EP08735271.2

申请日：2008-04-16

Applicant: Häusermann GmbH

Inventor： JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC: H05K3/00 ,  H01L23/13 ,  B23K20/00 ,  G06K19/077 ,  H01L25/065

CPC classification number: B23K20/10 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10689 ,  H05K2203/0285 ,  Y02P70/611

Abstract: The invention relates to a method for producing a circuit board (1) having at least one inner layer (4, 5, 6, 7) and at least one cavity (10) in at least one of the two surfaces for receiving at least one first electronic component (13), the cavity being covered toward the top at least partially by a second component (19) soldered in place, and the first component being connected in the cavity to at least two electrical contacts (14, 15) having corresponding electrical contacts (11, 12) of an inner layer (6) of the circuit board, said electrical contacts being produced by a non-thermal contacting method.

Abstract translation: 本发明涉及一种用于制造电路板（1）的方法，所述电路板（1）在至少一个所述两个表面中具有至少一个内层（4,5,6,7）和至少一个空腔（10），用于接收至少一个 第一电子部件（13），所述空腔至少部分地由焊接在适当位置的第二部件（19）覆盖，并且所述第一部件在所述空腔中连接到至少两个电触点（14,15），所述至少两个电触点具有对应的 电路板的内层（6）的电触点（11,12），所述电触点通过非热接触方法产生。