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    CMUT DEVICE MANUFACTURING METHOD, CMUT DEVICE AND APPARATUS
    41.
    发明公开
    CMUT DEVICE MANUFACTURING METHOD, CMUT DEVICE AND APPARATUS 审中-公开
    PROCESS FOR CMUT设备，CMUT设备和仪器

    公开(公告)号：EP3049194A1

    公开(公告)日：2016-08-03

    申请号：EP14766694.5

    申请日：2014-09-15

    申请人： Koninklijke Philips N.V.

    发明人： DIRKSEN, Peter ,  MULDER, Marcel ,  LEEUWESTEIN, Adriaan

    IPC分类号： B06B1/02

    CPC分类号： B06B1/0292 ,  B81B3/0021 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C2201/0109 ,  B81C2201/013 ,  H02N1/006

    摘要： Disclosed is a method of manufacturing a capacitive micro-machined ultrasonic transducer (CMUT) device comprising a first electrode (112) on a substrate (110) and a second electrode (122) embedded in an electrically insulating membrane, the first electrode and the membrane being separated by a cavity (130) formed by the removal of a sacrificial material (116) in between the first electrode and the membrane, the method comprising forming a membrane portion (22) on the second electrode and a further membrane portion (24) extending from the membrane portion towards the substrate alongside the sacrificial material, wherein the respective thicknesses the membrane portion and the further membrane portion exceed the thickness of the sacrificial material prior to forming said cavity. A CMUT device manufactured in accordance with this method and an apparatus comprising such a CMUT device are also disclosed.

    THIN BACK GLASS INTERCONNECT
    45.
    发明公开
    THIN BACK GLASS INTERCONNECT 审中-公开
    薄壁背面玻璃CONNECTION

    公开(公告)号：EP2785634A1

    公开(公告)日：2014-10-08

    申请号：EP12816161.9

    申请日：2012-11-29

    申请人： Qualcomm Mems Technologies, Inc.

    发明人： SHENOY, Ravindra V.

    IPC分类号： B81C1/00

    CPC分类号： B81C1/00047 ,  B81B2203/0315 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2203/0127

    摘要： This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (MEMS) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more MEMS devices on the device substrate. The cover glass can include one or more spin-on glass layers and electrically conductive routing and interconnects. The package can include a narrow seal surrounding the one or more encapsulated MEMS devices.

    VERFAHREN ZUR HERSTELLUNG EINER MIKROFLUIDISCHEN VORRICHTUNG
    47.
    发明公开
    VERFAHREN ZUR HERSTELLUNG EINER MIKROFLUIDISCHEN VORRICHTUNG 有权
    制造方法的微流体装置

    公开(公告)号：EP2547618A2

    公开(公告)日：2013-01-23

    申请号：EP11700456.4

    申请日：2011-01-21

    申请人： Robert Bosch GmbH

    发明人： SCHMIDT, Manuela

    IPC分类号： B81C3/00 ,  B01L3/00

    CPC分类号： B29C59/021 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/123 ,  B01L2300/163 ,  B81B2201/058 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C3/001 ,  Y10T137/85938

    摘要： The present invention relates to a method for producing a microfluidic device, comprising the following method steps: a) arranging a thermoplastic elastomeric film (1) between a base substrate (2) and a cover substrate (3), wherein at least one of the substrates (2, 3) has at least one depression (4, 5) for forming a microfluidic chamber having a depression opening (4a, 5a) on the side (2a, 3a) of the substrate (2, 3) facing the elastomeric film (1), b) applying pressing power to the arrangement such that the elastomeric film (1) is compressed between the base substrate (2) and the cover substrate (3), in which process the thickness (d
    0 ) of the elastomeric film (1) is reduced, c) forming, by means of laser beam welding, at least one weld joining the thermoplastic elastomeric film (1), the base substrate (2) and the cover substrate (3), and d) removing the pressing power, in order to prevent the formation of capillaries between the base substrate (2) and the cover substrate (3).

    Sacrificial layers made from aerogel for manufacturing MEMS devices
    50.
    发明公开
    Sacrificial layers made from aerogel for manufacturing MEMS devices 有权
    Herstellung von MEMS-Vorrichtungen，Opferschichten aus Airgelfürdie Herstellung von MEMS-Vorrichtungen

    公开(公告)号：EP2450309A2

    公开(公告)日：2012-05-09

    申请号：EP11187357.6

    申请日：2011-10-31

    申请人： Honeywell International Inc.

    发明人： Detry, James F.

    IPC分类号： B81C1/00

    CPC分类号： B81C1/00047 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C2201/0109

    摘要： Systems and methods for processing sacrificial layers in MEMS device fabrication are provided. In one embodiment, a method comprises: applying a patterned layer of Aerogel material onto a substrate to form an Aerogel sacrificial layer; applying at least one non-sacrificial silicon layer over the Aerogel sacrificial layer, wherein the non-sacrificial silicon layer is coupled to the substrate through one or more gaps provided in the patterned layer of Aerogel material; and removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid.

    摘要翻译： 提供了用于在MEMS器件制造中处理牺牲层的系统和方法。 在一个实施例中，一种方法包括：将图案化的气凝胶材料层施加到基底上以形成气凝胶牺牲层; 在所述气凝胶牺牲层上施加至少一个非牺牲硅层，其中所述非牺牲硅层通过设置在所述图案化的气凝胶材料层中的一个或多个间隙耦合到所述衬底; 并通过将气凝胶牺牲层暴露于去除液体来除去气凝胶牺牲层。