公开(公告)号：EP1783855A4

公开(公告)日：2007-10-03

申请号：EP05766369

申请日：2005-07-25

申请人： MURATA MANUFACTURING CO

发明人： MUKAIYAMA K ,  MIKAMI S ,  ISHIKAWA Y

IPC分类号： H01P1/203 ,  H01P5/02 ,  H01P7/08

CPC分类号： H01P1/2016 ,  H01P5/02 ,  H05K1/0239 ,  H05K1/142

摘要： A slot line (1) is constituted of a slot (4) formed in a surface electrode (3) of a dielectric substrate (2) and two slot lines (1) are arranged with a gap (5) between them in such a manner that the surface electrodes (3) are separated from each other. A slot resonator (6) having an open end on the gap (5) side is provided on the forward end side of each slot line (1) and these slot resonators (6) are arranged to be coupled with each other. Furthermore, each surface electrode (3) is provided with a slot tab (8) branched from the gap (5). Consequently, leakage of high frequency signals through the gap (5) can be suppressed using the slot tab (8).

公开(公告)号：EP1079357A4

公开(公告)日：2007-07-04

申请号：EP00904058

申请日：2000-02-21

申请人： TOSHIBA MATSUSHITA DISPLAY TEC

发明人： KAWASAKI KIYOHIRO

IPC分类号： G02F1/13 ,  G09F9/00 ,  G02F1/1345 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC分类号： H05K1/182 ,  G02F1/13452 ,  H05K1/142 ,  H05K3/368

摘要： A display panel capable of supplying necessary signals and a power supply, at a low resistance, to a semiconductor integrated circuit chip mounted on the display panel, wherein a supply of electric signals to the terminal electrodes of scanning lines and signal lines is performed by mounting a driving integrated circuit chip directly on the terminal electrodes disposed on an active substrate, and a connection of electricity to the driving integrated circuit chip is performed by mounting a printed circuit board, in which an opening part larger in outside diameter than the integrated circuit chip and a wiring path are formed at and around the mounting position of the driving integrated circuit chip which is mounted on the active substrate at portions outside the image display area.

摘要翻译： 一种显示面板，能够以低电阻向安装在显示面板上的半导体集成电路芯片提供必要的信号和电源，其中通过安装向扫描线和信号线的端子电极供应电信号 直接在设置在有源基板上的端子电极上的驱动集成电路芯片以及与驱动集成电路芯片的电连接通过安装印刷电路板来执行，其中外部直径大于集成电路芯片的开口部分 以及布线路径形成在安装在有源基板上的驱动集成电路芯片的位于图像显示区域外部的安装位置的周围。

公开(公告)号：EP1771318A1

公开(公告)日：2007-04-11

申请号：EP05739883.6

申请日：2005-04-29

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： LOIBL, Josef ,  SMIRRA, Karl

IPC分类号： B60R16/02 ,  H05K5/00 ,  H01R13/52

CPC分类号： H05K1/147 ,  F16H61/0006 ,  H01L2224/05554 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01R12/59 ,  H01R13/5202 ,  H05K1/142 ,  H05K3/0061 ,  H05K5/0082 ,  H05K2201/09745 ,  H05K2201/0999 ,  H05K2203/049 ,  H05K2203/1147

摘要： The invention relates to a control device and, for the first time, advantageously permits a number of individual partially flexible printed circuit boards (20a, 20b, ) to be arranged in a manner that makes it possible to optimally disentangle signal and current paths while simultaneously reducing the investment in expensive flexible surfaces (20) to a minimum. The invention helps in saving on flexible surfaces (20) and to design flexible component parts in order to make an optimal utilization possible and so no waste results. The individual partially flexible printed circuit boards (20a, 20b, ) are preferably laminated on an aluminum base plate (10). The edge areas (25) of the partially flexible printed circuit board (20a, 2b, ) are formed by appropriate measures whereby obtaining a reliable sealing by means of a molded seal. The invention is suited for mechatronic control units, particularly for control devices for mounting in a transmission or engine of a motor vehicle.

公开(公告)号：EP1760516A1

公开(公告)日：2007-03-07

申请号：EP06018692.1

申请日：2006-09-06

申请人： SHARP KABUSHIKI KAISHA

发明人： Chikazawa, Hideyuki ,  Moriyasu, Mitsuhiro

IPC分类号： G02F1/13357 ,  G02F1/1333 ,  G02F1/13

CPC分类号： H05K1/0266 ,  G02F1/13336 ,  G02F1/133603 ,  G02F2001/133354 ,  H05K1/142 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2203/168

摘要： [PROBLEMS]
To prevent mistake of fitting position and fitting direction of each substrate when a plurality of substrates is fitted in a base member.
[MEANS FOR SOLVING PROBLEMS]
Backlight unit X in a LCD device comprises such as a plurality of LED substrates 10 respectively mounting a plurality of LED elements 11 for illuminating each division multi-divided from the entire area of a LCD panel, and Chassis 1 as a base member in which LED substrates 10 are aligned and fitted, wherein Fitting position distinguishing mark 12 indicating a designed (qualified) fitting position of a relevant LED substrate 10 in Chassis 1 is recorded on each of a plurality of LED substrates 10. Fitting position distinguishing mark 12 is the mark graphically displaying the area to be covered by a relevant LED substrate 10 in the entire Chassis 1 when the LED substrate 10 is fitted in Chassis 1 as designed. And on every LED substrate adjusted in a designed fitting direction relative to Chassis 1, Fitting position distinguishing mark 12 is recorded in an area which is nearly the same area but other than the center nor vicinity thereof in LED substrate 10.

摘要翻译： [问题]为了防止在将多个基板安装在基部构件中时，各基板的嵌合位置和嵌合方向错误。 解决问题的手段LCD装置中的背光单元X包括多个LED基板10，其分别安装多个LED元件11，用于照亮从LCD面板的整个区域分割的各个分区，并且底盘1作为 其中LED基板10被对准并配合的基座部件，其中指示在底盘1中的相关LED基板10的设计（合格）装配位置的装配位置识别标记12被记录在多个LED基板10中的每一个上。配合位置 区别标记12是当LED基板10按照设计装配在底盘1中时，在整个底盘1中以图形方式显示由相关的LED基板10覆盖的区域的标记。 并且在相对于底盘1在设计的配合方向上调整的每个LED基板上，将配合位置识别标记12记录在LED基板10中几乎相同的区域但不同于其中心或其附近的区域中。

公开(公告)号：EP1503452B1

公开(公告)日：2007-01-10

申请号：EP04017892.3

申请日：2004-07-28

申请人： JAPAN ELECTRONICS INDUSTRY LTD. ,  OSAKA PREFECTURE

发明人： Miyazaki, Nagao, c/o Japan Electronics ind. Ltd. ,  Suzuki, Yoshihiko

IPC分类号： H01R4/04 ,  G01L5/00

CPC分类号： H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

公开(公告)号：EP0977298B1

公开(公告)日：2006-10-18

申请号：EP99114940.2

申请日：1999-07-30

申请人： KYOCERA CORPORATION

发明人： Sawa, Yoshinobu, c/o Kyocera Corporation ,  Koriyama, Shinichi, c/o Kyocera Corporation ,  Kitazawa, Kenji, c/o Kyocera Corporation ,  Minamiue, Hidehiro, c/o Kyocera Corporation

IPC分类号： H01P1/04

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/1053 ,  H05K2201/10727 ,  H05K2203/1572 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

公开(公告)号：EP1269584B1

公开(公告)日：2006-05-31

申请号：EP01921001.2

申请日：2001-03-30

申请人： Jenbacher Aktiengesellschaft

发明人： KRAUS, Markus ,  VIRCHOW, Florian

IPC分类号： H01R25/16 ,  B60R16/02 ,  H02G3/04 ,  H05K1/14

CPC分类号： H01R25/16 ,  H05K1/142

摘要： The invention relates to a channel-shaped connection device for electrical lines, especially signal and ignition lines, of internal combustion engines. At least one support element (2) is provided for preferably pre-assembled electrical lines (3) and components (7) and can be inserted, preferably pushed into receiving elements (4) of the channel-shaped connection device (1).

公开(公告)号：EP1601053A1

公开(公告)日：2005-11-30

申请号：EP05010152.6

申请日：2005-05-10

申请人： NITTO DENKO CORPORATION

发明人： Ooyabu, Yasunari

IPC分类号： H01R12/04

CPC分类号： H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

摘要： In order to provide a wired circuit board in which electrical continuity inspection can be omitted and a connection structure of the wired circuit board, in connection between a first wired circuit board 1 and a second wired circuit board 2, a first connection terminal 13 and a second connection terminal 14 are abutted against each other in the direction in which they are opposed along the respective longitudinal direction of the wired circuit boards, and are arranged in line with each other, and a solder bump 15 is provided so as to continuously extend over surfaces of the first connection terminal 13 and the second connection terminal 14. Consequently, the solder bump 15 is not interposed between opposed surfaces of the first connection terminal 13 and the second connection terminal 14, thereby allowing electrical connection by the solder bump 15 between the first connection terminal 13 and the second connection terminal 14 to be confirmed from the appearance by visual observation.

摘要翻译： 为了提供可以省略电连续性检查的布线电路板以及布线电路板在第一布线电路板1和第二布线电路板2之间的连接结构中的第一连接端子13和 第二连接端子14沿着与布线电路板的纵向方向相对的方向彼此抵接，并且彼此排成一列，并且设置焊料凸块15，以连续地延伸越过 第一连接端子13和第二连接端子14的表面。因此，焊料凸块15不插入在第一连接端子13和第二连接端子14的相对表面之间，从而允许焊料凸块15在 第一连接端子13和第二连接端子14通过目视观察从外观确认。

公开(公告)号：EP1192841B1

公开(公告)日：2003-07-09

申请号：EP00935161.0

申请日：2000-05-31

申请人： TYCO Electronics Logistics AG

发明人： FRISCH, Michael

IPC分类号： H05K1/14 ,  H05K1/18 ,  H01L25/16

CPC分类号： H01L25/162 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/142 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an intelligent power module. The power unit and the logic unit of the module are built up on different substrates. The printed circuit (5) of the logic unit is provided with a recess (6) in which the power substrate (2) is located and electrically connected to the logical unit via wire bonding techniques (7).

公开(公告)号：EP1289351A1

公开(公告)日：2003-03-05

申请号：EP01830550.8

申请日：2001-08-29

申请人： Gefran S.p.A.

发明人： Tonello, Giovanni, c/o Gefran S.p.a.

IPC分类号： H05K1/14

CPC分类号： H05K1/142

摘要： The invention relates to an improved structure of an electronic board for reduced-size electronic devices (11) and suitable for supporting discrete or integrated electronic components electrically interconnected by means of conductive tracks realised on or in the board (1). The board (1) comprises a first main functionally independent portion (2) and a second secondary portion (5), structurally independent but functionally additional to the first portion (2); the second portion (5) is coplanar to the first portion (2) and it has at least one edge section (6) with its profile joint to one corresponding edge section (7) of the first portion (2).

摘要翻译： 本发明涉及一种用于小尺寸电子设备（11）的电子板的改进结构，并且适用于通过在板（1）上或板上实现的导电轨迹来电耦合分离或集成的电子部件。 板（1）包括在第一部分（2）上结构独立但功能上附加的第一主功能独立部分（2）和第二副部分（5）; 第二部分（5）与第一部分（2）共面，并且其具有至少一个边缘部分（6），其轮廓接头连接到第一部分（2）的一个相应的边缘部分（7）。