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    FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE
    41.
    发明公开
    FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE 有权
    MELTING现有的液晶聚合物电路结构

    公开(公告)号：EP2954760A1

    公开(公告)日：2015-12-16

    申请号：EP14822548.5

    申请日：2014-07-09

    Applicant: HSIO Technologies, LLC

    Inventor： RATHBURN, James

    IPC: H05K1/00 ,  H05K1/09 ,  H05K3/00

    CPC classification number: H05K3/4635 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/429 ,  H05K3/4623 ,  H05K3/4679 ,  H05K2201/0141 ,  H05K2201/09563 ,  H05K2201/096

    Abstract: A method of making a multilayered, fusion bonded circuit structure. A first circuitry layer is attached to a first major surface of a first LCP substrate. A plurality of first recesses are formed that extend from a second major surface of the first substrate to the first circuitry layer. The first recesses are then plated to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses. A plurality of second recesses are formed in a second LCP substrate corresponding to a plurality of the first conductive pillars. The second recess are plated to form a plurality of second conductive structures that extend between first and second major surfaces of the second substrate. The second major surface of the first substrate is positioned adjacent to the second major surface of the second substrate. The first conductive pillars are aligned with the second conductive structures. The stack is then fusion bonded to mechanically couple the first conductive pillars to the second conductive structures.

    Luminous-body flexible board and luminous device
    45.
    发明公开
    Luminous-body flexible board and luminous device 审中-公开
    灵活的Beleuchtungskörperplatineund Beleuchtungsvorrichtung

    公开(公告)号：EP2506301A2

    公开(公告)日：2012-10-03

    申请号：EP12160932.5

    申请日：2012-03-23

    Applicant: Yamaichi Electronics Co., Ltd.

    Inventor： Sekine, Noriaki

    IPC: H01L25/075 ,  H05K1/18 ,  H01L33/64 ,  H01L33/56

    CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/056 ,  H05K2201/0141 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A luminous-body flexible board includes a flexible board (10) including a metal substrate (11) of a bendable plate, an insulating layer (12) of liquid crystal polymer of which one surface is joined directly to the metal substrate (11) and a conductor layer (13) joined to the other surface of the insulating layer (12) and formed in a wiring pattern. The flexible board (10) further has a plurality of cavities (14) dented on a side of the conductor layer (13) and protruded on a side of the metal substrate (11) of the flexible board (10), being arranged in juxtaposition and configured to be mounted a luminous element (31) respectively therein.

    Abstract translation: 发光体柔性基板包括柔性基板（10），该柔性基板（10）包括可弯曲板的金属基板（11），一个表面直接接合到金属基板（11）的液晶聚合物绝缘层（12）和 连接到绝缘层（12）的另一表面并以布线图案形成的导体层（13）。 柔性板（10）还具有在导体层（13）的侧面凹陷并突出在柔性基板（10）的金属基板（11）的一侧的多个空腔（14），并列设置成并置 并配置为分别安装有发光元件（31）。

    Procédé de réalisation d'une carte imprimée et carte imprimée correspondante
    49.
    发明公开
    Procédé de réalisation d'une carte imprimée et carte imprimée correspondante 有权
    Gedruckte Schaltkreiskarte und Verfahrenfürdessen Herstellung

    公开(公告)号：EP2205053A1

    公开(公告)日：2010-07-07

    申请号：EP10150191.4

    申请日：2010-01-06

    Applicant: Thales

    Inventor： Ledain, Bernard ,  Henriot, Dominique

    IPC: H05K3/38 ,  H05K3/46

    CPC classification number: H05K3/462 ,  H05K3/244 ,  H05K3/3484 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378

    Abstract: L'invention vise un procédé de réalisation d'une carte imprimée (ClM) comprenant au moins deux couches superposées, métallisées sur leurs deux faces, et au moins une couche intercalaire disposée entre deux couches métallisées successives.
    On réalise chaque couche intercalaire à l'aide d'un matériau thermoplastique métallisé.

    Abstract translation: 该方法包括叠加两层，并金属化每层的两个面。 由金属化热塑性材料制成的中间层 液晶聚合物，布置在两层之间。 在将两层彼此接触并且在中间层内部彼此接触之前，在两层内刺穿孔。 孔金属化。 将金属施加在两层的孔的开口上，另一种金属被施加到中间层的孔的开口上。 两层和中间层被压制以用金属覆盖的区域进行扩散接合。 对于包括两个重叠的金属化层的印刷电路板，还包括独立权利要求。

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