公开(公告)号：EP2015624B1

公开(公告)日：2011-10-12

申请号：EP08018753.7

申请日：1998-10-12

Applicant: Ibiden Co., Ltd.

Inventor： Asai, Motoo ,  Shimada, Kenichi ,  Noda, Kouta ,  Kariya, Takashi Ibiden Co., Ltd. ,  Segawa, Hiroshi Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: B32B3/00 ,  H05K3/0094 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10S428/901 ,  Y10T428/24917

公开(公告)号：EP2086294A3

公开(公告)日：2010-03-31

申请号：EP09000026.6

申请日：2009-01-03

Applicant: Samsung Electronics Co., Ltd

Inventor： Lee, Gwan-Hyoung ,  Chu, Young-Bee ,  Lee, Sang-Hee ,  Oh, Jeong-Seok ,  Kim, Young-Soo ,  Kim, Wal-Hee

IPC: H05K1/02 ,  H01L27/15

CPC classification number: H05K1/0209 ,  H05K3/0061 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: A printed circuit board (PCB) includes a base substrate (232), an electrical wiring (233,2331), a dummy pad (234) and a thermally conductive adhesion member (236). The base substrate includes a light-emitting diode (LED) mounted on a first surface of the base substrate. The electrical wiring is electrically connected to the LED (231). The dummy pad is formed on the first surface to be connected to the electrical wiring. The thermally conductive adhesion member is attached to a second surface of the base substrate. Therefore, superior heat radiation may be obtained, thereby reducing or preventing damage to the LED and the LCD device using the LED by radiating the heat from the LED used as a light source.

公开(公告)号：EP1808265A4

公开(公告)日：2009-10-21

申请号：EP05805313

申请日：2005-10-27

Applicant: PANASONIC CORP

Inventor： MAEDA TADASHI ,  SAKAI TADAHIKO

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

公开(公告)号：EP1889683A4

公开(公告)日：2009-08-19

申请号：EP06756513

申请日：2006-05-24

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU

IPC: B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/362 ,  H05K2201/0215 ,  H05K2201/0257

Abstract: [PROBLEMS] Conventional Sn-Zn, lead-free solder pastes have disadvantages in that they are liable to form coarse Zn crystals of tens of micrometers in size and the formation of such coarse crystals can hardly be inhibited and that it is difficult to enhance the joint strength without changing the soldering temperature. Although an alloy improved in the strength by the addition of a slight amount of a group 1B element was developed, the alloy is disadvantageous in that it cannot reflow according to the same temperature profile as that of Sn-Pb paste because of its enhanced melting temperature. [MEANS FOR SOLVING PROBLEMS] A solder paste prepared by incorporating a powder of an Sn-Zn, lead-free solder paste with both an ethanol solution containing nanoparticles of 5 to 300nm in diameter containing at least one member selected from among Ag, Au and Cu and a flux forms, in soldering, an alloy consisting of Ag, Au and/or Cu and Zn and thereby forms fine clusters in the liquid phase, thus giving a fine solder texture after melting.

公开(公告)号：EP1744608B1

公开(公告)日：2008-06-25

申请号：EP06020624.0

申请日：1999-05-21

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Kariya, Takashi ,  Shimada, Kenichi ,  Segawa, Hiroshi

IPC: H05K3/46

CPC classification number: H05K3/4602 ,  H05K3/382 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096

公开(公告)号：EP1919266A2

公开(公告)日：2008-05-07

申请号：EP08150255.1

申请日：1999-09-14

Applicant: Ibiden Co., Ltd.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An electroless plating solution comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion and 0.05 to 0.3 mol/L of tartaric acid or a salt thereof. Another electroless plating solution comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion. The electroless plating solution is used in an electroless plating process performing electroless copper plating, more specifically in a process for manufacturing a printed circuit board which comprises immersing a resin insulating substrate board in the electroless plating solution. The electroless plated film has a stress of 0 to +10 kg/mm 2 when formed on a roughened surface of the resin insulating substrate board.

Abstract translation: 无电镀液包含含有0.025〜0.25mol / L碱性化合物，0.03〜0.15mol / L还原剂，0.02〜0.06mol / L铜离子和0.05〜0.3mol / L酒石酸的水溶液 或其盐。 另一种化学镀溶液包含含有碱性化合物，还原剂，铜离子，酒石酸或其盐的水溶液和至少一种选自镍离子，钴离子和铁离子的金属离子。 化学镀溶液用于执行无电镀铜的化学镀处理，更具体地，在印刷电路板的制造方法中，包括将树脂绝缘基板浸入化学镀溶液中。 当形成在树脂绝缘基板的粗糙表面上时，无电镀膜具有0至+ 10kg / mm 2的应力。

公开(公告)号：EP1685751B1

公开(公告)日：2007-09-12

申请号：EP05752868.9

申请日：2005-06-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： SAKAI, Tadahiko ,  MAEDA, Tadashi

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

公开(公告)号：EP1744608A3

公开(公告)日：2007-04-18

申请号：EP06020624.0

申请日：1999-05-21

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Kariya, Takashi ,  Shimada, Kenichi ,  Segawa, Hiroshi

IPC: H05K3/46

CPC classification number: H05K3/4602 ,  H05K3/382 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096

Abstract: In a multilayer printed wiring board comprising a multilayer core (1) board having conductor layers in its innerlayer, and interlaminar resin (3) insulating layers and conductor layers alternately laminated on a substrate to form buildup wiring layer connecting the conductor layers through via-hole (12), the multilayer core board has a resin insulating layer covering the innerlayer conductor circuits formed on the core material, and a via-hole is formed in the resin insulating layer so as to arrive at the innerlayer conductor circuit through the layer, and a through-hole (10) is formed in the resin insulating layer and a filler (8) is filled in the through-hole. A part of the via-hole (19) in the buildup wiring layer is located just above the through-hole (10) and connected to the through-hole. Even if the core board is multilayered, there can be provided a multilayer printed wiring board suitable for the high densification of through-holes which can sufficiently ensure the electrical connection to the innerlayer circuits in the core board through the through-holes.

Abstract translation: 在多层印刷线路板中，该多层印刷线路板包括在其内层中具有导体层的多层芯（1）板以及交替层叠在基板上的层间树脂（3）绝缘层和导体层，以形成通过通孔连接导体层的累积布线层 （12）中，多层芯板具有树脂绝缘层，该树脂绝缘层覆盖形成在芯材上的内层导体电路，并且在树脂绝缘层中形成通孔以通过该层到达内层导体电路，并且 在树脂绝缘层中形成通孔（10），并且填充物（8）填充在通孔中。 增层配线层中的通孔（19）的一部分位于通孔（10）的正上方并连接至通孔。 即使芯板是多层的，也可以提供一种适合高通孔密度的多层印刷线路板，它能够充分确保通过通孔与核心板内的内层电路的电连接。

公开(公告)号：EP1685751A1

公开(公告)日：2006-08-02

申请号：EP05752868.9

申请日：2005-06-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： SAKAI, Tadahiko ,  MAEDA, Tadashi

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

Abstract: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

公开(公告)号：EP1667506A1

公开(公告)日：2006-06-07

申请号：EP06003716.5

申请日：1999-09-14

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Nakai, Tohru ,  Oki, Takeo ,  Hirose, Naohiro ,  Noda, Kouta

IPC: H05K3/18 ,  H05K3/46 ,  H05K1/09 ,  C25D5/18 ,  C23C18/34

CPC classification number: H05K3/4644 ,  C23C18/1607 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/30 ,  C23C18/34 ,  C23C18/405 ,  C23C28/00 ,  C23C28/023 ,  C23C28/42 ,  C25D3/38 ,  C25D5/022 ,  C25D5/18 ,  C25D5/34 ,  C25D7/123 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/241 ,  H05K3/381 ,  H05K3/382 ,  H05K3/384 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0344 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0353 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1492 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An electroless plating solution comprises an aqueous solution containing 0.025 to 0.25 mol/L of a basic compound, 0.03 to 0.15 mol/L of a reducing agent, 0.02 to 0.06 mol/L of copper ion and 0.05 to 0.3 mol/L of tartaric acid or a salt thereof. Another electroless plating solution comprises an aqueous solution containing a basic compound, a reducing agent, copper ion, tartaric acid or a salt thereof and at least one metal ion species selected from the group consisting of nickel ion, cobalt ion and iron ion. The electroless plating solution is used in an electroless plating process performing electroless copper plating, more specifically in a process for manufacturing a printed circuit board which comprises immersing a resin insulating substrate board in the electroless plating solution. The electroless plated film has a stress of 0 to +10 kg/mm 2 when formed on a roughened surface of the resin insulating substrate board.

Abstract translation: 无电镀液包含含有0.025〜0.25mol / L碱性化合物，0.03〜0.15mol / L还原剂，0.02〜0.06mol / L铜离子和0.05〜0.3mol / L酒石酸的水溶液 或其盐。 另一种化学镀溶液包含含有碱性化合物，还原剂，铜离子，酒石酸或其盐的水溶液和至少一种选自镍离子，钴离子和铁离子的金属离子。 化学镀溶液用于执行无电镀铜的化学镀处理，更具体地，在印刷电路板的制造方法中，包括将树脂绝缘基板浸入化学镀溶液中。 当形成在树脂绝缘基板的粗糙表面上时，无电镀膜具有0至+ 10kg / mm 2的应力。