公开(公告)号：EP2801123A4

公开(公告)日：2015-10-21

申请号：EP12864500

申请日：2012-11-01

Applicant: CRAY INC

Inventor： KIM HYUNJUN ,  CONGER JEFFREY SCOTT ,  SCOTT GREGORY ERWIN

IPC: H05K1/02 ,  H01R12/57

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

公开(公告)号：EP2222144B1

公开(公告)日：2014-07-30

申请号：EP10004994.9

申请日：2007-06-29

Applicant: SHIN-ETSU POLYMER CO., LTD.

Inventor： Kawaguchi, Toshiyuki ,  Tahara, Kazutoki ,  Saga, Tsutomu ,  Negishi, Mitsuaki

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

公开(公告)号：EP1776827B8

公开(公告)日：2013-12-18

申请号：EP05724119.2

申请日：2005-03-02

Applicant: Sony Ericsson Mobile Communications AB

Inventor： HAYES, Gerard James ,  VANCE, Scott LaDell

IPC: H04B1/38 ,  H05K1/02

CPC classification number: H05K9/0039 ,  H04B1/3838 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/167 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10446

Abstract: The present invention uses metallization termination techniques to reduce the electro-magnetic field scattering at the edges of metallized areas. The metallization termination techniques provide a gradual transition from high conductivity areas to high impedance areas. The mobile phone antenna illuminates the PCB allowing currents to flow on the PCB. When the currents reach edges of the PCB they flow through a region of increasingly high impedance without reflecting back or scattering.

Abstract translation: 本发明使用金属化端接技术来减少金属化区域边缘处的电磁场散射。 金属化终止技术提供从高电导率区域到高阻抗区域的逐渐过渡。 手机天线照亮PCB，允许电流在PCB上流动。 当电流到达PCB的边缘时，它们将流过阻抗逐渐增大的区域，而不会反射回或散射。

公开(公告)号：EP2573951A1

公开(公告)日：2013-03-27

申请号：EP11783425.9

申请日：2011-05-11

Applicant: Sony Corporation

Inventor： KIKUCHI, Hidekazu ,  MOGI, Takayuki ,  AKIYAMA, Yoshiyuki ,  KAWAMURA, Hirofumi

IPC: H04B5/02 ,  H01P5/107 ,  H04B1/40 ,  H04B3/02

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Abstract translation: 一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。 第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和 第二连接器装置。

公开(公告)号：EP2278863B1

公开(公告)日：2012-05-30

申请号：EP10165403.6

申请日：2010-06-09

Applicant: Alps Electric Co., Ltd.

Inventor： Kawai, Satoshi

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0224 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0723 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09709

公开(公告)号：EP1991040B1

公开(公告)日：2012-02-15

申请号：EP08155950.2

申请日：2008-05-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Yokai, Takahiko

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09081 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969

公开(公告)号：EP1912488A3

公开(公告)日：2010-07-28

申请号：EP07102581.1

申请日：2007-02-16

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Hattori, Makoto, c/o Air-conditioning & Refrigeration Systems ,  Asai, Masahiko, c/o Air-conditioning & Refrigeration Systems ,  Toyama, Koji, c/o NAGOYA Research & Development Center ,  Nakano, Koji, c/o NAGOYA Research & Development Center

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0262 ,  H05K1/0227 ,  H05K1/0231 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A control board (10) has a pattern for a low-voltage circuit including a ground pattern connectable to a ground and a pattern for a high-voltage circuit including a ground pattern. The patterns for the low-voltage and high-voltage circuits each have one or more ground-connection lands (13a, 13b) configured to connect the ground patterns thereof to each other via one or more capacitors.

Abstract translation: 控制板（10）具有用于低压电路的图案，其包括可连接到地的接地图案和包括接地图案的高电压电路的图案。 低电压和高压电路的图案各自具有一个或多个接地连接焊盘（13a，13b），其被配置为经由一个或多个电容器将其接地图案彼此连接。

公开(公告)号：EP2048919A4

公开(公告)日：2010-01-06

申请号：EP07767924

申请日：2007-06-29

Applicant: SHINETSU POLYMER CO

Inventor： KAWAGUCHI TOSHIYUKI ,  TAHARA KAZUTOKI ,  SAGA TSUTOMU ,  NEGISHI MITSUAKI

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

公开(公告)号：EP1413178B1

公开(公告)日：2010-01-06

申请号：EP02750400.0

申请日：2002-08-02

Applicant: SanDisk Corporation

Inventor： WALLACE, Robert, F.

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0256 ,  G06K19/077 ,  G06K19/07732 ,  G06K19/07735 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/242 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer (112) extending to the edges of a circuit board for electrostatic discharge protection but also has gaps (112a) at the edge of the ground and/or power layer (112) to avoid short circuiting with conductive segments (160) of another layer deformed when the card is trimmed during manufacture.

公开(公告)号：EP2120352A1

公开(公告)日：2009-11-18

申请号：EP07860420.4

申请日：2007-12-27

Applicant: Hitachi Metals, Ltd.

Inventor： KEMMOCHI, Shigeru ,  FUKAMACHI, Keisuke ,  HAGIWARA, Kazuhiro

IPC: H04B1/40

CPC classification number: H04B1/44 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K2201/093 ,  H05K2201/09327 ,  H05K2201/09781 ,  H01L2924/00

Abstract: A high-frequency device having high-frequency-signal-treating circuits in and on a laminate substrate comprising pluralities of dielectric layers having conductor patterns, the high-frequency-signal-treating circuits having amplifier circuits and switch circuits; terminals including input and output terminals of high-frequency signals, the power supply terminals of the amplifier circuits and the power supply terminals of the switch circuits being formed on one main surface of the laminate substrate; power supply lines each having one end connected to each of the power supply terminals of the amplifier circuits and power supply lines each having one end connected to each of the power supply terminals of the switch circuits being formed on one dielectric layer to constitute a power supply line layer; a first ground electrode being arranged on the side of the main surface with respect to the power supply line layer, the first ground electrode overlapping at least part of the power supply lines in a lamination direction; a second ground electrode being arranged on the opposite side of the first ground electrode with respect to the power supply line layer, the second ground electrode overlapping at least part of the power supply lines in a lamination direction; and the high-frequency-signal-treating circuits being arranged on the opposite side of the power supply line layer with respect to the second ground electrode.

Abstract translation: 一种具有高频信号处理电路的高频信号处理电路，具有包含多个具有导体图案的电介质层的叠层基板中及其上的高频信号处理电路，所述高频信号处理电路具有放大电路和开关电路; 包括高频信号的输入和输出端子的端子，放大器电路的电源端子和开关电路的电源端子形成在层叠基板的一个主表面上; 电源线各自具有连接到放大器电路的每个电源端子的一端和各自具有连接到开关电路的每个电源端子的一端的电源线，其形成在一个电介质层上以构成电源 线层; 第一接地电极相对于电源线层布置在主表面侧，第一接地电极在层叠方向上与至少一部分电源线重叠; 第二接地电极相对于电源线层布置在第一接地电极的相对侧上，第二接地电极在层叠方向上与至少一部分电源线重叠; 并且高频信号处理电路相对于第二接地电极布置在电源线层的相对侧。