公开(公告)号：EP2241168A1

公开(公告)日：2010-10-20

申请号：EP09702108.3

申请日：2009-01-08

Applicant: Rosemount, Inc.

Inventor： ERICKSEN, Christopher Lee ,  GOLDBERG, Howard David ,  MEYER, John Charles

IPC: H05K5/00

CPC classification number: H05K1/147 ,  H05K1/0256 ,  H05K2201/10204 ,  H05K2201/2036 ,  Y10T29/49826

Abstract: A compliant circuit element spacing system comprises a circuit board, a dummy spacer component, and a compliant circuit element. One or more active components are mounted to the circuit board. The dummy spacer component is also mounted to the circuit board, such that the dummy spacer component is electrically isolated from each active component mounted to the circuit board. The compliant circuit element is positionable proximate the circuit board, and spaced from the circuit board by the dummy spacer component. The spacing component isolates the compliant circuit element from each active component mounted to the circuit board.

公开(公告)号：EP1631137A4

公开(公告)日：2009-05-27

申请号：EP05726702

申请日：2005-03-17

Applicant: PANASONIC CORP

Inventor： FUJIWARA JOJI ,  HIMORI TSUYOSHI ,  TSUNEOKA MICHIAKI

IPC: H05K9/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L23/29 ,  H01L23/552 ,  H01L2924/15159 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/09972 ,  H05K2201/10204

Abstract: On a board (11) of a module component, a mounting component (12) and a conductive divider (13) which divides a circuit block into at least two circuit blocks are mounted, a sealing body (14) for covering the circuit block is provided, and a conductive film (16) is provided on a surface of the sealing body (14). The module component is electrically shielded by every group of circuit blocks. The module component provides sufficient shielding effects without increasing the number of manufacturing processes, maintains bending strength and has a small warp.

公开(公告)号：EP1534052A3

公开(公告)日：2007-10-24

申请号：EP04078154.4

申请日：2004-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Ihms, David W. ,  Myers, Bruce A.

IPC: H05K1/02 ,  H01L23/00

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10204 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A circuit board assembly (10) comprising a laminate substrate (12) and a surface mount device (18) having a CTE less than that of the laminate substrate (12) and attached with at least one solder joint (20) to a first surface (14) of the laminate substrate (12). The assembly (10) further includes a localized stiffener (24,124,224) attached to a second surface (16) of the laminate substrate (12) so as to be directly opposite the circuit device (18). The localized stiffener (24,124,224) is formed of a material and is shaped so that, when attached to the laminate substrate (12), the stiffener (24,124,224) is capable of increasing the thermal cycle fatigue life of the one or more solder joints (20) that attach the device (18) to the substrate (12).

公开(公告)号：EP1687114A1

公开(公告)日：2006-08-09

申请号：EP04781932.1

申请日：2004-08-23

Applicant: MOTOROLA, INC.

Inventor： WEIGLER, William, C. ,  BABULA, Robert ,  HERBOLD, James, E. ,  GALL, Thomas, P. ,  SHARKEY, Steven, G

IPC: B23K1/00

CPC classification number: H05K3/3457 ,  B23K1/018 ,  B23K2201/42 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2203/046 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated (66) until it is liquid, wherein the excess solder is wicked (68) vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted (70) from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

公开(公告)号：EP1631137A1

公开(公告)日：2006-03-01

申请号：EP05726702.3

申请日：2005-03-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： FUJIWARA, Joji ,  HIMORI, Tsuyoshi ,  TSUNEOKA, Michiaki

IPC: H05K9/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H05K1/0218 ,  H01L23/29 ,  H01L23/552 ,  H01L2924/15159 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/09972 ,  H05K2201/10204

Abstract: A module component in which mounting components and a conductive partition for dividing into a plurality of circuit blocks are mounted on a substrate. The circuit blocks are covered with a sealing member, which is further covered on its surface with a conductive film to electrically shield the circuit blocks individually. This module component can maintain bending strength, with little warpage by a sufficient shielding effect achieved without increasing the number of manufacturing processes.

Abstract translation: 其中安装部件和用于分割成多个电路块的导电隔板安装在基板上的模块部件。 电路块被密封构件覆盖，密封构件在其表面上进一步被导电膜覆盖，以分别电隔离电路块。 该模块组件可以在不增加制造工艺的数量的情况下实现足够的屏蔽效果，从而保持弯曲强度，具有很小的翘曲。

公开(公告)号：EP1565045A1

公开(公告)日：2005-08-17

申请号：EP04425094.2

申请日：2004-02-12

Applicant: Askoll Holding S.r.l.

Inventor： Marioni, Elio

IPC: H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L23/40

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing (2), substantially parallelepiped, and electric connecting pins (3) connected inside the body with said circuit and projecting from said body (2) for an electric connection on the electronic printed circuit board (4). The body (2) has a heat dissipating header (5) having at least one surface emerging from the body (2) and laying on a plane (P) whereas the pins (3) project from the body (2) for a first section initially extended parallelly to the plane (P). Advantageously a pair (7, 8) of pins (3) has a substantially U-shaped bending, after the first section parallel to the plane (P) for allowing a more stable bearing of the component (1) during the step of welding to a heat dissipating intermediate die (9).

Abstract translation: 本发明涉及一种基本上包装状的离散电子部件，其包括大体上平行六面体的电力电子电路，主体或壳体（2）和连接在主体内的所述电路的电连接销（3），并且从 所述主体（2）用于电子印刷电路板（4）上的电连接。 主体（2）具有散热集管（5），其具有至少一个从主体（2）出来并放置在平面（P）上的表面，而销（3）从主体（2）伸出，用于第一部分 最初平行于平面（P）延伸。 有利的是，一对（7,8）的销（3）具有基本上U形的弯曲，在第一部分平行于平面（P）之后，用于在焊接步骤期间允许部件（1）的更稳定的轴承 散热中间管芯（9）。

公开(公告)号：EP1320288A2

公开(公告)日：2003-06-18

申请号：EP02255035.4

申请日：2002-07-17

Applicant: FUJITSU LIMITED

Inventor： Kikuchi, Shunichi, c/o Fujitsu Limited ,  Yamada, Mitsutaka, c/o Fujitsu Limited ,  Iketaki, Kenji, c/o Fujitsu Limited

IPC: H05K3/34 ,  H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A printed wiring board device (10) includes circuit parts (20) which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device (10). Pads (22) are provided on the wiring board around the circumference of the circuit parts (20), the pads (22) being electrically isolated from the circuit. Heat-absorbing dummy parts (30) are mounted on the pads (22), and the dummy parts (30) absorb heat from the circuit parts (20) through the pads (22) during reflow soldering.

公开(公告)号：EP0264243B1

公开(公告)日：1990-10-03

申请号：EP87308979.1

申请日：1987-10-09

Applicant: LOMA PARK ASSOCIATES INC.

Inventor： Wilent, John W. ,  Benson, Robert F. ,  Sparks, Robert A.

IPC: H05K13/00 ,  G03F9/00

CPC classification number: H05K3/4638 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/4611 ,  H05K2201/09918 ,  H05K2201/10204 ,  Y10T83/178 ,  Y10T408/03 ,  Y10T408/08 ,  Y10T408/21

公开(公告)号：EP3275295A1

公开(公告)日：2018-01-31

申请号：EP16714303.1

申请日：2016-03-21

Applicant: Sivantos Pte. Ltd.

Inventor： BEYFUSS, Stefanie ,  KRAL, Holger ,  FREELS, Björn ,  KUHN, Johannes

IPC: H05K3/28 ,  H01R25/00

CPC classification number: H05K3/341 ,  H04R25/00 ,  H04R25/60 ,  H05K3/0076 ,  H05K3/284 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2203/0228 ,  H05K2203/0557 ,  H05K2203/107

Abstract: The invention relates to a method (2) for manufacturing a circuit (4), in particular of a hearing aid (6), in which method (2) a printed circuit board (10) is made available with a first region (14) and with a second region (12) which are separated by means of a boundary (18). A component (24) is mounted on the printed circuit board (10), wherein the component (24) is positioned on the boundary (18). The first region (14) is covered by means of a mask (38) which has an edge (42), wherein the edge (42) is positioned on the component (24), and the printed circuit board (10) is provided with a coating (46). The coating (46) is cut away in the region of the component (24) and the mask (38) is removed.

公开(公告)号：EP3085211A1

公开(公告)日：2016-10-26

申请号：EP14795651.0

申请日：2014-11-10

Applicant: Robert Bosch GmbH

Inventor： LISKOW, Uwe

IPC: H05K3/34

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: For an electronic control module (1), in particular for a transmission controller, comprising a printed circuit board (5) with a component side (17), on which at least one contact area (13a) is arranged, and comprising at least one electrical component (20) with at least one electrical connection element (24) having a connection section (25) which runs parallel to the component side (17) of the printed circuit board (5) and is electrically connected to the at least one contact area (13a), it is proposed to arrange at least one adapter (30) on the printed circuit board (5), which adapter is independent of the at least one electrical component (20), is arranged as a separate part on the printed circuit board (5) and has a holding body (31) fastened to the printed circuit board (5) outside the at least one contact area (13a) and at least one metal web (34) which is arranged on the holding body (31) and has a contact section (35) running parallel to the component side of the printed circuit board, wherein the contact section (35) of the at least one metal web (34) and the connection section (25) of the at least one connection element (24) are arranged lying on top of one another in a covering area (50), as seen in a direction perpendicular to the printed circuit board, and are welded to one another in the covering area (50), and the at least one metal web (34) or the at least one connection element (24) makes electrical contact with the at least one contact area (13a) by means of an electrically conductive material (42) applied to the at least one contact area (13a).

Abstract translation: 电子控制模块包括印刷电路板和在电气部件。 电路板具有设置在元件侧的接触面积。 电气部件具有与平行于所述组件侧的连接部的运行的电连接元件，并电连接到接触区域。 一个适配器被布置在电气部件的电路基板unabhängig并且具有固定于所述电路板的接触面积和金属网以外的保持体。 幅材被设置在所述保持体，并且具有一个平行于元件侧面延伸的接触部。 接触部和连接部谎言在另一个顶上并且被焊接到彼此的覆盖区域。 网络或连接元件与通过在导电材料施加到所述接触区域的接触区域电接触。