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公开(公告)号：EP0777955B1
公开(公告)日：1999-01-20
申请号：EP95928995.0
申请日：1995-08-28
Applicant: SIEMENS AKTIENGESELLSCHAFT
Inventor： DIRMEYER, Josef , PLANKL, Christian , SWART, Marten , GOTTLIEB, Alfred
CPC classification number: H05K7/02 , H05K1/0284 , H05K1/187 , H05K3/202 , H05K2201/0382 , H05K2201/09118 , H05K2201/09736 , H05K2201/10371 , H05K2201/2072 , H05K2203/1545
Abstract: The invention relates to a structure (10) (pressed screen) stamped from a metal strip (11) which is used to secure electrical components (20) fitted on it and connect them electrically. The entire structure with the components (20) fitted thereon can be sprayed with plastic and be fitted with supports (31, 32) for components or external sockets (30) for plugs.
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公开(公告)号：EP0796038A2
公开(公告)日：1997-09-17
申请号：EP97104425.0
申请日：1997-03-14
Applicant: TDK Corporation
Inventor： Hayashi, Katsuhiko
IPC: H05K9/00
CPC classification number: H05K3/3405 , H05K1/0237 , H05K3/341 , H05K3/403 , H05K5/0091 , H05K9/0039 , H05K2201/09181 , H05K2201/10371
Abstract: Downward projections made on two side walls of a cap are fitted into recesses in two opposed side faces of a substrate. Lower margins of two end walls of the cap are soldered to ground electrodes provided on a part mounting face of the substrate. Lower margins in the proximity of projections of the side walls of the cap are soldered to ground electrodes provided on the part mounting face above recesses of the substrate. Therefore, it is provided a high-frequency module that can produce a good electromagnetic shielding effect even in a high-frequency band.
Abstract translation: 在盖的两个侧壁上形成的向下突出部被装配到基板的两个相对侧面中的凹部中。 将帽的两个端壁的较低边缘焊接到设置在基板的部件安装面上的接地电极。 在盖的侧壁的突起附近的较低边缘被焊接到设置在基板的凹槽上方的部件安装面上的接地电极。 因此，提供了即使在高频带也能够产生良好的电磁屏蔽效果的高频模块。
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43.发明公开Decoupling capacitor integrated between an h.f. output line and an h.f. cavity 失效H.输出线和H.F. CAVITY之间的解耦电容器
公开(公告)号：EP0132006A3
公开(公告)日：1986-12-30
申请号：EP84201009
申请日：1984-07-11
Inventor： KUPFER, KARL-HEINZ
CPC classification number: H03H1/0007 , H05K1/0231 , H05K1/0237 , H05K3/3405 , H05K3/4046 , H05K2201/09263 , H05K2201/1003 , H05K2201/10371 , H05K2201/10636 , Y02P70/611
Abstract: Die Erfindung bezieht sich auf eine Hochfrequenzleitera uskopplung aus einem Hochfrequenzraum mit Hilfe eines Auskopplungskondensators (71). Der Auskopplungskonden sator (71) ist als Chipschichtkondensator ausgebildet und an einer Schaltungsplatine (1) befestigt. Eine Kontaktfläche (73) des Chipschichtkondensators (71) ist mit der den Hochfrequ enzraum abschließenden Schottwand (19) durch Anlöten ele ktrisch kontaktiert. An der anderen Kontaktfläche (75) des Chipschichtkondenwsators (71) wird der auszukoppelnde Lei ter (77) möglichst langflächig auch wieder durch Anlöten elek trisch kontaktiert vorbeigeführt. Der auszukoppelnde Leiter (77) kann als flächenhafter Leitungszug ausgebildet sein.
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公开(公告)号：EP3157317B1
公开(公告)日：2018-12-26
申请号：EP16158530.2
申请日：2016-03-03
Applicant: Xiaomi Inc.
Inventor： WANG, Dongliang , WANG, Shaojie , SHI, Shasha
CPC classification number: H05K1/0212 , H05K7/20 , H05K7/2039 , H05K7/20418 , H05K7/20427 , H05K7/20436 , H05K7/20518 , H05K9/0024 , H05K9/0052 , H05K9/0081 , H05K2201/066 , H05K2201/0707 , H05K2201/10371
Abstract: Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) that are interconnected, wherein the second shielding case body (2) at least partially covers the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).
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公开(公告)号：EP3383149A1
公开(公告)日：2018-10-03
申请号：EP18163961.8
申请日：2018-03-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： LEE, Chang-Joon , LEE, Yong-Won , JANG, Hyun-Tae
CPC classification number: H05K9/0049 , B32B15/013 , H05K1/0216 , H05K1/0306 , H05K1/053 , H05K1/181 , H05K3/303 , H05K3/341 , H05K9/0028 , H05K2201/10318 , H05K2201/10333 , H05K2201/10371 , Y02P70/613
Abstract: According to various embodiments of the present disclosure, a metal unit 100 may include: a core metal layer 110 that is mainly composed of iron (Fe); and an outer layer 120 formed on at least one face 111, 112 of the core metal layer, and bonded to solder 10 so as to be attached to a printed circuit board 21. The metal unit and an electronic device including the same may be variously implemented according to embodiments.
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Patent Agency Ranking
公开(公告)号：EP2799181B1
公开(公告)日：2018-09-26
申请号：EP12861511.9
申请日：2012-12-25
Applicant: Senju Metal Industry Co., Ltd
Inventor： OHNISHI Tsukasa , YOSHIKAWA Shunsaku , ISHIBASHI Seiko , FUJIMAKI Rei
IPC: B23K35/26 , B23K1/00 , B23K35/14 , C22C13/00 , H05K3/34 , B23K101/40 , H05K1/02 , H01L27/00 , H01L23/552 , H01L23/42 , B23K35/02 , H01L23/373
CPC classification number: B23K35/262 , B23K35/0233 , B23K35/0244 , C22C13/00 , H01L23/3736 , H01L23/42 , H01L23/552 , H01L27/00 , H01L2924/0002 , H05K1/0203 , H05K3/341 , H05K3/3463 , H05K2201/10371 , H01L2924/00
Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.
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公开(公告)号：EP3302009A1
公开(公告)日：2018-04-04
申请号：EP16191810.7
申请日：2016-09-30
Applicant: Napatech A/S
Inventor： Ek, Claus
CPC classification number: H05K1/142 , H05K1/0203 , H05K7/20145 , H05K2201/10371 , H05K2201/10409
Abstract: An assembly comprising a first and a second circuit board interconnected via first and second connectors attached to the first and second circuit board, respectively, where a cooling structure is attached to the first and second circuit boards to cool components thereof and prevent detachment of the first and second circuit boards.
Abstract translation: 一种组件，包括第一和第二电路板，所述第一和第二电路板通过分别连接到第一和第二电路板的第一和第二连接器相互连接，其中冷却结构连接到第一和第二电路板以冷却其组件，并防止第一 和第二电路板。
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公开(公告)号：EP3244711A1
公开(公告)日：2017-11-15
申请号：EP17166595.3
申请日：2017-04-13
Applicant: KATHREIN-Werke KG
Inventor： Langenberg, Jörg , Leinenbach, Florian , Ponn, Philipp
CPC classification number: F16B5/0024 , F16B5/02 , H01Q21/08 , H01Q21/26 , H05K3/0061 , H05K3/3447 , H05K9/006 , H05K2201/09036 , H05K2201/09063 , H05K2201/09072 , H05K2201/093 , H05K2201/09718 , H05K2201/09745 , H05K2201/10371 , H05K2201/2036
Abstract: Bereitgestellt wird eine Adapterplatte (1) für HF-Strukturen, die dazu eingerichtet ist, zwischen einer Rückseite einer Leiterplatte (2) und einem Reflektor (4) angeordnet zu werden, wobei die Adapterplatte elektrisch leitfähig ist, und die Adapterplatte an jeder Stelle, an der ein Element durch die Leiterplatte auf die Seite der Adapterplatte durchgeführt ist, eine Öffnung (102) oder eine Vertiefung (101) aufweist, wobei mindestens ein Element ausschließlich zur Massekontaktierung durch die Leiterplatte geführt ist.
Abstract translation: 提供了一种用于HF-结构，其适于被设置在印刷电路板的后侧之间提供一个适配器板（1）（2）和反射器（4），其中所述适配器板是导电的，并且在每个位置处，其中所述适配板 元件穿过电路板到达适配板的侧部，开口（102）或凹部（101），其中至少一个元件专门用于通过电路板进行接地。
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公开(公告)号：EP2804452B1
公开(公告)日：2017-07-19
申请号：EP14163650.6
申请日：2014-04-07
Inventor： IWAO, Seiichi , ASAKAWA, Koji , IBUKI, Yasuo , NISHIMURA, Shinji , WATANABE, Kazunori
CPC classification number: H05K3/281 , H05K1/141 , H05K1/181 , H05K3/368 , H05K2201/041 , H05K2201/10106 , H05K2201/10371
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公开(公告)号：EP2995179A4
公开(公告)日：2016-11-02
申请号：EP14788578
申请日：2014-03-13
Applicant: PARKER HANNIFIN CORP
Inventor： BUNYAN MICHAEL H , TOROK PETER Z , WATCHKO GEORGE R , CZARNECKI JEFFREY
IPC: H05K9/00
CPC classification number: H05K3/321 , H05K1/05 , H05K9/0083 , H05K9/009 , H05K2201/10371
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