公开(公告)号：EP1247343B1

公开(公告)日：2007-04-18

申请号：EP00983625.5

申请日：2000-12-01

Applicant: FCI

Inventor： GREK, Joachim

IPC: H03L1/00

CPC classification number: H05K1/147 ,  H01R12/716 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/10189

Abstract: A slanted connector and a method for mounting the same, having first connector means (20) extended in a first direction and second connector means (29a-c) extended in a slanted direction in relation to the first connector means (20).According to the invention the slanted connector comprises a first part (2) comprising the first connector means (20) and a second part (21a-e) comprising the second connector means (29a-c). The second part (21a-e) is connectable to the first connector means (20) and has a bent form in order to engage the first connector means (20) in a first direction and provide the second connector means (29a-c) protruding in at least one second direction slanted to the first direction, the second part (21a-e) having a circuit pattern to connect the first connector means (20) to the second connector means (29a-c).

公开(公告)号：EP1754400A1

公开(公告)日：2007-02-21

申请号：EP05748489.1

申请日：2005-06-03

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HIDAKA, Akio ,  IKEBE, Shouichi ,  MURANO, Yuuichi ,  KAZITANI, Hirozumi ,  IKEDA, Mika ,  MIZOGUCHI, Yoshitaka

IPC: H05K5/00

CPC classification number: H05K3/3426 ,  H01G2/065 ,  H05K5/0095 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/10909 ,  H05K2201/2009 ,  Y02P70/613

Abstract: The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same time, without requiring fine adjustment etc. The invention is an electronic component 1 which has an element 2, a pair of terminal portions 4 which were disposed on the element 2, and an external covering material 5 which covers the a part of the terminal portions 4 and the element 2, and configured in such a manner that inclined portions 10 are disposed on corner portions of a bottom surface 9 and side surfaces of the external covering material 5, and the terminal portions 4 are protruded from corner portions where the inclined portions 10 and the bottom surface 9 of the external covering material intersect.

公开(公告)号：EP1172901B1

公开(公告)日：2007-01-03

申请号：EP01305721.1

申请日：2001-07-02

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko c/o Intellectual Property Dep. Sumito ,  Yamakawa, Shuji c/o Intellectual Property Dept. Su ,  Kato, Shinshu c/o Intellectual Property Dept. Sumi

IPC: H01R25/00

CPC classification number: H05K1/0256 ,  H01R4/70 ,  H01R25/00 ,  H05K1/0284 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/10272

公开(公告)号：EP1261243B1

公开(公告)日：2006-11-22

申请号：EP02011219.9

申请日：2002-05-21

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Suzuki, Toshiyuki, Matsushita Electric Works, Ltd. ,  Nakagawa, Kazuya, Matsushita Electric Works, Ltd. ,  Kobayashi, Mitsuru, Matsushita Electric Works Ltd. ,  Shiohama, Eiji, Matsushita Electric Works, Ltd. ,  Sugimoto, Masaru, Matsushita Electric Works, Ltd. ,  Kimura, Hideyoshi, Matsushita Electric Works, Ltd. ,  Hashimoto, Takuma, Matsushita Electric Works, Ltd.

IPC: H05K3/24 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/242 ,  H05K1/0284 ,  H05K1/0293 ,  H05K3/045 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

公开(公告)号：EP1451831A4

公开(公告)日：2006-11-02

申请号：EP02771903

申请日：2002-11-04

Applicant: COCHLEAR LTD

Inventor： PARKER JOHN ,  EROL HARVEY

IPC: A61F11/00 ,  H05K1/02 ,  B32B7/02 ,  C25D1/10 ,  H01B5/14 ,  H01B13/00 ,  H05K1/00 ,  H05K3/20

CPC classification number: H05K1/0265 ,  C25D1/10 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/20 ,  H05K2201/0133 ,  H05K2201/0317 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/1152

Abstract: A thin flexible electric conductor for use in implantable devices such as cochlear implants, consists of a conductive metal layer coated on a flexible three dimensionally textured surface so that the current capacity of the conductor is increased relative to the current capacity of a conductor of the same size that is not on a three dimensional surface. The flexible substrate is treated to form a three dimensional surface such as with corrugations and a conductive layer is deposited onto the surface.

公开(公告)号：EP1425792A2

公开(公告)日：2004-06-09

申请号：EP02774350.9

申请日：2002-09-13

Applicant: Siemens Dematic AG

Inventor： VAN PUYMBROECK, Jozef ,  HEERMAN, Marcel

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H05K3/02 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L23/13 ,  H01L2924/0002 ,  H05K1/119 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/046 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an intermediate support for electronic components, for example a semiconductor, comprising a plastic substrate with contact bumps (2) in one-piece, covered with a metallic layer, which is electrically connected to at least one conducting path of said substrate (1). Said contact bumps (2) each comprise a well wettable path, extending from the tips to the base thereof and each leading to the corresponding contact bump (2) base in a solder receiving region with suction (11). Therefore, by soldering said contact bumps, excess solder can be sucked off, such that short circuits can be avoided even without the use of a solder resist. By solder contacting said intermediate support, the solder can thus be applied over a large surface on a circuit support and sucked off the cavities between the contact points by reflow soldering.

公开(公告)号：EP1209959A3

公开(公告)日：2004-03-10

申请号：EP01126948.7

申请日：2001-11-13

Applicant: Matsushita Electric Works, Ltd.

Inventor： Uchinono, Yoshiyuki, c/o Matsushita Electric Works ,  Sawada, Kazuo, c/o Matsushita Electric Works ,  Masaki, Yasufumi, c/o Matsushita Electric Works ,  Muto, Masahide, c/o Matsushita Electric Works

IPC: H05K3/46

CPC classification number: H05K1/183 ,  B29L2031/3493 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/027 ,  H05K3/403 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/09645 ,  Y10T29/49155

Abstract: A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate (10) having a first surface (14) and a second surface (15) extending from an end of the first surface (14) at a required angle relative to the first surface (14), and the multilayer circuit formed on the first surface (14) and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer (20,22,24,26) having a required circuit pattern and an insulation layer (30,32,34) formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer (20) formed on the second surface (15) of the substrate.

Abstract translation: 提供具有减小厚度的多层电路的模制互连装置（MID），其中以高可靠性形成层间连接（一个或多个）作为多层电路板。 多层电路板包括具有从第一表面（14）的端部相对于第一表面（14）以所需角度延伸的第一表面（14）和第二表面（15）的基板（10），并且 形成在第一表面（14）上并由多个电路层组成的多层电路。 每个电路层设有具有所需电路图案的导电层（20,22,24,26）和通过成膜在导电层上形成的绝缘层（30,32,34）。 多层电路的层对层连接通过形成在衬底的第二表面（15）上的第二导电层（20）来形成。

公开(公告)号：EP1261243A2

公开(公告)日：2002-11-27

申请号：EP02011219.9

申请日：2002-05-21

Applicant: Matsushita Electric Works, Ltd.

Inventor： Suzuki, Toshiyuki, Matsushita Electric Works, Ltd. ,  Nakagawa, Kazuya, Matsushita Electric Works, Ltd. ,  Kobayashi, Mitsuru, Matsushita Electric Works Ltd. ,  Shiohama, Eiji, Matsushita Electric Works, Ltd. ,  Sugimoto, Masaru, Matsushita Electric Works, Ltd. ,  Kimura, Hideyoshi, Matsushita Electric Works, Ltd. ,  Hashimoto, Takuma, Matsushita Electric Works, Ltd.

IPC: H05K3/24 ,  H05K1/11

CPC classification number: H05K3/242 ,  H05K1/0284 ,  H05K1/0293 ,  H05K3/045 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

Abstract translation: 提供一种有效地制造印刷电路板的方法。 在该方法中，在具有突起的基板上形成金属薄膜。 然后，通过图案化金属薄膜，在基板上形成初始电路图案。 初始电路图案包括彼此隔离的第一和第二电路图案，以及形成在突起上的导电层，以在第一和第二电路图案之间形成临时电连接。 通过电流通过初始电路图案进行电镀，以在初始电路图案上形成额外的金属膜。 在电镀之后，去除突起上的导电层以在第一和第二电路图案之间提供电绝缘。

公开(公告)号：EP1172901A1

公开(公告)日：2002-01-16

申请号：EP01305721.1

申请日：2001-07-02

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko ,  Yamakawa, Shuji ,  Kato, Shinshu

IPC: H01R25/00

CPC classification number: H05K1/0256 ,  H01R4/70 ,  H01R25/00 ,  H05K1/0284 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/10272

Abstract: An electrical connection box is provided for a vehicle which has a low-voltage battery of maximum output voltage selected from 14V and 28V, and a high-voltage battery of output voltage higher than that of said first battery structure. The electrical connection box (3) has an insulation plate and, fixed on one face of said insulation plate, first bus bars (10) connected in use to the first battery and second bus bars (11) connected in use to the second battery so that the first and second bus bars are at different potentials. In order to reduce risk of electrical leakage paths on the insulation plate, at least one of the following features is present:-

(i) the first bus bars (10) and the second bus bars (11) are separated on the face of the insulation plate by an air insulation zone of width in the range 1 to 30 mm,
(ii) an insulation wall stands up on the insulation plate between the first bus bars and the second bus bars,
(iii) the second bus bars (11) are embedded in the insulating material.

Abstract translation: 为车辆提供电气接线盒，该车辆具有选自14V和28V的最大输出电压的低压电池，以及输出电压高于所述第一电池结构的高压电池。 电连接盒（3）具有绝缘板，并且固定在所述绝缘板的一个面上，使用中连接到第一电池的第一母线（10）和与第二电池相连接的第二母线（11） 第一和第二母线处于不同的电位。 为了减少绝缘板上的漏电路径的风险，存在以下特征中的至少一个： - （i）第一母线（10）和第二母线（11）在 绝缘板由宽度范围为1至30mm的空气绝缘区，（ii）绝缘壁在第一母线和第二母线之间的绝缘板上竖立，（iii）第二母线（11） 嵌入绝缘材料中。

公开(公告)号：EP1124710A1

公开(公告)日：2001-08-22

申请号：EP99956668.0

申请日：1999-10-26

Applicant: Lear Automotive Dearborn, Inc.

Inventor： DAVIS, Joseph, J., Jr. ,  O'BRIEN, Timothy, F.

IPC: B60R16/02

CPC classification number: B60R16/0215 ,  B60R16/0207 ,  H05K1/0284 ,  H05K3/14 ,  H05K2201/09045

Abstract: A trim panel includes a plurality of ribs projecting from a surface of the trim panel. Fluent, conductive material is sprayed onto the ribs at an angle such that distinct electrical traces are formed on each rib. The gauge of each electrical trace can be determined by varying the height of each rib. The gauge of each electrical trace can also be determined by varying the angle of the rib relative to the surface of the trim panel.