公开(公告)号：EP2524389B1

公开(公告)日：2016-06-15

申请号：EP11700251.9

申请日：2011-01-10

Applicant: Elmos Semiconductor Aktiengesellschaft

Inventor： TEN HAVE, Arnd

IPC: B81C99/00

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B3/0021 ,  B81B3/007 ,  B81B3/0072 ,  B81B3/0081 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00626 ,  B81C99/0035 ,  B81C2201/019 ,  G01L9/0047 ,  H01L29/4916 ,  H01L29/84

公开(公告)号：EP2844419A4

公开(公告)日：2016-03-30

申请号：EP13780717

申请日：2013-04-25

Applicant: ALERE SAN DIEGO INC

Inventor： OLSSON ERIK MIKAEL ,  RIVERON JONATHAN ,  TOVAR ARMANDO RAUL

IPC: B29C65/08 ,  B29C59/16 ,  B29C65/16 ,  B29C65/72 ,  B29C65/78 ,  B81C3/00

CPC classification number: B29C65/7855 ,  B23K26/244 ,  B23K26/324 ,  B23K26/60 ,  B23K2203/30 ,  B29C59/16 ,  B29C65/08 ,  B29C65/1606 ,  B29C65/1609 ,  B29C65/1612 ,  B29C65/1616 ,  B29C65/1632 ,  B29C65/1635 ,  B29C65/1654 ,  B29C65/1664 ,  B29C65/1677 ,  B29C65/1683 ,  B29C65/1696 ,  B29C65/72 ,  B29C66/0246 ,  B29C66/028 ,  B29C66/1122 ,  B29C66/21 ,  B29C66/232 ,  B29C66/234 ,  B29C66/24244 ,  B29C66/30223 ,  B29C66/3452 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/73361 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/836 ,  B29C66/9513 ,  B29C2035/0838 ,  B29C2791/009 ,  B29K2995/0027 ,  B29L2009/00 ,  B29L2031/756 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0143 ,  B81C2201/019 ,  Y10T156/1039 ,  Y10T156/1064 ,  B29K2025/06 ,  B29K2069/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2071/00 ,  B29K2909/08

Abstract: The present invention relates to methods for joining materials as well as articles manufactured using such processes. The invention pertains to a process for joining a first substrate to a second substrate. The process includes irradiating a portion of a first substrate with a laser beam having a first wavelength and intensity sufficient to increase the absorbance of the first substrate to light having a second, different wavelength. The laser beam may carbonize at least a portion of the irradiated portion of the first substrate imparting a higher absorbance to light than non-irradiated portions of the first substrate. A second substrate is then placed in contact with the irradiated portion of the first substrate. The first substrate is then irradiated with a second laser having a second wavelength, different to the first wavelength; with a sufficient intensity to heat and, preferably melt, the irradiated portion of the first substrate.

公开(公告)号：EP2876078A2

公开(公告)日：2015-05-27

申请号：EP14193909.0

申请日：2014-11-19

Applicant: Rofin-Sinar Technologies, Inc.

Inventor： Hosseini, S. Abbas

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B23K26/0069 ,  B23K26/0604 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/382 ,  B23K26/40 ,  B23K2203/50 ,  B81C1/00634 ,  B81C2201/019 ,  B81C2203/036 ,  B81C2203/038 ,  C03B33/0222 ,  C03B33/04 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/0756 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.

Abstract translation: 一种制造使用多个透明基板的机电芯片的方法，包括以下步骤：使用光声压缩来加工所述多个基板中的至少一个中的全部或部分空隙。 多个透明基板以特定顺序堆叠布置。 将透明基板固定并密封在一起。 芯片可以通过激光焊接或粘合剂密封。

公开(公告)号：EP2029475A4

公开(公告)日：2014-08-06

申请号：EP07743258

申请日：2007-05-08

Applicant: SEMICONDUCTOR ENERGY LAB

Inventor： YAMAGUCHI MAYUMI ,  IZUMI KONAMI

IPC: B81C3/00 ,  B81B3/00

CPC classification number: H01L21/762 ,  B32B38/10 ,  B81C3/008 ,  B81C2201/019 ,  Y10T428/24802

公开(公告)号：EP2455331B1

公开(公告)日：2014-06-18

申请号：EP11190203.7

申请日：2011-11-22

Applicant: Honeywell International, Inc.

Inventor： Horning, Robert D. ,  Supino, Ryan

IPC: H01L21/768 ,  H01L25/065

CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

公开(公告)号：EP2523895B1

公开(公告)日：2014-06-04

申请号：EP11700162.8

申请日：2011-01-10

Applicant: ELMOS Semiconductor AG

Inventor： TEN HAVE, Arnd Dr.

IPC: B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B3/0021 ,  B81B3/007 ,  B81B3/0072 ,  B81B3/0081 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00626 ,  B81C99/0035 ,  B81C2201/019 ,  G01L9/0047 ,  H01L29/4916 ,  H01L29/84

公开(公告)号：EP2624290A3

公开(公告)日：2014-04-16

申请号：EP13166078.9

申请日：2009-04-03

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC: H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

Abstract: An interposer comprises a substrate and a plurality of posts. Each of the posts extends substantially through a thickness of the substrate. A method for forming an interposer comprises forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts.

公开(公告)号：EP2628708A1

公开(公告)日：2013-08-21

申请号：EP13154830.7

申请日：2013-02-11

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Baillin, Xavier ,  Pornin, Jean-Louis

IPC: B81C1/00

CPC classification number: B81C1/00134 ,  B81B3/0018 ,  B81B7/0038 ,  B81C1/00357 ,  B81C2201/0108 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L21/2007

Abstract: Substrat microélectronique (400) comportant au moins :
- une couche support (102),
- une couche supérieure (106) composée d'au moins un semi-conducteur,
- une couche intermédiaire (104) composée d'au moins un matériau organique et comportant en outre une ou plusieurs portions (402) de matériau diélectrique dont la dureté est supérieure à celle du matériau organique. Ces portions sont disposées dans la couche de matériau organique et ont une épaisseur sensiblement égale à celle de la couche de matériau organique. La couche intermédiaire (104) est apte à être gravé sélectivement par rapport au semi-conducteur de la couche supérieure et est disposée entre la couche support et la couche supérieure. L'invention décrit également un procédé de réalisation d'un dispositif microélectronique dans la couche supérieure du substrat ci-mentionné, ainsi qu'un procédé d'encapsulation de ce dispositif.

Abstract translation: 衬底（100）具有支撑层（102）和顶层（106），其中顶层包括半导体。 层（104）由有机材料即感光树脂制成，能够通过使用干蚀刻相对于顶层的半导体选择性地被蚀刻，并且布置在支撑层和顶层之间。 吸气材料层布置在支撑层和有机材料层之间。 有机材料层中的电介质材料部分形成封闭的轮廓。 还包括以下独立权利要求：（1）微电子基板的制造方法（2）微电子器件的制造方法。

公开(公告)号：EP2626883A1

公开(公告)日：2013-08-14

申请号：EP12188218.7

申请日：2012-10-11

Applicant: Samsung Electronics Co., Ltd

Inventor： Baik, Chan-wook ,  Ahn, Ho-young ,  Kim, Yong-sung

IPC: H01J25/34 ,  H01J25/48

CPC classification number: H01J25/34 ,  B81B2201/0271 ,  B81C1/00063 ,  B81C1/00619 ,  B81C2201/019 ,  H01J25/40 ,  H01J25/48

Abstract: Electromagnetic wave oscillators each having a multi-tunnel and electromagnetic wave generating apparatuses including the electromagnetic wave oscillators are provided. The electromagnetic wave oscillator includes: a first waveguide (130) which has a folded structure such that a path traveled by an electromagnetic wave through the first waveguide crosses an axial direction a plurality of times; an electron beam tunnel (131) through which an electron beam passes, wherein the electron beam tunnel extends along the axial direction and crosses the first waveguide a plurality of times; and at least one auxiliary tunnel (139) which extends parallel to the electron beam tunnel and which crosses the first waveguide a plurality of times.

Abstract translation: 电磁波振荡器的每个具有多隧道和电磁波发生装置包括电磁波振荡器提供。 电磁波振荡器，包括：第一波导（130），其具有检测做了路径行进通过在通过第一波导电磁波横穿的次数的多个轴向方向上的折叠结构; 于通过其的电子束穿过，worin电子束隧道沿轴向延伸并穿过所述第一波导的次多个电子束隧道（131）; 和平行于电子束隧道延伸，并且其中至少一个辅助隧道（139）横穿所述第一波导的次多个的情况。

公开(公告)号：EP2624289A2

公开(公告)日：2013-08-07

申请号：EP13166066.4

申请日：2009-04-03

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC: H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13

CPC classification number: H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

Abstract: An electronic module comprises a substrate having a plurality of cavities. A die is encapsulated within each cavity. A post defines at least a portion of an electrical connection through the substrate.

Abstract translation: 电子模块包括具有多个空腔的基板。 模具被封装在每个腔内。 支柱限定通过基板的电连接的至少一部分。