公开(公告)号：EP2226346A1

公开(公告)日：2010-09-08

申请号：EP08791811.6

申请日：2008-07-29

Applicant: Panasonic Electric Works Co., Ltd

Inventor： FUJISAWA, Hiroyuki ,  TAMIYA, Hiroki

IPC: C08G59/32 ,  B32B15/08 ,  C08G59/62 ,  C08J5/24 ,  C08K3/22 ,  C08K7/18 ,  C08L63/00 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0373 ,  B32B5/024 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2457/08 ,  C08G59/38 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/08 ,  C08K3/22 ,  C08K3/36 ,  C08K5/13 ,  C08L63/00 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31529 ,  C08L2666/22

Abstract: The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide.

Abstract translation: 本发明提供一种环氧树脂组合物，其在钻井，成型和脱模中表现出良好的加工性能以及良好的层间粘合强度。 该环氧树脂组合物包含环氧树脂，固化剂和无机填料。 环氧树脂由二环戊二烯系环氧树脂和酚醛清漆型环氧树脂构成。 固化剂是联苯基酚醛树脂。 无机填料由具有环氧硅烷处理表面的氢氧化铝和粒状二氧化硅构成。 环氧树脂组合物含有20〜50重量％的粒状二氧化硅。 环氧树脂组合物含有2〜15重量％，相对于粒状二氧化硅的总重量为氢氧化铝。

公开(公告)号：EP2053907A2

公开(公告)日：2009-04-29

申请号：EP08166610.9

申请日：2008-10-14

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Oberlin, Gary E.

IPC: H05K3/28 ,  H05K1/14

CPC classification number: H05K3/284 ,  B29C45/14377 ,  B29C45/14418 ,  B29C45/14639 ,  B29C45/14836 ,  B29C45/72 ,  H05K1/118 ,  H05K1/147 ,  H05K3/361 ,  H05K5/065 ,  H05K2201/0239 ,  H05K2203/1121 ,  H05K2203/1316 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/5193

Abstract: An electronic assembly including a circuit board (16) and a flexible circuit interconnect (14) is overmolded by fixturing the assembly in a mold cavity such that a portion of the flexible circuit (14) protrudes from the mold, and providing a compressible elastomeric interface (18a/20a, 32) between the mold (18, 20) and the flexible circuit (14) to seal off the mold cavity and protect the flexible circuit (14) from damage due to the clamping force of the mold (18, 20). The portion of the flexible circuit (14) within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound (30), and a heat exchanger (26) thermally coupled to the portion of the flexible circuit (14) that protrudes from the mold protects the flexible circuit (14) from damage due to thermal conduction from the mold (18, 20) and mold compound (30).

Abstract translation: 一种电子组件，其包括一电路板（16）和柔性电路互连（14）由在模腔中搜索装夹组件包覆模制做的柔性电路（14）的部分从模具中突出，并且提供了一个可压缩的弹性界面 所述模具（18,20）和所述柔性电路（14）之间（18A / 20A，32），以封闭所述模具腔，并保护免受损坏柔性电路（14）由于模具的夹紧力（18，20 ）。 在模腔内的柔性电路（14）的所述部分是预涂覆有材料确实确保与热耦合到所述柔性电路的所述部分的模制化合物（30），和一个热交换器（26）良好的粘附性（14 ）由于从模具（热传导18，20）和模制化合物（30那样突出从模具中免受损坏柔性电路（14））。

公开(公告)号：EP1387367B1

公开(公告)日：2007-01-10

申请号：EP02710342.3

申请日：2002-01-24

Applicant: JSR Corporation

Inventor： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  YOSHIMURA, Nakaatsu, c/o JSR CORPORATION

IPC: H01B3/00 ,  H01B3/12 ,  C08K3/22 ,  C08K9/00 ,  H05K1/03 ,  H01G4/20 ,  C08K9/02 ,  C08K9/04

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 形成电介质组合物雅定到本发明通过由......组成为特征：在其中部分或电介质都具有30或更大的介电常数的无机颗粒的表面的复合颗粒被涂覆有导电金属或它们的化合物，或导电 有机化合物或传导性无机材料; 和（B）的树脂成分构成的聚合性化合物和聚合物中的至少一种制成。 另外，另一种电介质形成用组合物雅鼎的发明是通过含有为特征：（J）具有0.1微米或更小，并且平均粒径的无机超微粒子构成超细颗粒 - 树脂复合粒子（B ）的树脂成分构成的聚合性化合物和聚合物中的至少一种的，worin部分或全部涂有树脂成分（B）的无机超微粒子（J）的表面的，和超细颗粒的树脂复合粒子 含有20％（重量）或更多的无机超微粒子（J）的; 并用0.1〜2微米的平均粒径和30或更大的介电常数，或无机复合颗粒的无机颗粒，其中导电金属或它们的化合物，或导电性有机化合物或导电无机材料沉积在所述部分 或全部的无机颗粒的表面。

公开(公告)号：EP1335389A4

公开(公告)日：2006-08-02

申请号：EP01934417

申请日：2001-05-30

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： WAKIYA TAKESHI ,  MORITA TAKEHARU ,  HIRAIKE HIROSHI ,  NAGAI KATSUTOSHI ,  TANIGUCHI TATSUO

IPC: C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H01B5/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: Coated particles having excellent connection reliability. The coated particles each comprises a core particle having a surface layer made of a metal, wherein the core surface has been partly modified with an organic compound through a functional group (A) having bondability to the metal.

公开(公告)号：EP1103575B1

公开(公告)日：2006-02-08

申请号：EP00250395.1

申请日：2000-11-22

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： Nakamura, Yoshihiko ,  Asano, Takuya ,  Ogasawara, Kenji ,  Ito, Naoki

IPC: C08K5/5313 ,  C08G59/14 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08G59/245 ,  C08G59/4071 ,  C08G59/621 ,  C08K5/5313 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  C08L63/00

公开(公告)号：EP0864248B1

公开(公告)日：2005-07-27

申请号：EP97916913.3

申请日：1997-03-21

Applicant: Isola Laminate Systems Corporation

Inventor： TUNGARE, Aroon, Vishwanath ,  RICHGELS, Scott, Harold ,  KAMLA, Jeffrey, Robert ,  CONN, Peggy, Mae

IPC: H05K1/03 ,  C08K3/34

CPC classification number: H05K1/0373 ,  C08K3/34 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31511 ,  C08L63/00

Abstract: Epoxy laminates incorporate up to 20 wt.% talc particles, particularly pure Montana platy talc particles having a maximum particle size of about 40 νm providing improved drilling performance, reduced dust formation, and improved Z-direction CTE, particularly when the epoxy resin has a Tg of about 150 °C or higher. The talc is selected from those which do not significantly reduce the electrical strength of the laminate relative to those which contain no talc particles. Characteristically, the talcs will have less than 5 wt.% impurities and less than 0.01 wt.% (100 wt.ppm) water extractable anions.

公开(公告)号：EP1335389A1

公开(公告)日：2003-08-13

申请号：EP01934417.5

申请日：2001-05-30

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： WAKIYA, Takeshi c/o Sekisui Chemical Co., Ltd. ,  MORITA, Takeharu c/o Sekisui Chemical Co., Ltd. ,  HIRAIKE, Hiroshi c/o Sekisui Chemical Co., Ltd. ,  NAGAI, Katsutoshi ,  TANIGUCHI, Tatsuo

IPC: H01B5/00 ,  C08F2/44 ,  C08F292/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: It is an object of the invention to provide coated particles excellent in the reliability of connection.
The invention provides coated particles each comprising a metal-surfaced particle as a core and resulting from a partial surface modification of that core particle with an organic compound via a functional group (A) capable of binding to a metal.

Abstract translation: 本发明的目的是提供连接可靠性优异的涂覆颗粒。 本发明提供了包含金属表面的颗粒作为核心并由有机化合物通过能够与金属结合的官能团（A））部分地表面改性核心颗粒的涂层颗粒。

公开(公告)号：EP1060141B1

公开(公告)日：2002-10-30

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce E. ,  ROBERTSON, Walter, J.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

Abstract translation: 本发明提供了用非研磨固体颗粒浸渍的玻璃纤维丝束，其在丝束内的相邻纤维之间提供至少3微米的间隙，这对于增强复合材料是有用的。

公开(公告)号：EP1204698A1

公开(公告)日：2002-05-15

申请号：EP00950817.7

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C08J5/08 ,  C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和在300K的温度下具有至少1瓦/米K的热导率的层状颗粒。 本发明还提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和不可水合的层状颗粒。 本发明还提供至少部分涂覆的纤维束，其包含多种纤维，所述纤维束在至少一种所述纤维的至少一部分表面上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 由选自非热膨胀性有机材料，无机聚合物材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有足以使纤维束湿润的平均粒度; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供至少部分涂覆的纤维束，其包含多种玻璃纤维，所述纤维束在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供一种至少部分涂覆的纤维束，其包含多种玻璃纤维，所述玻璃纤维在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）多个中空非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：EP1204696A1

公开(公告)日：2002-05-15

申请号：EP00950780.7

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供至少部分涂覆的纤维束，其包含多个玻璃纤维，所述玻璃纤维在至少一个所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供了树脂相容涂料组合物的用途，该组合物包含：（a）由选自非热膨胀性有机材料，无机聚合材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒， 平均粒度足以使纤维束湿润的颗粒; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 该树脂相容性涂料组合物还可以包含：（a）多个中空的非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。