公开(公告)号：EP1605738A1

公开(公告)日：2005-12-14

申请号：EP05007800.5

申请日：2005-04-08

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Aizawa, Mitsuhiro Shinko Elec. Industri., Co. Ltd ,  Higashi, Mitsutoshi

IPC: H05K3/40 ,  H01L21/48

CPC classification number: H05K3/4046 ,  H01L21/486 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2924/09701 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/0195 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

Abstract: A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific structure, is free from surface relief shapes and internal voids, and enables conduction processing simply, in a short time, at a low cost utilizing existing facilities, wherein the conduction processing of the through holes includes a step of press fitting a conductor (20) into the through holes (10) by a ball bonder and a step of flattening the exposed heads of the press-fit conductors (20A) by coining.

Abstract translation: 用于制造半导体封装的方法，其能够对由传导处理覆盖的所有通孔进行均匀的导电处理而不受任何特定结构的限制，但是没有表面浮雕形状和内部空隙，并且能够在短时间内简单地进行导通处理 利用现有设备以低成本，其中通孔的传导处理包括通过球接合器将导体压入通孔的步骤和通过压印使压配合导体的暴露头平坦化的步骤。

公开(公告)号：EP1577979A1

公开(公告)日：2005-09-21

申请号：EP05101799.4

申请日：2005-03-08

Applicant: Tyco Electronics AMP K.K.

Inventor： Ikeda, Yuji ,  Maruyama, Kiyomi ,  Yamagami, Hidehisa ,  Kawahara, Yuzo

IPC: H01R12/32

CPC classification number: H01R12/58 ,  H05K3/42 ,  H05K2201/0382 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2203/0195 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/5307 ,  Y10T29/53174

Abstract: The object of the present invention is to provide a board through-hole working method which makes it possible to form in a circuit board a through-hole that does not strip metal plating away when a press-fit contact is inserted, with the amount of wear of a jig being minimized. The board through-hole working method is a board through-hole working method for working a through-hole (for the insertion of the press-fit contact 101) that is bored in a circuit board (PCB) and that is formed with a conductor (51). The method comprises a step of beveling the corner edge of a through-hole (50) following the formation of the conductor (51). This beveling is performed by the pressing of a pointed jig.

公开(公告)号：EP1328142A3

公开(公告)日：2005-03-09

申请号：EP02028224.0

申请日：2003-01-01

Applicant: ROBERT BOSCH GMBH

Inventor： Uhland, Thomas ,  Beckbissinger, Kai ,  Mueller-Hirsch, Wolfgang ,  Schinzel, Ralf ,  Hennel, Udo

IPC: H05K3/20 ,  H05K7/14

CPC classification number: H05K3/202 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10651

Abstract: Es wird eine Schaltungsanordnung vorgeschlagen, die sich zum einen sehr kompakt realisieren lässt und zum anderen Schwingungsbelastungen sehr gut standhält.
Die Schaltungsanordnung ist zumindest teilweise auf einer ersten Leiterplatte (4) realisiert und umfasst mindestens ein bedrahtetes Bauelement (14, 15). Das bedrahtete Bauelement (14, 15) ist erfindungsgemäß auf einem eigenen Bauelementeträger (5) angeordnet. Außerdem sind die erste Leiterplatte (4) und der Bauelementeträger (5) übereinander angeordnet und mechanisch miteinander verbunden.

Abstract translation: 提出一种电路装置，一方面可以非常紧凑地实现，另一方面非常好地承受振动载荷。 该电路装置至少部分地在第一印刷电路板（4）上实现并且包括至少一个有线部件（14,15）。 根据本发明的引线部件（14,15）布置在单独的部件载体（5）上。 此外，第一印刷电路板（4）和部件载体（5）一个在另一个之上并且机械连接到彼此。

公开(公告)号：EP1504636A1

公开(公告)日：2005-02-09

申请号：EP03740657.6

申请日：2003-04-23

Applicant: DAV

Inventor： LAURENT, Patrice ,  MEYNET, Marc ,  DEVILLER, Cécile ,  HERVIEU, Marc

IPC: H05K5/00 ,  H05K7/20 ,  B60R16/02 ,  H05K1/02

CPC classification number: B60R16/0239 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/202 ,  H05K7/20854 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/063 ,  Y10S439/949

Abstract: The invention concerns a power switching device comprising semiconductor members (60) having drain, gate and source connections. Said members (60) are brazed through their drain sole plates on the bosses of an electrically conductive cooling plate (20) while the gates and the sources (62, 63) of the semiconductor members (60) are connected to a control circuit and to power connectors through a routing circuit (40) arranged globally parallel proximate said plate (20) but separated therefrom by a spacer (30) and comprising openings (42) corresponding to the flat bosses of the subjacent plate (20), the latter being in a plane proximate the routing circuit (40), whereby the connection of the semiconductor members (60) to the plate (20) and the routing circuit (40) can be provided substantially in the same plane.

公开(公告)号：EP1389407A1

公开(公告)日：2004-02-18

申请号：EP02747159.8

申请日：2002-05-22

Applicant: Pac Tech - Packaging Technologies GmbH ,  Smart Pac GmbH Technology Services

Inventor： ZAKEL, Elke ,  AZDASHT, Ghassem

IPC: H05K3/40

CPC classification number: H05K3/3478 ,  H01L2224/11334 ,  H05K3/4038 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/041

Abstract: The invention relates to a method for producing a contact substrate (10), and to a contact substrate comprising via holes between a connecting conductor arrangement (21) situated on an upper side of a dielectric carrier substrate (12), and a lower side of the carrier substrate. Said connecting conductor arrangement extends along an opening edge (22) of a substrate recess (15) and the lower side (11) of the carrier substrate (12) is supported on a counter holder (23). A moulded body of solder material (24) is inserted into the substrate recess (15), and is then deformed inside said substrate recess in order to form a contact moulded body (50), in such a way that an inner surface (28) of the substrate recess is connected to the connecting conductor arrangement (21) in a non-positive manner by radially displacing the solder material of the moulded body in the substrate recess, and the contact moulded body forms a via hole between the connecting conductor arrangement (21) and the lower side (11) of the carrier substrate.

公开(公告)号：EP1039539A3

公开(公告)日：2004-02-04

申请号：EP00105950.0

申请日：2000-03-23

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Naba, Takayuki ,  Mizunoya, Nobuyuki

IPC: H01L23/373

CPC classification number: H01L23/3735 ,  C04B35/6365 ,  C04B37/026 ,  C04B2235/96 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/405 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/706 ,  H01L24/32 ,  H01L2224/27013 ,  H01L2224/32 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/341 ,  H05K3/38 ,  H05K3/4092 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/0382 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate; a plurality of metal circuit plates bonded to a surface of the ceramic substrate; and parts including semiconductor element integrally bonded to a surface of the metal circuit plates through a solder layer, wherein at least peripheral portion of one metal metal circuit plate to which the parts are solder-bonded and is adjacent to the other metal circuit plates is formed with a projection for preventing solder-flow. According to the structure described above, there can be provided a ceramic circuit board which is free from short-circuit due to the solder-flow or bonding defects of the parts thereby to have an excellent operating reliability, and is capable of being easily mass-produced with a high production yield.

Abstract translation: 本发明提供一种陶瓷电路板，包括：陶瓷基板; 多个金属电路板，其结合到所述陶瓷基板的表面; 以及包括通过焊料层一体地结合到金属电路板的表面的半导体元件的部件，其中形成有焊接在一起的金属电路板的至少周边部分并与其它金属电路板相邻的部分 具有用于防止焊料流动的突起。 根据上述结构，可以提供一种陶瓷电路板，其由于焊料流动或部件的接合缺陷而没有短路，因此具有优异的操作可靠性，并且能够容易地进行质量 - 产量高，产量高。

公开(公告)号：EP1348234A1

公开(公告)日：2003-10-01

申请号：EP01272987.7

申请日：2001-12-19

Applicant: Telefonaktiebolaget L M Ericsson (Publ)

Inventor： OLOFSSON, Lars-Anders

IPC: H01L21/60 ,  H01L23/535 ,  H05K7/02 ,  H05K1/02

CPC classification number: H05K3/4046 ,  H05K1/0204 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: The present invention relates to a method of providing thermal vias in a printed circuit board that includes one or more layers of board material, for conducting heat from components mounted on and/or in the board through said board through said board and away therefrom, and also relates to a printed cirucit board that includes vias arranged in accordance with method. One or more holes (4) are provided in a printed circuit board that includes several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

公开(公告)号：EP1328142A2

公开(公告)日：2003-07-16

申请号：EP02028224.0

申请日：2003-01-01

Applicant: ROBERT BOSCH GMBH

Inventor： Uhland, Thomas ,  Beckbissinger, Kai ,  Mueller-Hirsch, Wolfgang ,  Schinzel, Ralf ,  Hennel, Udo

IPC: H05K3/20 ,  H05K7/14

CPC classification number: H05K3/202 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/301 ,  H05K3/305 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10651

Abstract: Es wird eine Schaltungsanordnung vorgeschlagen, die sich zum einen sehr kompakt realisieren lässt und zum anderen Schwingungsbelastungen sehr gut standhält.
Die Schaltungsanordnung ist zumindest teilweise auf einer ersten Leiterplatte (4) realisiert und umfasst mindestens ein bedrahtetes Bauelement (14, 15). Das bedrahtete Bauelement (14, 15) ist erfindungsgemäß auf einem eigenen Bauelementeträger (5) angeordnet. Außerdem sind die erste Leiterplatte (4) und der Bauelementeträger (5) übereinander angeordnet und mechanisch miteinander verbunden.

Abstract translation: 该布置至少部分地实现在电路板（4）上并且包含安装在部件载体（5）上的至少一个有线部件。 组件载体彼此并排设置并机械连接在一起。 在第一电路板上实现的部件和级之间的电连接通过部件载体进行。 AN还包括以下的独立权利要求：具有本发明电路装置的发动机控制器。

公开(公告)号：EP1091626A1

公开(公告)日：2001-04-11

申请号：EP99919564.7

申请日：1999-05-13

Applicant: Rohm Co., Ltd.

Inventor： NAKAMURA, Satoshi

IPC: H05K1/14 ,  H01M2/10

CPC classification number: H05K1/148 ,  H01M2/1061 ,  H01M2/20 ,  H01M2/30 ,  H01M2/34 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/36 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0382 ,  H05K2201/1028

Abstract: A protective circuit device (3) according to the present invention prevents overcharge to a storage battery (2). Protective circuit device (3) has a circuit board body (32) with a prescribed circuit pattern, and island portions (33, 34) having on their surfaces a plurality of external terminals (30) and connected to circuit board body (32) through a metal piece (35, 36). Island portions (33, 34) preferably includes first and second islands. First island (33) preferably has an external terminal (30) and is parallel to circuit board body (32). Second island (34) is preferably arranged between first island (33) and circuit board body (32) and is vertical to circuit board body (32).

Abstract translation: 根据本发明的保护电路装置（3）防止对蓄电池（2）过充电。 保护电路装置（3）具有：具有规定的电路图案的电路基板主体（32）;在表面具有多个外部端子（30）并与电路基板主体（32）连接的岛部（33,34） 一个金属片（35,36）。 岛部分（33,34）优选地包括第一和第二岛。 第一岛（33）优选具有外部端子（30）并且平行于电路板主体（32）。 第二岛（34）优选地布置在第一岛（33）和电路板主体（32）之间并且与电路板主体（32）垂直。

公开(公告)号：EP1039539A2

公开(公告)日：2000-09-27

申请号：EP00105950.0

申请日：2000-03-23

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Naba, Takayuki ,  Mizunoya, Nobuyuki

IPC: H01L23/373

CPC classification number: H01L23/3735 ,  C04B35/6365 ,  C04B37/026 ,  C04B2235/96 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/405 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/706 ,  H01L24/32 ,  H01L2224/27013 ,  H01L2224/32 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/341 ,  H05K3/38 ,  H05K3/4092 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/0382 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate; a plurality of metal circuit plates bonded to a surface of the ceramic substrate; and parts including semiconductor element integrally bonded to a surface of the metal circuit plates through a solder layer, wherein at least peripheral portion of one metal metal circuit plate to which the parts are solder-bonded and is adjacent to the other metal circuit plates is formed with a projection for preventing solder-flow. According to the structure described above, there can be provided a ceramic circuit board which is free from short-circuit due to the solder-flow or bonding defects of the parts thereby to have an excellent operating reliability, and is capable of being easily mass-produced with a high production yield.

Abstract translation: 本发明提供一种陶瓷电路板，包括：陶瓷基板; 多个金属电路板，其结合到所述陶瓷基板的表面; 以及包括通过焊料层一体地结合到金属电路板的表面的半导体元件的部件，其中形成有焊接在一起的金属电路板的至少周边部分并与其它金属电路板相邻的部分 具有用于防止焊料流动的突起。 根据上述结构，可以提供一种陶瓷电路板，其由于焊料流动或零件的接合缺陷而不会发生短路，从而具有优异的操作可靠性，并且能够容易地进行质量 - 产量高，产量高。