公开(公告)号：EP2225807A1

公开(公告)日：2010-09-08

申请号：EP08864519.7

申请日：2008-12-11

Applicant: Continental Automotive GmbH

Inventor： LOIBL, Josef ,  ROBIN, Hermann-Josef ,  SMIRRA, Karl

IPC: H01R43/02 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01L2924/0002 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/10416 ,  H05K2203/107 ,  H01L2924/00

Abstract: The invention relates to a method for producing an electrical connection between a rigid circuit board (1) and a metal contact partner (2), having the following steps: -preparing the rigid circuit board (1) comprising at least one copper layer (3) and at least one prepreg layer (5) - bringing the metal contact partner (2) and the circuit board (1) together, such that the metal contact partner (2) is brought into contact with a contact pad (7) on the copper layer (3) of the circuit board (1); - forming a recess in the circuit board (1) by removing the prepreg layer (5) in at least one partial region of the contact pad (7), and - irradiating with laser light (9), wherein a weld connection is formed between the contact partner (2) and the contact pad (7). The invention further relates to an arrangement of a rigid circuit board (1), a metal contact partner (2) and an electrical connection point, and a module comprising such an arrangement.

公开(公告)号：EP2070343A4

公开(公告)日：2010-08-25

申请号：EP07811343

申请日：2007-08-16

Applicant: DELPHI TECH INC

Inventor： HUNTZINGER JOSEPH K ,  COADY MICHAEL G ,  CARMAN DAN D

IPC: G04G5/00 ,  G04G7/02

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2135839A2

公开(公告)日：2009-12-23

申请号：EP09006279.5

申请日：2009-05-08

Applicant: Garmin Ltd.

Inventor： Kulach, Christopher J. ,  MacDonald, Paul R.

IPC: B81B7/00

CPC classification number: B81B7/0054 ,  B81B2201/0235 ,  B81B2207/096 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09081 ,  H05K2201/10151

Abstract: A system for improving the performance of a microelectromechanical systems (MEMS) device that is housed in a package and implemented on a printed circuit board (PCB) comprises a footprint, an isolation channel, and a bridge. A portion of the isolation channel is removed to mechanically isolate the MEMS device.

Abstract translation: 一种提高微机电系统（MEMS）器件的性能没有系统被容纳在封装中并实现在印刷电路板（PCB）包括在隔离通道的覆盖区，和一个桥。 隔离通道的一部分被去除，以机械隔离MEMS器件。

公开(公告)号：EP1991040A3

公开(公告)日：2009-09-30

申请号：EP08155950.2

申请日：2008-05-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Yokai, Takahiko

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09081 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction.

公开(公告)号：EP2055162A2

公开(公告)日：2009-05-06

申请号：EP07836859.4

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SNIDER, Chris R. ,  GUPTA, Vineet ,  HUNTZINGER, Joseph K. ,  COADY, Michael G.

IPC: H05K9/00

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2055161A2

公开(公告)日：2009-05-06

申请号：EP07836856.0

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SNIDER, Chris, R. ,  GUPTA, Vineet ,  HUNTZINGER, Joseph, K. ,  COADY, Michael, G. ,  STAPERT, Curtis, A. ,  MEYER, Kevin, E. ,  GARNER, Timothy, D. ,  BELL, Jeffrey, T. ,  VADAS, Robert, L. ,  MOESCHBERGER, Donald, G. ,  OBERLIN, Allen, E. ,  BURTON, Paul, C.

IPC: H05K9/00 ,  H05K7/20

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2055143A2

公开(公告)日：2009-05-06

申请号：EP07811342.0

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： GUPTA, Vineet ,  HUNTZINGER, Joseph, K. ,  COADY, Michael, G. ,  CARMAN, Dan, D. ,  REED, William, R.

IPC: H04R29/00 ,  H04B1/00

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2054269A2

公开(公告)日：2009-05-06

申请号：EP07836836.2

申请日：2007-08-16

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： SNIDER, Chris, R. ,  GUPTA, Vineet ,  COADY, Michael, G. ,  STAPERT, Curtis, Allen ,  MOESCHBERGER, Donald, G. ,  OBERLIN, Allen, E.

IPC: B60R5/00 ,  H04B1/08

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP1868242A3

公开(公告)日：2009-02-18

申请号：EP07011562.1

申请日：2007-06-13

Applicant: Hitachi, Ltd.

Inventor： Oyama, Kazuhiro ,  Mori, Mutsuhiro ,  Saito, Katsuaki ,  Koike, Yoshihiko

IPC: H01L25/00 ,  H01L25/07 ,  H01L25/065

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An elastic printed board (102) is provided so that stress applied by the silicon gel (101) is absorbed by the printed board (102). Further, the printed board (102) is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate (105).

Abstract translation: 提供弹性印刷电路板（102），使得由硅胶（101）施加的应力被印刷电路板（102）吸收。 此外，印刷电路板（102）形成为如此狭窄，使得应力可能逸出。 另一方面，施加高电压的导线在相应的印刷电路板上图案化。 这用于防止通过作为当前通道的相同印刷电路板的表面放电。 该设计使得能够密封电源模块，防止潮湿或污染的侵入以及盖板（105）的位移，转换和裂纹。

公开(公告)号：EP1450439A3

公开(公告)日：2008-12-10

申请号：EP04002351.7

申请日：2004-02-03

Applicant: Tyco Electronics AMP GmbH

Inventor： Reissmann, Tobias

IPC: H01R4/48

CPC classification number: H01R12/58 ,  H01R4/4818 ,  H01R12/718 ,  H05K1/118 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09954 ,  H05K2201/1059

Abstract: Die Erfindung beschreibt eine Kontaktanordnung zur Kontaktierung eines Kontaktstiftes, wobei als Kontaktelement zwei sich gegenüberstehende Reihen von Kontaktzungen verwendet werden.
Die Kontaktzungen einer Reihe erstrecken sich bis in Zwischenräume von Kontaktzungen der gegenüberliegenden Reihe.
Durch die Verwendung von Kontaktzungen, die sich über eine Mittenachse des Kontaktelementes erstrecken, ist eine elektrische Kontaktierung eines Kontaktstiftes mit guter Leitfähigkeit möglich, obwohl dessen Position seitlich aus der Mittenachse verschoben ist. Vorzugsweise stehen sich Reihen von unterschiedlich langen Kontaktzungen gegenüber, wobei einer kurzen Kontaktzunge einer ersten Reihe eine lange Kontaktzunge einer zweiten Reihe zugeordnet ist. Vorzugsweise sind zwei identisch aufgebaute Kontaktelemente übereinander angeordnet, wobei jeweils eine lange und eine kurze Kontaktzunge übereinander angeordnet sind. Die kurzen Kontaktzungen dienen zur Erhöhung der Anpresskraft der langen Kontaktzungen. Auf diese Weise kann eine verbesserte elektrische Kontaktierung von Kontaktstiften mit einer flexiblen Leiterplatte, insbesondere von elektrischen Relais mit einer flexiblen Leiterplatte erreicht werden.