公开(公告)号：EP1026928A3

公开(公告)日：2003-02-05

申请号：EP00300553.5

申请日：2000-01-26

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandial

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/062 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09736 ,  H05K2201/09772 ,  H05K2201/098 ,  Y02P70/611

Abstract: An etched tri-metal-layer air bridge circuit board specially designed for fine-pitch applications, comprising: an electrically insulative substrate surface (10), a plurality of tri-metal-layer bond pads (12) arranged in a generally straight row on the substrate surface (10) wherein the row defines a width direction therealong, and a circuit trace (20) arranged on the substrate surface (10), wherein the circuit trace (20) runs between two adjacent ones (22) of the plurality of tri-metal-layer bond pads (12). Each bond pad (12) comprises: (1) a bottom layer (14) attached to the substrate surface (10), the bottom layer (14) being made of a first metal and having an overall width W1 as measured along the width direction; (2) a top layer (18) disposed above and generally concentric with the bottom layer (14), the top layer (18) being made of the first metal and having an overall width W2 as measured along the width direction; and (3) a middle layer (16) made of a second metal connecting the bottom layer (14) and the top layer (18). The bond pads (12) are specially shaped such that W2 > W1 for at least the two adjacent bond pads (12), thus enabling the circuit trace (20) to be spaced closely to the bottom layers (14) of the two adjacent bond pads (12), while allowing the top layers (18) of the pads (12) to be made much larger so as to avoid delamination thereof from their associated middle layers (16).

公开(公告)号：EP0989789A3

公开(公告)日：2001-06-13

申请号：EP99307407.9

申请日：1999-09-17

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Nojioka, Shinichi

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10651 ,  Y10S428/901 ,  Y10T428/24281 ,  Y10T428/24802

Abstract: A printed wiring board with an increased strength of solder is provided by preventing solder bridge formation and increasing the amount of solder adherent thereto. A land (1) serving as a soldering foundation is formed in a star-shape, to minimize the proximal peripheral length (L2) between adjacent lands spaced distance (L1) apart, thus reducing the possibility of solder bridge formation. Since the star-shaped land (1) has a greater area than a rhombic land of identical size, the amount of solder adherent thereto is greater than that of the rhombic land, thus enabling to increase the strength of solder.

Abstract translation: 通过防止焊料桥形成和增加附着于其上的焊料的量来提供具有增加的焊料强度的印刷线路板。 用作焊接基座的焊盘（1）形成为星形，以使间隔距离（L1）的相邻焊盘之间的近端周长（L2）最小化，从而减少形成焊料桥的可能性。 由于星形土地（1）的面积大于相同尺寸的菱形土地，因此附着于其上的焊料的量大于菱形，因此能够提高焊料的强度。

公开(公告)号：EP1026927A2

公开(公告)日：2000-08-09

申请号：EP00300407.4

申请日：2000-01-20

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandlal

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A circuit board having special bond pad configurations which mitigate against both reflow-induced skew and bond pad delamination, especially for fine-pitch applications. The circuit board comprises: (1) an electrically insulative substrate 16; and (2) a plurality of bond pads 20 disposed side-by-side in a generally straight row on the substrate, wherein the row defines a width direction therealong and a length direction orthogonal thereto. Each bond pad 20 has an overall width W as measured along the width direction and an overall length L as measured along the length direction, such that L > W. Each pad 20 also has an overall left edge 22 and an overall right edge 24 running generally along the overall length of each respective pad, such that at least one of the edges of each pad is non-straight or is oblique with respect to the length direction. The adjacent edges of adjacent pads generally dovetail, interdigitate, or otherwise conform in shape with each other, such that at least one portion of each pad has a width W min wide enough to avoid delamination of the pad, while the remainder of each pad is narrow enough that skewing of the component leads during reflow is avoided.

Abstract translation: 具有特殊接合焊盘结构的电路板，其减轻了回流引起的偏斜和接合焊盘分层，特别是对于精细间距应用。 电路板包括：（1）电绝缘基板16; 以及（2）在基板上以大致直线列并排配置的多个接合焊盘20，其中该行限定宽度方向和与其正交的长度方向。 每个接合焊盘20具有沿着宽度方向测量的总宽度W和沿长度方向测量的总长度L，使得L> W。每个焊盘20还具有整体左边缘22和整个右边缘24运行 通常沿着每个相应焊盘的总长度，使得每个焊盘的至少一个边缘是非直的或相对于长度方向倾斜的。 相邻焊盘的​​相邻边缘通常在形状上彼此相交，相互指向或以其它方式相符合，使得每个焊盘的至少一部分宽度足够宽以避免焊盘的分层，而每个焊盘的其余部分是窄的 足以避免在回流期间元件的偏斜导致。

公开(公告)号：EP0996322A2

公开(公告)日：2000-04-26

申请号：EP99308015.9

申请日：1999-10-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Harada, Hiroshi ,  Terashima, Kiminori

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

Abstract: The electronic circuit unit of the present invention is provided with the broad width lands (4a) and the thin width lands (4b) tied with the broad width lands, which are configured by a solder resist (5) that is formed on the surface of the circuit board (1). Owing to this configuration, the solders placed on the thin width lands (4b) are drawn toward the broad width lands (4a), which increases the quantity of the solder build-up on the broad width lands, and accompanied with this increase, swells the heights of the solder build-up on the broad width lands. Thus, the electronic circuit unit of the present invention ensures the soldering.

Abstract translation: 本发明的电子电路部设置有宽幅的土地（4a）和所述薄宽度土地（4b）上的宽幅的土地，其通过焊料配置并列抗蚀剂（5）没有被形成的表面上 所述电路板（1）。 由于该构造，放置在薄宽度土地（4b）的焊料被拉向广阔的宽度的土地（4a）中，这增加了在宽的宽度的土地焊料积聚的量，并与这种增加的陪同下，膨胀 上广阔的宽度土地上的焊料堆积的高度。 因此，本发明的电子电路单元确保焊接。

公开(公告)号：EP0852059A4

公开(公告)日：1999-08-11

申请号：EP96945302

申请日：1996-12-23

Applicant: EMC TECHNOLOGY INC

Inventor： MAZZOCHETTE JOSEPH B

IPC: H01C1/142 ,  H01C17/00 ,  H05K1/02 ,  H05K3/34 ,  H01C1/012

CPC classification number: H01C1/142 ,  H01C17/006 ,  H05K1/0201 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10469 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A chip resistor (30) includes a substantially rectangular substrate (32) of an insulating material having opposed substantially flat top and bottom surfaces (34, 36) and edges (38) extending between the top and bottom surfaces (34, 36). A layer (40) of a resistance material is on the top surface (34) of the substrate (32). Separate termination layers (42, 44) of a conductive material are on the top surface (34) of the substrate (30) and contact the resistance layer (40) at opposite end thereof. Each of the termination layers (42, 44) extends across an edge of the substrate and over a portion of the bottom surface (36) of the substrate (30). The total area of the portions (42b, 44b) of the termination layers (42, 44) on the bottom surface (36) of the substrate (30) is greater than the total area of the portions (42a, 44a) of the termination layers (42, 44) on the top surface (34) of the substrate (30) so that the spacing between the ends of the portions (42b, 44b) of the termination layers (42, 44) on the bottom surface (36) of the substrate (30) is smaller than the spacing between the ends of the portions (42a, 44a) of the termination layers (42, 44) on the top surface (34) of the substrate (30).

Abstract translation: 芯片电阻器包括绝缘材料的基本上矩形的基板，其具有相对的基本上平坦的顶表面和底表面以及在顶表面和底表面之间延伸的边缘。 电阻材料层位于衬底的顶表面上。 导电材料的单独端接层位于顶表面或基板上，并在其相对端接触电阻层。 每个终端层延伸穿过衬底的边缘并且在衬底的底表面的一部分上方延伸。 基板的底面上的终端层的部分的总面积大于基板的顶面上端接层的部分的总面积，使得终端部分的端部之间的间隔 衬底底表面上的层小于衬底顶表面上终端层部分的端部之间的间距。

公开(公告)号：EP0918355A2

公开(公告)日：1999-05-26

申请号：EP98203298.9

申请日：1998-09-29

Applicant: DELCO ELECTRONICS CORPORATION

Inventor： Cornell, Ralph Edward ,  Erickson, Curtis A. ,  Vaidyanthan, Aparna

IPC: H01L23/485

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A surface mount circuit device (110), such as a flip chip, of the type which is attached to a conductor pattern (126) with solder bump connections (120). The solder bump connections (120) are formed by reflowing solder on shaped input/output pads (112) on the device (110), with the shape of the pads (112) being tailored to favorably affect optimal distribution, shape and height of the solder bump connections (120) following reflow soldering of the device (110) to the conductor pattern (126). The solder bump connections (120) are preferably characterized by a shape that increases the stand-off height of the device (110). The shaped solder bump connections (120) also promote stress relief during thermal cycling, improve mechanical bonding, allow better penetration of cleaning solutions, and improve flow of encapsulation materials between the device (110) and its substrate (122).

公开(公告)号：EP0699020A1

公开(公告)日：1996-02-28

申请号：EP95113102.8

申请日：1995-08-21

Applicant: Blaupunkt-Werke GmbH

Inventor： Dobers, Michael, Dr.

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/116 ,  H05K1/0206 ,  H05K3/4069 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/09981

Abstract: Erfindungsgemäß werden für eine beidseitig kaschierte Leiterplatte Durchkontaktierungen vorgeschlagen, bei denen die Kontaktbrücken aus einer gehärteten Leitpaste zur elektrisch leitenden Verbindung der vorgesehenen Leiterbahnen aufgebracht wird. Die Kontaktbrücken werden derart großflächig ausgebildet, daß sie die Funktion von wärmeabführenden Kühlkörpern übernehmen (Figur 1).

Abstract translation: 在双面电路板（1）中，在板的相对侧上具有通过接触导电轨道（2,3）的双面电路板（1）通过接触桥（5）彼此电连接。 接触桥由硬化的导电膏制成，并且布置在板中的通孔中。 通过接触桥连接的轨道在接触桥附近的区域中具有大的面积，使得它们承担与它们连接的接触桥的散热元件的作用。

公开(公告)号：EP0373528A3

公开(公告)日：1991-12-11

申请号：EP89122670.6

申请日：1989-12-08

Applicant: SIEMENS-ALBIS AKTIENGESELLSCHAFT ,  SIEMENS AKTIENGESELLSCHAFT

Inventor： Willi, Walter

IPC: H05K3/22 ,  H01H37/74

CPC classification number: H05K3/225 ,  H01H37/74 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/092 ,  H05K1/11 ,  H05K3/067 ,  H05K3/245 ,  H05K3/34 ,  H05K3/4061 ,  H05K2201/0305 ,  H05K2201/09381 ,  H05K2201/10181 ,  H05K2203/1115 ,  H05K2203/173 ,  H05K2203/175

Abstract: Zum wahlweisen Herstellen von Thermosicherungen, elektrischen Verbindungen oder Unter­brüchen wird auf einem Substrat (5) zwischen zwei Anschlüssen (3,4 ) eine Schicht (1) und darüber eine Schicht (2) aufgetragen, wobei mindestens eine der beiden Schichten (1,2) zwischen den Anschlüssen (3,4) eine elektrisch leitende Verbindung bildet. Dabei wird vor­gesehen, dass die Schicht (1) bzw.(2) , im Vergleich zu den Anschlüssen (3,4), gegenüber der Schicht (2) bzw. (1) eine deutlich geringere Ablegierfestigkeit besitzt.
Nach einer Erwärmung des Substrats (5) bzw. der Schichten (1,2) auf eine bestimmte Tempe­ratur wird die schicht (1) bzw. (2) durch die Schicht (2) bzw. (1) ablegiert, wobei die Schicht (1) vom Substrat (5) abgelöst wird. Die verbleibende Schicht wird nachfolgend im flüssigen Zustand durch die Oberflächenspannung in zwei Teile geteilt, welche sich in der Folge auf die beiden Anschlüsse (3,4) zurückziehen. Die Verbindung wird somit beim Überschreiten einer bestimmten Temperatur gelöst.

公开(公告)号：EP0278869A3

公开(公告)日：1990-11-07

申请号：EP88400301.3

申请日：1988-02-09

Applicant: AUGAT INC.

Inventor： Kendall, Jerry A. ,  Morse, Gary L. ,  Webb, David M.

IPC: H01R23/70

CPC classification number: H05K1/117 ,  H01R12/716 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K2203/167 ,  Y10S439/951

Abstract: A circuit pattern on the surface of a printed circuit board used as a guide and connection circuit for closely spaced contacts of a connector to be connected to the circuit board. The contacts of the connector are closely spaced and possibly would not contact the connection pads (80) or might be located between connection pads (80) because of the close spacing of the contacts. The guides (70) formed from circuit patterns accurately guide the connector to the connector pads (80) on the circuit board and place each contact over its respective circuit connection pad.

公开(公告)号：EP0373528A2

公开(公告)日：1990-06-20

申请号：EP89122670.6

申请日：1989-12-08

Applicant: SIEMENS-ALBIS AKTIENGESELLSCHAFT ,  SIEMENS AKTIENGESELLSCHAFT

Inventor： Willi, Walter

IPC: H05K3/22 ,  H01H37/74

CPC classification number: H05K3/225 ,  H01H37/74 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/092 ,  H05K1/11 ,  H05K3/067 ,  H05K3/245 ,  H05K3/34 ,  H05K3/4061 ,  H05K2201/0305 ,  H05K2201/09381 ,  H05K2201/10181 ,  H05K2203/1115 ,  H05K2203/173 ,  H05K2203/175

Abstract: Zum wahlweisen Herstellen von Thermosicherungen, elektrischen Verbindungen oder Unter­brüchen wird auf einem Substrat (5) zwischen zwei Anschlüssen (3,4 ) eine Schicht (1) und darüber eine Schicht (2) aufgetragen, wobei mindestens eine der beiden Schichten (1,2) zwischen den Anschlüssen (3,4) eine elektrisch leitende Verbindung bildet. Dabei wird vor­gesehen, dass die Schicht (1) bzw.(2) , im Vergleich zu den Anschlüssen (3,4), gegenüber der Schicht (2) bzw. (1) eine deutlich geringere Ablegierfestigkeit besitzt.
Nach einer Erwärmung des Substrats (5) bzw. der Schichten (1,2) auf eine bestimmte Tempe­ratur wird die schicht (1) bzw. (2) durch die Schicht (2) bzw. (1) ablegiert, wobei die Schicht (1) vom Substrat (5) abgelöst wird. Die verbleibende Schicht wird nachfolgend im flüssigen Zustand durch die Oberflächenspannung in zwei Teile geteilt, welche sich in der Folge auf die beiden Anschlüsse (3,4) zurückziehen. Die Verbindung wird somit beim Überschreiten einer bestimmten Temperatur gelöst.

Abstract translation: 用于可选地使温度保险丝，电连接或中断的目的，有两个端子（3,4）上的基板之间施加（5）的层（1），并有上述的层（2），这两个中的至少一个 在终端之间的导电连接形成层（1,2）（3，4）。 在这种布置中，它是由与终端比较而提供确实（3，4），所述层（1）或（2）具有比所述层基本上较低的脱合金的电阻（2）或（1）。 基板的加热后（5）或所述层的（1,2）到一个特定的温度时，层（1）或（2）由所述层（2）或（1），层（1脱合金化 ）（5）从所述基板脱离。 剩余的层是在液体状态下随后除以表面张力为两个部分在序列撤回到两个端子（3，4）。 该连接是在过冲的特定温度。因此撤消。