公开(公告)号：EP1671524B1

公开(公告)日：2015-11-04

申请号：EP04784579.7

申请日：2004-09-17

Applicant: Motorola Solutions, Inc.

Inventor： WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

公开(公告)号：EP2741591A1

公开(公告)日：2014-06-11

申请号：EP13193771.6

申请日：2013-11-21

Applicant: ROBERT BOSCH GMBH

Inventor： Vogelgesang, Michael

IPC: H05K1/02 ,  H05K3/12 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K1/0265 ,  H05K3/245 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/0305 ,  H05K2201/035 ,  H05K2203/042 ,  H05K2203/043 ,  H05K2203/1484

Abstract: Verfahren zum Herstellen einer Leiterplatte (1), umfassend die Schritte Bereitstellen eines Substrats (2), Vorsehen von zumindest einer Leiterbahn (31) und zumindest einer Anschlussfläche (32) auf dem Substrat (2), und Aufbringen zumindest eines ersten Lots (42) und zumindest einer elektronischen Komponente (5) auf die Anschlussfläche (32), gekennzeichnet dadurch, dass auf oder an zumindest einen Teil der Leiterbahn (31) ein zweites Lot (41) aufgebracht wird, und das erste Lot (42) auf der Anschlussfläche (32) und das zweite Lot (41) auf der Leiterbahn (32) gemeinsam bis mindestens zu einem Schmelzpunkt des ersten Lots (42) und des zweiten Lots (41) erhitzt wird, wobei ein Querschnitt von zumindest einem Bereich der Leiterbahn (31) durch das zweite Lot (41) vergrößert wird.

Abstract translation: 该方法包括在衬底（2）上提供带状导体（31）和衬垫。 第一焊料和电子部件被施加在焊盘上。 第二焊料（41）被施加在带状导体的一部分上。 焊盘上的第一焊料和带状导体上的第二焊料通常被加热到第一焊料和第二焊料的熔点，使得带状导体的区域的横截面被第二焊料扩大。 将焊锡膏形式的第一焊料和/或第二焊料施加在焊盘和/或带状导体上。

公开(公告)号：EP1671524A2

公开(公告)日：2006-06-21

申请号：EP04784579.7

申请日：2004-09-17

Applicant: MOTOROLA, INC.

Inventor： WALDVOGEL, John, M. ,  BIELICK, Brian, R. ,  MILLER, Herman, J. ,  VAN CANNON, Billy, J.

IPC: H05K7/20

CPC classification number: H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/042 ,  H05K2203/063

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 一种电路装置（300），包括：具有接地层（336），至少一个器件孔（332）和至少一个焊料孔（334）的衬底（330）; 散热器（310）; 和粘合剂层（320），用于将所述散热器机械地耦合到所述衬底的所述接地层，使得所述衬底器件孔的至少一部分覆盖所述散热器，所述粘合剂层具有至少一个器件孔和至少一种焊料 其中将所述至少一个基板焊料孔与所述至少一个粘合剂层焊料孔对齐并且将所述至少一个基板器件孔与所述至少一个粘合剂层器件孔对准使得焊料在所述散热器和所述散热器之间的预定区域中变湿 衬底的底层。

公开(公告)号：EP2533617B1

公开(公告)日：2017-12-13

申请号：EP11736603.9

申请日：2011-01-10

Applicant: Huawei Device Co., Ltd.

Inventor： JIANG, Zhiwei ,  CHEN, Xiaochen ,  GUO, Zhipeng

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/22

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

公开(公告)号：EP0996322B1

公开(公告)日：2005-12-28

申请号：EP99308015.9

申请日：1999-10-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Harada, Hiroshi ,  Terashima, Kiminori

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

公开(公告)号：EP1427073A1

公开(公告)日：2004-06-09

申请号：EP03027454.2

申请日：2003-12-01

Applicant: Autosplice Systems, Inc.

Inventor： Kenney, Craig M. ,  Eisenberg, Donald S.

IPC: H01R43/02

CPC classification number: H01R43/0235 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10303 ,  H05K2203/042

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve toa solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint betweenthe contact surfaces.

Abstract translation: 使用作为车辆的冲压或销或焊盘的导电的例如金属表面的焊接传输方法将熔融焊料从远程焊料储存器转移到待制造的焊接点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸过程传递到相邻的接触表面，以提供制造坚固焊接所需的附加焊料。 当其中一个接触表面是第一PCB上的触点或引脚，另一个接触表面是例如作为存储卡的第二个PCB上的SMT焊盘时，本发明的工艺使得SMT处理容易 将存储卡连接到第一PCB，而不需要在第二回流步骤期间添加焊料以在接触表面之间形成坚固的焊接接头。

公开(公告)号：EP0996322A2

公开(公告)日：2000-04-26

申请号：EP99308015.9

申请日：1999-10-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Harada, Hiroshi ,  Terashima, Kiminori

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3452 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10984 ,  H05K2203/042 ,  Y02P70/613

Abstract: The electronic circuit unit of the present invention is provided with the broad width lands (4a) and the thin width lands (4b) tied with the broad width lands, which are configured by a solder resist (5) that is formed on the surface of the circuit board (1). Owing to this configuration, the solders placed on the thin width lands (4b) are drawn toward the broad width lands (4a), which increases the quantity of the solder build-up on the broad width lands, and accompanied with this increase, swells the heights of the solder build-up on the broad width lands. Thus, the electronic circuit unit of the present invention ensures the soldering.

Abstract translation: 本发明的电子电路部设置有宽幅的土地（4a）和所述薄宽度土地（4b）上的宽幅的土地，其通过焊料配置并列抗蚀剂（5）没有被形成的表面上 所述电路板（1）。 由于该构造，放置在薄宽度土地（4b）的焊料被拉向广阔的宽度的土地（4a）中，这增加了在宽的宽度的土地焊料积聚的量，并与这种增加的陪同下，膨胀 上广阔的宽度土地上的焊料堆积的高度。 因此，本发明的电子电路单元确保焊接。

公开(公告)号：EP3516688A1

公开(公告)日：2019-07-31

申请号：EP17764319.4

申请日：2017-08-22

Applicant: ZKW Group GmbH

Inventor： PETSCH, Daniel

IPC: H01L25/16 ,  H01L33/48 ,  H05K1/18 ,  H05K3/34 ,  F21Y107/50 ,  F21Y115/10

CPC classification number: F21S41/147 ,  F21S41/19 ,  F21S41/25 ,  F21S41/321 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L33/62 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10484 ,  H05K2203/042 ,  H05K2203/0465 ,  H05K2203/048

公开(公告)号：EP2334159B1

公开(公告)日：2014-02-12

申请号：EP09252761.3

申请日：2009-12-10

Applicant: ST-Ericsson SA

Inventor： Slavov, Nedialko

IPC: H05K1/14 ,  H05K3/34 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H01L25/10 ,  H01L23/00 ,  H01L25/00

CPC classification number: H05K1/142 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H05K1/181 ,  H05K3/3405 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/042 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

公开(公告)号：EP2533617A4

公开(公告)日：2013-02-13

申请号：EP11736603

申请日：2011-01-10

Applicant: HUAWEI DEVICE CO LTD

Inventor： JIANG ZHIWEI ,  CHEN XIAOCHEN ,  GUO ZHIPENG

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

Abstract translation: 本发明的实施例公开了PCBA芯片封装部件和焊接部件，其可以有助于修复PCBA芯片封装模块。 本发明实施例中的PCBA芯片封装部件包括：模块板和接口板。 第一焊盘设置在模块板的底部，第二焊垫设置在接口板的顶部上，第二焊垫是城堡型结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域被焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。 本发明的实施例还提供一种焊接部件。 本发明的实施例可以有助于修复PCBA芯片封装部件。