公开(公告)号：EP1424748A3

公开(公告)日：2005-03-23

申请号：EP04002310.3

申请日：1995-06-07

申请人： TESSERA, INC.

发明人： Fjelstad, Joseph ,  Smith, John W. ,  Distefano, Thomas, H. ,  Zaccardi, James ,  Walton, Christian, A.

IPC分类号： H05K3/32 ,  H01L23/498 ,  H05K7/10 ,  G01R1/04

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

摘要： A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：EP1442503A1

公开(公告)日：2004-08-04

申请号：EP02779521.0

申请日：2002-10-31

申请人： Leopold Kostal GmbH & Co. KG ,  Solarworld Aktiengesellschaft

发明人： BERGMANN, Eduard ,  RILLING, Herwig ,  WESTERMAYR, Peter ,  HOFBAUER, Clemens ,  KLEBENSBERGER, Boris ,  WAMBACH, Karsten

IPC分类号： H01R9/24

CPC分类号： H05K3/202 ,  H01L31/02013 ,  H01R13/24 ,  H01R13/665 ,  H01R43/24 ,  H02S40/34 ,  H02S40/345 ,  H05K1/187 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10651 ,  Y02E10/50 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53209 ,  Y10T29/53265

摘要： The invention relates to an assembly comprised of a panel-like constructed electrical/electronic module (7) comprising a flat surface with exposed, contactable connection sections AS serving as a part of an essentially flat conductor track structure for electrically connecting the module (7). The assembly also comprises a connection unit (1) provided with electrical/electronic elements D, which are located on a conductor track structure (2) situated in a plane parallel to the conductor track structure of the module (7). In addition, the assembly is fitted with means for contacting connection sections of the module whereby enabling the module to be electrically connected via the connection unit. The means for contacting the connection sections AS of the module (7) are bent out from the plane of the conductor track structure (2), and are connection sections AA that represent a portion of the conductor track structure. The connection sections AS of the module (7) are rigid and are electrical conductor sections AS that can be bent out from the plane of the conductor track structure of the module (7). Connection sections AA of the connection unit (1) are arranged according to the arrangement of connection sections AS of the module (7) so that when the connection unit (1) is connected to the module (7), one connection segment AS of the module (7) and one of the connection unit (1) are electrically connected to one another, abut against one section, and, in the area in which they abut, are situated in a spatial position different from that of the planes of the conductor track structures (2).

公开(公告)号：EP0719075B1

公开(公告)日：2004-03-24

申请号：EP95309221.0

申请日：1995-12-19

申请人： PILKINGTON UNITED KINGDOM LIMITED

发明人： Castle, Derek Charles ,  Chamberlain, Mark Andrew

IPC分类号： H05B3/86 ,  H05B3/84

CPC分类号： H05B3/84 ,  B32B3/04 ,  B32B17/10036 ,  B32B17/10293 ,  B32B17/10385 ,  H05B3/86 ,  H05B2203/016 ,  Y10T29/49083 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179

公开(公告)号：EP1350287A1

公开(公告)日：2003-10-08

申请号：EP02712812.3

申请日：2002-01-11

申请人： SCHUNK Ultraschalltechnik GmbH

发明人： STEINER, Ernst ,  STROH, Dieter ,  DIETERLE, Horst

IPC分类号： H01R43/02

CPC分类号： B29C65/082 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/38 ,  B29C66/1122 ,  B29C66/43 ,  H01R4/021 ,  H01R12/59 ,  H01R43/0207 ,  H01R43/0228 ,  H01R43/0263 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2203/0195 ,  H05K2203/0285 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/49208 ,  Y10T29/53217 ,  Y10T29/53243

摘要： The invention relates to a method and device for connecting the electrical conductors which are surrounded by outer insulation and associated with overlapping flat conductors (47, 49) by means of a sonotrode (52) producing ultrasonic vibrations and a counter electrode associated therewith. The conductors which are to be connected are to be arranged on a surface (48) of a carrier (50) extending between the sonotrode and the counter electrode. The carrier can be embodied as a counter electrode.

公开(公告)号：EP1247067A1

公开(公告)日：2002-10-09

申请号：EP01901931.4

申请日：2001-01-09

申请人： HR TEXTRON INC.

发明人： RATLIFF, William, Edward

IPC分类号： G01B7/14 ,  G01B7/30 ,  G01R33/07 ,  H05K1/00 ,  H05K13/00 ,  H01R12/00 ,  H01R43/00

CPC分类号： H02K5/225 ,  G01B7/003 ,  G01B7/023 ,  G01D5/145 ,  G01D5/147 ,  G01D11/245 ,  G01R33/07 ,  H01R12/592 ,  H02K11/215 ,  H02K11/33 ,  H02K15/0006 ,  H02K23/00 ,  H02K26/00 ,  H02K29/08 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/118 ,  H05K1/189 ,  Y10T29/49009 ,  Y10T29/49169 ,  Y10T29/49179

摘要： A low cost Hall position sensor comprises a standard surface mount Hall effect sensing device (2) having its three leads (4, 6, 8) soldered directly to an exposed electro-conductive end portion of a standard flexible multiconductor circuit (42). The flexible circuit (42) may be custom designed and manufactured at low cost for a variety of mass production applications. The position sensor further comprises a permanent movable Hall magnet (82) disposed proximate to the soldered Hall effect sensing device which remains stationary during operation. The Hall effect sensing device (2) picks up variations in the magnetic flux generated by the movement of the Hall magnet during operation and sends a corresponding feedback voltage signal to an external controller which powers the Hall effect sensing device via the flexible circuit (42). The flexible circuit (42) has a second exposed electro-conductive end portion (46) for removably mating with a corresponding flex circuit connector on the controller board. The Hall position sensor may be used in applications involving a moving Hall effect sensing device (406) disposed proximate to a series of stationary Hall magnets (404a-404k).

公开(公告)号：EP1124284A3

公开(公告)日：2002-03-13

申请号：EP00116242.9

申请日：2000-08-08

申请人： MITSUBISHI DENKI KABUSHIKI KAISHA

发明人： Tanaka, Kazunori, Mitsubishi Denki K.K. ,  Asao, Yoshihito, Mitsubishi Denki K.K.

IPC分类号： H01R4/18

CPC分类号： H01R4/187 ,  H01R11/12 ,  Y10T29/49179 ,  Y10T29/49185

摘要： The generator comprises a polyphase stator coil 5 having a lead conductor 19 wound and inserted into a stator core 4, a rotor 6 having rotor cores 8 and 9 for forming magnetic poles, a front bracket 1 and a rear bracket 2 for holding a stator 3 and rotatably supporting the rotor 6, and a commutator 17 which is mounted in this rear bracket 2 and to which a metal terminal 20 bonded to the lead conductor 19 of the stator coil 5 is connected, andit is configured so that bonding between the lead conductor 19 and the metal terminal 20 is fixed by caulking with bonding pieces 20a and 20b provided in the metal terminal 20 embracing the end of the lead conductor 19 from both sides and spacing between the bonding pieces 20a and 20b embracing from both of these sides is bonded and fixed by arc welding.

摘要翻译： 发电机包括多相定子线圈5，其具有缠绕并插入定子铁心4中的导线导体19，具有用于形成磁极的转子铁芯8和9的转子6，用于保持定子3的前支架1和后支架2 并且可旋转地支撑转子6;以及换向器17，该换向器17安装在该后支架2中，并且与定子线圈5的引线导体19接合的金属端子20连接到该换向器17，并且被配置为使得引线导体 并且金属端子20通过铆接而固定，所述接合片20a和20b设置在从两侧包围引线导体19的端部的金属端子20中，并且从两侧包围的接合片20a和20b之间的间隔被接合 并通过电弧焊固定。

公开(公告)号：EP0988664B1

公开(公告)日：2001-11-21

申请号：EP98930696.4

申请日：1998-05-16

申请人： Mannesmann VDO Aktiengesellschaft

发明人： BENDER, Günther

IPC分类号： H01R4/02

CPC分类号： H01R4/027 ,  H01R43/0221 ,  Y10T29/4914 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49179 ,  Y10T29/49181 ,  Y10T29/49208 ,  Y10T29/49211 ,  Y10T29/53209

摘要： The invention relates to a method for producing an electrical connection between a first contact partner part and a second contact partner part. According to the invention, the two parts are brought together and then interconnected non-detachably in a positive material fit or quasi- positive material fit, to form a plug-in connection.

公开(公告)号：EP0917273A3

公开(公告)日：2001-08-29

申请号：EP98303290.5

申请日：1998-04-28

申请人： TAMAGAWA SEIKI KABUSHIKI KAISHA

发明人： Ooshita, Hiromi

IPC分类号： H02K3/50 ,  H02K15/00

CPC分类号： H02K3/50 ,  H02K15/0056 ,  H02K15/0075 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/53157

摘要： In a stator winding method and a stator winding structure, the ends (4a) of windings (4) are caused to become entangled with terminals (6) through a longitudinal rod member (10) and form slack portions (4aA) when the longitudinal rod member is removed, whereby the vibration resistance and impact resistance of the windings can be improved as well as preventing breakage thereof.

摘要翻译： 在定子绕组方法和定子绕组结构中，绕组（4）的端部（4a）通过纵向杆件（10）与端子（6）缠绕，并且当纵向杆件 部件被去除，由此可以提高绕组的耐振动性和耐冲击性，并且防止其断裂。

公开(公告)号：EP0712266B1

公开(公告)日：2000-10-11

申请号：EP95308071.0

申请日：1995-11-10

申请人： VLT CORPORATION

发明人： Pullen, Stephen R. ,  Hedlund III,Walter R.

IPC分类号： H05K5/00 ,  H05K7/20 ,  H05K3/40

CPC分类号： H05K7/20463 ,  H01L2224/05553 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K5/0095 ,  H05K7/209 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

公开(公告)号：EP0694220B1

公开(公告)日：1998-09-09

申请号：EP92922778.3

申请日：1992-04-15

申请人： NORTH AMERICAN SPECIALTIES CORP.

发明人： SEIDLER, Jack

IPC分类号： H01R9/09 ,  H01R4/02 ,  H01R9/24 ,  H05K1/00 ,  H01R43/02 ,  H05K3/36 ,  H01L23/498

CPC分类号： H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/02 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K2203/041 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2924/00

摘要： A solder-bearing lead (10) for attachment to the surface of a substrate (39), wherein a discrete mass of solder (24) is mechanically held firmly by the lead (10) in a position permitting close proximity to the substrate surface to connect the lead (10) to the substrate (39) with an electrical and mechanical bond upon melting of the solder (24), the lead body having a pair of fingers (22) partially encircling the solder mass (24) with a gap (32) between the fingers (22) providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate (39) to a second substrate (44), forming a bond between conductive areas (45, 46) on both substrates.