公开(公告)号：EP3000288A4

公开(公告)日：2017-01-04

申请号：EP14801350

申请日：2014-05-21

Applicant: BYD CO LTD

Inventor： XU QIANG ,  LIN XINPING

IPC: C25D11/24 ,  C23C18/18 ,  H05K1/03 ,  H05K1/05 ,  H05K3/18 ,  H05K3/44

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Abstract translation: 本公开的实施例涉及电路板。 电路板包括：铝基底板; 形成在铝基基板的至少一个表面上的氧化铝层; 以及形成在氧化铝层上的电路层。 氧化铝层包括氧化铝和选自铬，镍，稀土金属及其组合的元素。

公开(公告)号：EP3069583A1

公开(公告)日：2016-09-21

申请号：EP14784376.7

申请日：2014-10-13

Applicant: Cambridge Nanotherm Limited ,  Rogers Corporation

Inventor： SHASHKOV, Pavel ,  USOV, Sergey ,  CURTIS, Steven ,  KILHENNY, Brett W.

IPC: H05K3/44 ,  C25D11/02 ,  C25D11/06

CPC classification number: H05K1/028 ,  C25D11/02 ,  C25D11/024 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/053 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/1147

Abstract: A flexible electronic substrate (FES) includes a metallic layer, a dielectric nanoceramic layer formed by oxidation of a surface of the metallic layer, and an electrical circuit formed on a surface of the dielectric layer. The FES may be used for supporting a device, for example a flexible display, an OLED, an optoelectronic device, or a rf device. The dielectric nanoceramic layer has a crystalline structure consisting of substantially equiaxed grains having an average grain size of 100 nanometres or less, a thickness of between 1 micrometre and 50 micrometres, a dielectric strength of greater than 20 KV mm−1, and a thermal conductivity of greater than 3 W/mK. The FES has a minimum bend radius of lower than 25 cm.

公开(公告)号：EP3000288A1

公开(公告)日：2016-03-30

申请号：EP14801350.1

申请日：2014-05-21

Applicant: BYD Company Limited

Inventor： XU, Qiang ,  LIN, Xinping

IPC: H05K1/03

CPC classification number: H05K1/053 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/40 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/246 ,  H05K3/185 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1147

Abstract: Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Abstract translation: 提供了一种电路板及其制造方法。 该电路板包括：铝基衬底; 在铝基基板的至少一个表面上形成的氧化铝层; 以及在氧化铝层上形成的电路层。 氧化铝层包含氧化铝和选自铬，镍，稀土金属及其组合的元素。

公开(公告)号：EP2579695A4

公开(公告)日：2015-11-11

申请号：EP11789939

申请日：2011-06-03

Applicant: FURUKAWA ELECTRIC CO LTD

Inventor： HAMADA HIROKI ,  TAMAOKA HIROYUKI ,  ISO YOICHI

IPC: H05K3/18 ,  H01P11/00 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q9/42 ,  H01Q13/08 ,  H04B1/18 ,  H05K3/00

CPC classification number: H01Q1/38 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q9/42 ,  H01Q21/00 ,  H05K1/03 ,  H05K1/0393 ,  H05K3/146 ,  H05K3/185 ,  H05K2201/0116 ,  H05K2201/09118 ,  H05K2201/10098

公开(公告)号：EP2859314A2

公开(公告)日：2015-04-15

申请号：EP13747501.8

申请日：2013-06-10

Applicant: Ecole Polytechnique Fédérale de Lausanne (EPFL)

Inventor： VANDERPARRE, Hugues ,  LACOUR, Stephanie

IPC: G01L1/14 ,  G01L1/22 ,  G01L1/24

CPC classification number: H05K1/0271 ,  G01L1/142 ,  H03K2017/9602 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0116 ,  Y10T29/49117

Abstract: Stretchable electronic structure comprising one intrinsically fragile thin film integrated on or within a soft heterogeneous substrate. The invention also relates to a process for manufacturing such a structure.

Abstract translation: 伸缩性电子结构，其包括一个本脆弱薄膜集成电路上或软异质衬底内。 因此本发明涉及一种用于制造结构的搜索的方法。

公开(公告)号：EP2792705A3

公开(公告)日：2014-11-05

申请号：EP14172847.7

申请日：2004-05-20

Applicant: Dow Global Technologies LLC

Inventor： Valette, Ludovic ,  Maresin, Catherine ,  Mercier, Regis

IPC: C08J9/26 ,  C08G59/14

CPC classification number: B32B15/08 ,  B32B27/04 ,  B32B2457/00 ,  B82Y30/00 ,  C08G59/1433 ,  C08G59/1438 ,  C08G59/18 ,  H05K1/0313 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/24998 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

Abstract: An organic resin composition comprising (a) a reactive organic resin which is an epoxy resin; (b) a compound containing a thermolabile group and capable of being grafted onto the reactive organic resin, wherein the thermolabile group undergoes thermal degradation at a temperature from 120°C to 220°C; and (c) optionally a solvent.

公开(公告)号：EP2213771A4

公开(公告)日：2014-02-26

申请号：EP08854900

申请日：2008-08-21

Applicant: FUJIFILM CORP

Inventor： HATANAKA YUSUKE ,  HOTTA YOSHINORI ,  UESUGI AKIO

IPC: C25D11/04 ,  B82B1/00 ,  C25D11/20 ,  H01B5/16 ,  H01R11/01

CPC classification number: H05K3/423 ,  C25D11/045 ,  C25D11/12 ,  C25D11/20 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0116 ,  H05K2201/10378 ,  H05K2203/0315 ,  H05K2203/1142 ,  H05K2203/1476 ,  H01L2924/00

Abstract: Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm 2 . In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.

公开(公告)号：EP2673403A1

公开(公告)日：2013-12-18

申请号：EP12706093.7

申请日：2012-02-07

Applicant: Cambridge Nanotherm Limited

Inventor： SHASHKOV, Pavel ,  KHOMUTOV, Gennady ,  YEROKHIN, Aleksey ,  USOV, Sergey

IPC: C25D5/18 ,  C25D11/00 ,  C25D11/04 ,  C25D11/26 ,  C25D11/30 ,  C25D11/32 ,  C25D13/02 ,  C25D21/12 ,  H01L23/14

CPC classification number: C25D5/18 ,  C25D11/00 ,  C25D11/005 ,  C25D11/02 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/32 ,  C25D13/02 ,  C25D15/00 ,  C25D21/12 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/021 ,  H05K1/053 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1147 ,  Y10T428/1317 ,  Y10T428/24917 ,  Y10T428/249969 ,  H01L2924/00

Abstract: A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, whereas the amplitude of the negative voltage pulses is galvanostatically controlled.

Abstract translation: 在金属基底上形成非金属涂层的方法包括以下步骤：将金属基底定位在电解室中，并且施加一系列具有交替极性的电压脉冲以使电极相对于电极偏置。 正电压脉冲相对于电极阳极偏置衬底，负电压脉冲相对于电极阴极偏置衬底。 正电压脉冲的幅度被电位控制，从而恒定地控制负电压脉冲的幅度。

公开(公告)号：EP2508652A4

公开(公告)日：2013-08-21

申请号：EP10834410

申请日：2010-06-25

Applicant: MITSUI MINING & SMELTING CO

Inventor： MATSUNAGA TETSUHIRO ,  WATANABE HAJIME ,  NISHIKAWA JOE ,  SATO TETSURO

IPC: B01D39/20 ,  C25D1/04 ,  C25D1/08 ,  C25D1/10 ,  H01G11/06 ,  H01G11/66 ,  H01G11/68 ,  H01G11/70 ,  H01G11/84 ,  H01M4/66 ,  H01M4/74 ,  H01M4/75 ,  H01M4/80

CPC classification number: C25D1/08 ,  B01D39/2041 ,  B01D2239/10 ,  B01D2239/1208 ,  C25D1/04 ,  C25D3/04 ,  C25D7/00 ,  H01M4/74 ,  H01M4/75 ,  H01M4/80 ,  H01M4/808 ,  H05K1/09 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/0355 ,  Y10T428/12042 ,  Y10T428/12424 ,  Y10T428/12431 ,  Y10T428/12479 ,  Y10T428/249986

Abstract: A porous metal foil of the present invention comprises a two-dimensional network structure composed of metal fibers. This porous metal foil has superior properties and can be obtained in a highly productive and cost effective manner.

公开(公告)号：EP2591912A1

公开(公告)日：2013-05-15

申请号：EP13000604.2

申请日：2007-02-16

Applicant: DAICEL CHEMICAL INDUSTRIES, LTD.

Inventor： Shimizu, Kiyoshi ,  Yamato, Yo

IPC: B32B5/18 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/036 ,  B32B5/18 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/0116 ,  Y10T29/49155 ,  Y10T428/24331 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/249979

Abstract: A multilayer assembly having a base and a porous layer arranged on at least one surface of the base, the porous layer having a large number of continuous micropores with an average pore diameter of 0.01 to 10 µm, wherein the multilayer assembly suffers from no interfacial delamination between the base and the porous layer when the multilayer assembly is examined in a tape peeling test according to the following procedure:
Tape Peeling Test
A 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer and press-bonded to the porous layer with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm/min .

Abstract translation: 一种多层组件，其具有布置在所述基底的至少一个表面上的基部和多孔层，所述多孔层具有大量平均孔径为0.01至10μm的连续微孔，其中所述多层组件没有界面分层 在根据以下步骤的带剥离试验中检查多层组件时，在基底和多孔层之间：胶带剥离试验由Teraoka Seisakusho提供的24mm宽的胶带[Film Masking Tape No.603（＃25）] 有限公司被涂布在多孔层的表面上并用直径为30mm，载荷为200gf的辊压接到多孔层上，得到样品; 用剥离速度为50mm /分钟的拉伸试验机进行T剥离试验。