公开(公告)号：EP2688367A1

公开(公告)日：2014-01-22

申请号：EP12183968.2

申请日：2012-09-12

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Noguchi, Akinori ,  Kamata, Masahiko ,  Ono, Tetsuya

IPC: H05B33/08 ,  F21K99/00 ,  H01L25/00 ,  H05K1/00

CPC classification number: H05B33/0803 ,  H05K1/0296 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: According to one embodiment, an LED module includes a substrate and a connection circuit. The connection circuit includes at least two series circuits, in each of which a plurality of LEDs are connected in series. The LEDs of the series circuits different from one another are mixedly arranged along the longitudinal direction of the substrate.

Abstract translation: 根据一个实施例，LED模块包括基板和连接电路。 连接电路包括至少两个串联电路，其中多个LED串联连接。 串联电路的LED彼此不同的LED沿着基板的纵向方向混合布置。

公开(公告)号：EP2355629B1

公开(公告)日：2014-01-01

申请号：EP11152531.7

申请日：2011-01-28

Applicant: AMPHENOL CORPORATION

Inventor： Kirk, Brian Peter

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R13/6587 ,  H05K1/0245 ,  H05K2201/044 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10T29/49117

公开(公告)号：EP2668833A1

公开(公告)日：2013-12-04

申请号：EP12703144.1

申请日：2012-01-27

Applicant: Novalia Ltd

Inventor： STONE, Kate

IPC: H05K1/02 ,  H05K1/11 ,  H01H13/702 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01H13/52 ,  H01H13/7006 ,  H01H13/79 ,  H01H2203/02 ,  H01H2203/022 ,  H05K1/0293 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/118 ,  H05K1/16 ,  H05K2201/0385 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/10053

Abstract: An electronic component such as a push button switch or a connector comprises a flexible planar substrate (fig 1, 2) which is substantially non-stretchable, that has at least two slits 14 to allow a portion 15 of the substrate supporting a region of conductive material 12 to be moved apart from another portion of the substrate. There can be three or more slits which can be arcuate and overlap an adjacent slit forming a bridge 17 between them. The conducting region 12 can be isolated, and short out two further pads 7,8 on a second substrate 3 or connected to a conductive track (fig 7, 13) and formed from conductive ink. The slits can allow movement out of the plane of the substrate, and in the same plane as the substrate to form a flexible connector (fig 11 and 12) where the slits can extend from opposite edges. The substrate can comprise a laminate, paper, card or plastic membrane and the device can be used in an electronic circuit (fig 9), as part of a game (fig 10), a book, poster, calendar, greetings card or product packaging or point of sale display.

公开(公告)号：EP1605238B1

公开(公告)日：2012-01-04

申请号：EP05009634.6

申请日：2005-05-03

Applicant: Hydrometer Electronic GmbH

Inventor： Werner, Wolfgang ,  Sebald, Marc ,  Becke, Gerhard

IPC: G01K17/06

CPC classification number: H05K1/0201 ,  G01K17/06 ,  G01K17/08 ,  H05K1/0206 ,  H05K1/18 ,  H05K2201/0133 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10151

公开(公告)号：EP2254151A2

公开(公告)日：2010-11-24

申请号：EP10176557.6

申请日：2007-08-22

Applicant: DAIKIN INDUSTRIES, LIMITED

Inventor： Sekimoto, Morimitsu ,  Haga, Hitoshi ,  Sakakibara, Kenichi ,  Kawashima, Reiji ,  Mechi, Abdallah ,  Maeda, Toshiyuki

IPC: H01L25/07 ,  H05K1/02

CPC classification number: H01L25/16 ,  H01L23/647 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/081 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a package (41) in which the chip made of the wide band gap semiconductor is sealed, and a printed circuit board (43) on which a pattern connected to a terminal (42) of the package (41) is formed.
The package (41) is thermally insulated from the printed circuit board (43) and a component on the printed circuit board (43) so that temperatures of the printed circuit board (43) and the component thereon are equal to or lower than respective heat resistant temperatures thereof even when a temperature of the chip exceeds the heat resistant temperature of at least one of the printed circuit board (43) and the component on the printed circuit board (43).

Abstract translation: 在芯片由宽带隙半导体制成的情况下，获得其中密封由宽带隙半导体制成的芯片的封装（41）和印刷电路板（43）的功率转换装置 形成连接到封装（41）的端子（42）的图案。 封装（41）与印刷电路板（43）和印刷电路板（43）上的部件热绝缘，使得印刷电路板（43）和其上的部件的温度等于或低于相应的热量 即使当芯片的温度超过印刷电路板（43）和印刷电路板（43）上的部件中的至少一个的耐热温度时，其耐温度也是如此。

公开(公告)号：EP2193698A1

公开(公告)日：2010-06-09

申请号：EP08804255.1

申请日：2008-09-16

Applicant: Continental Automotive GmbH

Inventor： CREMER, Dieter ,  GRIMMEL, Reinfried

IPC: H05K1/18 ,  G06F21/00

CPC classification number: H05K1/186 ,  H05K1/0268 ,  H05K1/0275 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: The invention relates to a multilayer circuit board (5) having a security cell (10) having security-related electronic components (11) disposed thereon. The security cell (10) is covered by a circuit path arrangement (14) having circuit path segments (15) disposed close to one another, and by an insulation layer (12). Penetration and thus manipulation of the security-related electronic components (11) is thus largely prevented.

公开(公告)号：EP2099265A3

公开(公告)日：2010-01-06

申请号：EP09100144.6

申请日：2009-02-25

Applicant: Continental Automotive GmbH

Inventor： Bartholomäus, Ulf ,  Hanke, Klausdieter ,  Hildebrandt, Jens ,  Kolar, Anton

IPC: H05K1/02

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K2201/09263 ,  H05K2201/10151 ,  H05K2201/10734

Abstract: Vorgeschlagen ist eine Leiterbahnanordnung zum Kontaktieren elektronischer Bauteile mit wenigstens einer Leiterbahnebene, die zumindest eine Leiterbahn (80) aufweist sowie jeweils eine oberhalb und unterhalb der wenigstens einen Leiterbahnebene (81) angeordnete Mäanderlage (48). Anschlüsse (30A) auf einer Hauptseite der Leiterbahnanordnung sind mit Durchkontaktierungen (92,95D) verbunden, welche die zumindest eine Leiterbahn der Leiterbahnebene und wenigstens eine der Mäanderlagen elektrisch kontaktieren. Des Weiteren umfasst die Leiterbahnanordnung ein in einem Gehäuse untergebrachtes elektronisches Bauelement (11) zur Überwachung der zumindest einen Leiterbahn und der Mäanderlage. Dieses ist fest auf der Hauptseite angeordnet und weist Kontaktelemente (111) auf, die den Anschlüssen gegenüberliegen und diese kontaktieren.

公开(公告)号：EP2059100A1

公开(公告)日：2009-05-13

申请号：EP07744769.6

申请日：2007-06-06

Applicant: Nippon Mektron, Limited

Inventor： MIYAHARA, Seiichiro, Nippon Mektron, Ltd.

IPC: H05K1/02

CPC classification number: H05K1/025 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract translation: 提供了具有布线结构的柔性布线板，即使以三维方式折叠，也可以通过减小阻抗失配来降低传输损耗。 在具有特性阻抗控制电路20的柔性布线板10中，柔性布线板在沿着切线折叠成弧状态之后，在特性阻抗控制电路中具有折叠点20A的平面投影形状。

公开(公告)号：EP1987569A1

公开(公告)日：2008-11-05

申请号：EP07717613.9

申请日：2007-02-13

Applicant: Panduit Corp.

Inventor： CAVENEY, Jack, E. ,  BOLOURI-SARANSAR, Masud

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R13/7195 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/189 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A jack with a flexible printed circuit board (FPC) is provided. The FPC is connected to the plug interface contacts and has a compensation circuit to compensate for near-end crosstalk (NEXT) and far-end crosstalk (FEXT). Capacitive and inductive compensation in the compensation circuit are of opposite polarity and are substantially equal in magnitude. The compensation circuit has a FEXT compensation zone containing compensation for the FEXT. Inductive and capacitive compensation in the FEXT compensation zone are distributed.

公开(公告)号：EP1404219A4

公开(公告)日：2008-07-02

申请号：EP02704284

申请日：2002-01-30

Applicant: VIVOMETRICS INC

Inventor： ISTOOK CYNTHIA L

IPC: A61B5/00 ,  A61B5/113 ,  D04B1/14 ,  D04B21/16 ,  A61B5/04 ,  D04B1/00

CPC classification number: A61B5/1135 ,  A61B5/0002 ,  A61B5/6805 ,  D04B21/18 ,  D10B2403/02431 ,  D10B2403/0311 ,  H05K1/0283 ,  H05K1/038 ,  H05K3/103 ,  H05K2201/09263 ,  H05K2201/10287

Abstract: A fabric for use in apparel of the type used for physiological monitoring of prescribed body functions has one or more elongated bands of elastic material which is stretchable in the longitudinal direction. Each such elastic band includes at least one conductive wire affixed to or formed therein in a curved pattern. A garment and a system of the type used for physiological monitoring of prescribed body functions includes such a fabric and a monitoring unit monitoring electrical parameters of the included conductive wires.