公开(公告)号：EP3182471A1

公开(公告)日：2017-06-21

申请号：EP16195947.3

申请日：2016-10-27

申请人： LG Electronics Inc.

发明人： HONG, Jaepyo ,  KIM, Jaechan ,  KIM, Injoong

IPC分类号： H01L33/62 ,  H01L33/64 ,  F21V29/74

CPC分类号： F21V29/713 ,  F21S2/005 ,  F21V3/0625 ,  F21V23/06 ,  F21V29/503 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21V31/00 ,  F21Y2115/10 ,  H01L33/64 ,  H01L33/647 ,  H05K1/0209 ,  H05K1/053 ,  H05K3/107 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/1355

摘要： A light source module (100) includes: at least one light source emitting light; and a body supporting the light source, wherein the body includes: a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside; an insulating part provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties; and a plating part (40) provided on the insulating part, wherein the plating part (40) includes: a contact heat dissipation part (203, 303) contacting a portion of a bottom surface of the light source to receive heat generated from the light source; and a diffusion heat dissipation part (350) connected to the contact heat dissipation part (203, 303), the diffusion heat dissipation part (350) receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed, so that it is possible to obtain effects such as improvement of the lifespan of products, enhancement of the stability of products, rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, and improvement of the reliability of products. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

摘要翻译： 一种光源模块（100）包括：至少一个发光的光源; 以及支撑所述光源的主体，其中，所述主体包括：散热器，所述散热器在所述光源的顶面上支撑所述光源，所述散热器从所述光源吸收热量并将所述热量散发到外部; 设置在所述散热器的至少一个表面上的绝缘部件，所述绝缘层具有电绝缘性能; 和设置在绝缘部分上的电镀部分（40），其中电镀部分（40）包括：接触散热部分（203,303），接触光源的底表面的一部分以接收从光产生的热量 资源; 以及连接到所述接触散热部件（203,303）的扩散散热部件（350），所述扩散散热部件（350）从所述接触散热部件接收热量以将所述热量排放到所述散热器。 因此，可以实现快速散热，从而可以获得诸如提高产品使用寿命，提高产品稳定性，快速制造工艺，便宜的制造成本，便于大量生产，提高产品成品率， 导电材料的保护以及产品可靠性的提高。 此外，可以通过实施例中描述的配置来获得可以理解的各种效果。

公开(公告)号：EP3140838A4

公开(公告)日：2017-05-03

申请号：EP15789595

申请日：2015-05-05

申请人： 3D GLASS SOLUTIONS INC

发明人： FLEMMING JEB H ,  BULLINGTON JEFF

IPC分类号： H01F41/04 ,  H05K1/16

CPC分类号： H01F27/2804 ,  H01F17/0013 ,  H01F41/041 ,  H01F41/042 ,  H01F2027/2809 ,  H05K3/0023 ,  H05K3/107

摘要： A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

摘要翻译： 通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的光敏玻璃基材制成的制造方法和装置，所述光敏玻璃基材掩盖包括一个或多个孔的设计布局以在光敏玻璃基材上形成一个或多个导电路径 将所述光敏玻璃基板的至少一部分暴露于激活能量源，将所述光敏玻璃基板暴露于比其玻璃化转变温度高至少10分钟的加热阶段，冷却所述光敏玻璃基板以将至少部分所述曝光 玻璃转变成晶体材料以形成玻璃晶体基板，并用蚀刻剂溶液蚀刻玻璃晶体基板以形成一个或多个角度的通道，然后将其涂覆。

公开(公告)号：EP3144787A2

公开(公告)日：2017-03-22

申请号：EP16182915.5

申请日：2016-08-05

申请人： Samsung Display Co., Ltd.

发明人： Choi, Won Il ,  Yoo, Je Won ,  Hong, Jong Ho ,  Joo, Hye Jin

IPC分类号： G06F3/044

CPC分类号： G06F3/044 ,  G06F2203/04103 ,  H05K1/0283 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/101 ,  H05K3/107

摘要： A touch sensor including a first substrate (100) which extends in a first direction and on which first channels (LC1) may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate (200) which extends in a second direction which intersects with the first direction and on which second channels (LC2) may be formed and stretched, and a second conductive liquid injected into the second channels.

摘要翻译： 一种触摸传感器，包括：第一基板（100），其沿第一方向延伸，并且可以在其上形成和拉伸第一通道（LC1）;第一导电液体注入到所述第一通道中;第二基板（200），其在 与第一方向相交的第二方向，并且可以在其上形成和拉伸第二通道（LC2），并且将第二导电液体注入第二通道。

公开(公告)号：EP2620523A3

公开(公告)日：2017-01-18

申请号：EP13163970.0

申请日：2009-06-25

申请人： 3M Innovative Properties Company

发明人： Stay, Matthew, S. ,  Pekurovsky, Mikail L. ,  Mora, Cristin, E. ,  Frey, Matthew, S.

IPC分类号： C23C18/16 ,  H05K3/12 ,  H05K3/24 ,  G03F7/00 ,  C09D11/00 ,  H05K3/10 ,  H05K9/00 ,  C23C18/06 ,  C23C18/08 ,  C09D11/52 ,  H05K3/18 ,  H05K1/02 ,  G02F1/155 ,  C23C18/30

CPC分类号： B32B3/30 ,  C09D11/52 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1608 ,  C23C18/30 ,  G02F1/155 ,  G02F2202/22 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/182 ,  H05K9/0096 ,  H05K2201/09036 ,  H05K2201/09827

摘要： A method of forming a microstructure comprising providing a substrate comprising a metallized structured surface region comprising a metal layer disposed the structured surface region, the metallized structured surface region comprising one or more recessed features having recessed surfaces, the metallized structured surface region substantially free of plateaus; disposing a fluid composition comprising a resist material and a liquid onto the metallized structured surface region; and evaporating liquid from the fluid composition, the resist material collecting on the recessed surfaces such that a remainder of the metallized structured surface region is substantially free of the resist material.

公开(公告)号：EP2308276B1

公开(公告)日：2016-10-26

申请号：EP09788230.2

申请日：2009-07-14

申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

发明人： VAN DEN BRAND, Jeroen ,  DIETZEL, Andreas Heinrich

IPC分类号： H05K3/10 ,  H05K3/12

CPC分类号： H05K3/107 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2203/0264

公开(公告)号：EP3007221A4

公开(公告)日：2016-06-15

申请号：EP14803769

申请日：2014-05-23

申请人： TOPPAN PRINTING CO LTD

发明人： YOSHIDA TOMOHIRO

IPC分类号： H01L23/15 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H05K3/10 ,  H05K3/14 ,  H05K3/18 ,  H05K3/46

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/1511 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/002 ,  H05K3/107 ,  H05K3/241 ,  H05K3/26 ,  H05K3/4644

公开(公告)号：EP2919265A2

公开(公告)日：2015-09-16

申请号：EP15155491.2

申请日：2015-02-18

申请人： MediaTek, Inc

发明人： Hsu, Wen-Sung ,  Yu, Ta-Jen

IPC分类号： H01L23/66

CPC分类号： H01L21/485 ,  H01F17/00 ,  H01F17/0006 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/705 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L24/17 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/12042 ,  H01L2924/1206 ,  H01L2924/1421 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/2064 ,  H05K1/165 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0047 ,  H05K3/107 ,  H05K3/188 ,  H05K3/303 ,  H05K2201/10098 ,  H01L2924/00

摘要： The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

摘要翻译： 本发明提供一种半导体封装和用于制造基础的半导体封装的方法。 所述半导体封装包括一底座。 所述基座具有设备粘贴面。 一种射频（RF）设备被嵌入基。 RF设备是靠近器件贴装表面。

公开(公告)号：EP2023699B1

公开(公告)日：2015-07-08

申请号：EP08161925.6

申请日：2008-08-06

申请人： Shinko Electric Industries Co., Ltd.

发明人： Shiraishi, Akinori ,  Murayama, Kei ,  Taguchi, Yuichi ,  Sunohara, Masahiro ,  Higashi, Mitsutoshi

IPC分类号： H05K3/10 ,  H01L33/48 ,  H05K1/02 ,  H01L23/498 ,  H05K3/00 ,  H05K1/03 ,  H01L33/64 ,  H01L33/62 ,  H01L23/373

CPC分类号： H05K3/107 ,  H01L23/3735 ,  H01L23/49861 ,  H01L33/483 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/108 ,  H05K2201/10106

公开(公告)号：EP2750148A4

公开(公告)日：2015-06-03

申请号：EP12828321

申请日：2012-08-24

申请人： ROHM CO LTD

发明人： TSURUMI NAOAKI ,  FUKAE KEISUKE

IPC分类号： H01F17/00 ,  H01F5/00 ,  H01F17/04 ,  H05K1/05

CPC分类号： H01F27/2804 ,  H01F17/0006 ,  H01F27/24 ,  H01F27/2871 ,  H01F2017/0066 ,  H01F2017/0073 ,  H05K1/053 ,  H05K1/165 ,  H05K3/107 ,  H05K2201/086

摘要： The inductance device (4) includes: a magnetic metal substrate (2) comprising a metallic substrate (10) having first permeability, a first insulating layer (16a) disposed in the metallic substrate (10), and a first metallic wiring layer (22) having second permeability and disposed on the first insulating layer (16a); a first gap layer (24) disposed on the front side surface of the magnetic metal substrate (2); and a first magnetic flux generation layer (26) disposed on the first gap layer (24). There are provide a thin magnetic metal substrate adaptable to the large current use and advantageous in the high frequency characteristics; and an inductance device to which such a magnetic metal substrate are applied, wherein the inductance device is adaptable to smaller mounting area, larger inductance values, and large current use and advantageous in high frequency characteristics.

公开(公告)号：EP2781143A1

公开(公告)日：2014-09-24

申请号：EP12787011.1

申请日：2012-11-16

申请人： CeramTec GmbH

发明人： DOHN, Alexander ,  HERRMANN, Klaus ,  THIMM, Alfred ,  HELGERT, Oskar ,  LENEIS, Roland ,  ADLER, Sigurd

IPC分类号： H05K3/10 ,  H05K3/18 ,  H05K1/02

CPC分类号： H05K1/0296 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1868 ,  C23C18/204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/185 ,  Y10T29/49165

摘要： The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.