公开(公告)号：EP1484952A4

公开(公告)日：2008-04-23

申请号：EP03703355

申请日：2003-02-21

Applicant: FUJIKURA LTD

Inventor： ITO SHOUJI ,  NAKAO OSAMU ,  HIGUCHI REIJI ,  OKAMOTO MASAHIRO

IPC: H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0191 ,  H05K2203/1453 ,  Y10T29/49165 ,  Y10T428/12181 ,  Y10T428/24917

Abstract: A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through the conductive layer, the insulating base, and the adhesive layer is filled with a conductive resin composition (115) for interlayer electrical connection. The diameter of the conductive layer portion (114b) of the through hole is smaller than those of the insulating base portion and the adhesive layer portion (114a). The electrical connection between the conductive resin composition and the conductive layer is ensured through the back (112a) of the conductive layer.

公开(公告)号：EP2434305A4

公开(公告)日：2015-02-18

申请号：EP10777584

申请日：2010-05-21

Applicant: FUJIKURA LTD

Inventor： OHMORI KENICHI ,  AIZAWA TAKUYA ,  NAKAO OSAMU

IPC: G01R33/05 ,  G01C17/30 ,  G01R33/02

CPC classification number: G01R33/05 ,  G01C17/30 ,  G01R33/04

公开(公告)号：EP1951015A4

公开(公告)日：2011-03-23

申请号：EP06811725

申请日：2006-10-13

Applicant: FUJIKURA LTD

Inventor： OKAMOTO MASAHIRO ,  ITOU SHOUJI ,  NAKAO OSAMU ,  SUZUKI TAKANAO ,  OKUDE SATOSHI

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/186 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/0058 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

Abstract: A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion. According to the invention, therefore, it is allowed to provide a multi-layer printed wiring board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.

公开(公告)号：EP2348572A4

公开(公告)日：2013-04-17

申请号：EP09825935

申请日：2009-11-13

Applicant: FUJIKURA LTD

Inventor： UEMICHI YUSUKE ,  AIZAWA TAKUYA ,  NAKAO OSAMU

IPC: H01P5/10 ,  H01L23/12 ,  H01L23/498 ,  H01L23/66 ,  H01P11/00

CPC classification number: H01P5/10 ,  H01L23/3114 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2224/13 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P11/00

公开(公告)号：EP2117026A4

公开(公告)日：2012-03-14

申请号：EP08711072

申请日：2008-02-08

Applicant: FUJIKURA LTD

Inventor： ITOI KAZUHISA ,  NAGASU KATSUBUMI ,  AIZAWA TAKUYA ,  NAKAO OSAMU

IPC: H01H36/00 ,  G01R33/00

CPC classification number: G01R33/09 ,  G01D5/147 ,  G01R33/0011 ,  G01R33/07 ,  G01R33/072

公开(公告)号：EP2017635A4

公开(公告)日：2012-03-14

申请号：EP07742940

申请日：2007-05-08

Applicant: FUJIKURA LTD

Inventor： ITOI KAZUHISA ,  NAGASU KATSUBUMI ,  AIZAWA TAKUYA ,  NAKAO OSAMU ,  KAWAI SHIGEKAZU

IPC: G01R33/02 ,  G01R33/00 ,  H01L43/00

CPC classification number: G01R33/09 ,  G01R33/0011 ,  G01R33/02 ,  G01R33/063 ,  G01R33/18 ,  H01L43/12