公开(公告)号：EP2650906B1

公开(公告)日：2024-10-09

申请号：EP13003427.5

申请日：2005-06-02

IPC分类号： H01L21/308 ,  H01L21/208 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L23/00 ,  H01L29/786 ,  H01L27/12 ,  H01L31/18 ,  H01L21/683

CPC分类号： B81C2201/018520130101 ,  B82Y10/00 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/1804 ,  H01L2924/1204120130101 ,  Y10S977/724 ,  Y10S977/707 ,  Y02E10/547 ,  H01L2224/8300520130101 ,  H01L2224/0361420130101 ,  H01L2224/8086220130101 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L21/6835 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L2224/033220130101 ,  H01L2224/034520130101 ,  H01L2224/036220130101 ,  H01L2224/0507320130101 ,  H01L2224/0508220130101 ,  H01L2224/0512420130101 ,  H01L2224/0514420130101 ,  H01L2224/0515520130101 ,  H01L2224/0516620130101 ,  H01L2224/0555220130101 ,  H01L2224/0555320130101 ,  H01L2224/0555420130101 ,  H01L2224/0555520130101 ,  H01L2224/0564420130101 ,  H01L2224/0566620130101 ,  H01L2224/0822520130101 ,  H01L2224/291920130101 ,  H01L2224/3222520130101 ,  H01L2224/8000620130101 ,  H01L2224/8012120130101 ,  H01L2224/8089520130101 ,  H01L2224/8312120130101 ,  H01L2224/8319220130101 ,  H01L2224/8319320130101 ,  H01L2224/838520130101 ,  H01L2224/8386220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L2224/9720130101 ,  H01L2924/1025320130101 ,  H01L2924/1032920130101 ,  H01L2924/1515920130101 ,  H01L2924/1516220130101 ,  H01L2924/157920130101 ,  H01L27/1285 ,  H01L27/1292 ,  H01L2924/1309120130101 ,  H01L2924/130620130101 ,  H01L2924/146120130101 ,  H01L21/02628 ,  H01L2924/130520130101 ,  H01L2924/1203220130101 ,  H01L2924/1578820130101 ,  H01L31/03926 ,  H01L31/1864 ,  H01L31/1896 ,  H01L2924/1204220130101 ,  H01L2924/1204420130101 ,  H01L2924/1203620130101 ,  H01L2924/1204320130101 ,  H01L2224/9520130101 ,  H01L2924/1306320130101 ,  H01L2924/1420130101 ,  H01L2924/1305520130101 ,  H01L21/02603 ,  Y02P70/50

公开(公告)号：EP2401776B1

公开(公告)日：2016-08-10

申请号：EP10746830.8

申请日：2010-02-25

申请人： D-Wave Systems Inc.

发明人： LADIZINSKY, Eric ,  ROSE, Geordie ,  HILTON, Jeremy, P. ,  DANTSKER, Eugene ,  OH, Byong, Hyop

IPC分类号： H01L39/22 ,  H01L39/24 ,  H01L27/18

CPC分类号： H01L27/18 ,  B82Y10/00 ,  G06N99/002 ,  H01L28/24 ,  H01L39/025 ,  H01L39/223 ,  H01L39/2406 ,  H01L39/2493 ,  Y10S977/707 ,  Y10S977/723 ,  Y10S977/943

摘要： Various techniques permitting fabrication of superconducting integrated circuits and structures including Josephson junctions, which may be useful in quantum computers, are disclosed. For instance, a superconductor/insulator/superconductor trilayer structure may be patterned by etching the upper superconductor layer using a hard mask which is lithographically patterned using a photoresist mask.

公开(公告)号：EP2401776A4

公开(公告)日：2013-08-07

申请号：EP10746830

申请日：2010-02-25

申请人： DWAVE SYS INC

发明人： LADIZINSKY ERIC ,  ROSE GEORDIE ,  HILTON JEREMY P ,  DANTSKER EUGENE ,  OH BYONG HYOP

IPC分类号： H01L39/22 ,  H01L27/18 ,  H01L39/24

CPC分类号： H01L27/18 ,  B82Y10/00 ,  G06N99/002 ,  H01L28/24 ,  H01L39/025 ,  H01L39/223 ,  H01L39/2406 ,  H01L39/2493 ,  Y10S977/707 ,  Y10S977/723 ,  Y10S977/943

摘要： Various techniques permitting fabrication of superconducting integrated circuits and structures including Josephson junctions, which may be useful in quantum computers, are disclosed. For instance, a superconductor/insulator/superconductor trilayer structure may be patterned by etching the upper superconductor layer using a hard mask which is lithographically patterned using a photoresist mask.

摘要翻译： 各种技术允许超导集成电路和结构，包括约瑟夫逊结，这可能是在量子计算机有用的制造，是游离缺失盘。 例如，超导体/绝缘体/超导体三层结构可以通过蚀刻使用硬掩模的所有使用光刻胶掩模是光刻图案化所述上超导层被图案化。

公开(公告)号：EP1709700B1

公开(公告)日：2008-03-12

申请号：EP05701511.7

申请日：2005-01-13

申请人： International Business Machines Corporation

发明人： FURUKAWA, Toshiharu ,  HAKEY, Mark, Charles ,  HOLMES, Steven, John ,  HORAK, David, Vaclav ,  MITCHELL, Peter ,  NESBIT, Larry, Alan

IPC分类号： H01L51/30

CPC分类号： H01L27/283 ,  B82Y10/00 ,  H01L51/0048 ,  H01L51/057 ,  Y10S977/70 ,  Y10S977/707 ,  Y10S977/721 ,  Y10S977/724

摘要： Vertical field effect transistors having a channel region defined by at least one semi­conducting nanotube and methods for fabricating such vertical field effect transistors by chemical vapor deposition using a spacer-defined channel. Each nanotube is grown by chemical vapor deposition catalyzed by a catalyst pad positioned at the base of a high-aspect-ratio passage defined between a spacer and a gate electrode. Each nanotube grows in the passage with a vertical orientation constrained by the confining presence of the spacer. A gap may be provided in the base of the spacer remote from the mouth of the passage. Reactants flowing through the gap to the catalyst pad participate in nanotube growth.

公开(公告)号：EP1759422A2

公开(公告)日：2007-03-07

申请号：EP05755193.9

申请日：2005-06-02

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： NUZZO, Ralph, G. ,  ROGERS, John, A. ,  MENARD, Etienne ,  LEE, Keon Jae ,  KHANG, Dahl-Young ,  SUN, Yugang ,  MEITL, Matthew ,  ZHU, Zhengtao

IPC分类号： H01L31/0312

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP1097464A2

公开(公告)日：2001-05-09

申请号：EP00930380.1

申请日：2000-05-04

申请人： Etec Systems, Inc.

发明人： Muray, Lawrence P. ,  Kim, Ho-Seob ,  Chang, T. H. Philip

IPC分类号： H01J37/317 ,  H01J37/28 ,  H01J37/304 ,  G03F9/00

CPC分类号： G01Q30/02 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/1205 ,  H01J2237/2818 ,  Y10S977/707 ,  Y10S977/849 ,  Y10S977/86 ,  Y10S977/869 ,  Y10S977/874 ,  Y10S977/881 ,  Y10S977/887

摘要： An apparatus for surface inspection and processing of a wafer (12) includes a microcolumn (14) and an associated scanning probe microscope (16). The microcolumn enables high speed scanning of the wafer at a relatively high resolution, while the scanning probe microscope provides atomic resolution of highly localized areas of the wafer. The microcolumn and scanning probe microscope can be partially fabricated out of the same substrate. Additionally, the microcolumn and scanning probe microscope can be a portion of an array of microcolumns and/or scanning probe microscopes. The apparatus may be used for imaging, lithography and spectroscopy.

公开(公告)号：EP2650907A2

公开(公告)日：2013-10-16

申请号：EP13003428.3

申请日：2005-06-02

申请人： The Board of Trustees of the University of Illinois

发明人： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC分类号： H01L21/20 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

公开(公告)号：EP2650906A2

公开(公告)日：2013-10-16

申请号：EP13003427.5

申请日：2005-06-02

申请人： The Board of Trustees of the University of Illinois

发明人： Nuzzo, Ralph G. ,  Rogers, John, A. ,  Menard, Etienne ,  Lee, Keon Jae ,  Khang, Dahl-Young ,  Sun, Yugang ,  Meitl, Matthew ,  Zhu, Zhengtao

IPC分类号： H01L21/20 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP1667738B1

公开(公告)日：2012-04-04

申请号：EP04782178.0

申请日：2004-08-23

申请人： KIMBERLY-CLARK WORLDWIDE, INC.

发明人： MACDONALD, John, Gavin ,  BOGA, RameshBabu ,  KIM, Jaeho ,  DO, Bao, Trong ,  KUZNETSOV, Irene

IPC分类号： A61L9/01 ,  A61L9/014 ,  A61F13/15 ,  A61L15/18 ,  A61L15/46 ,  B01D53/02 ,  B01J20/02 ,  B01J20/08 ,  B01J20/10

CPC分类号： B01J20/28014 ,  A61F13/42 ,  A61F13/8405 ,  A61L9/01 ,  A61L9/014 ,  A61L15/46 ,  A61L15/56 ,  A61L2300/102 ,  A61L2300/442 ,  A61L2300/624 ,  B01J20/0233 ,  B01J20/041 ,  B01J20/06 ,  B01J20/08 ,  B01J20/103 ,  B01J20/28007 ,  B01J20/28033 ,  B01J20/3204 ,  B01J20/3236 ,  B01J2220/49 ,  B82Y30/00 ,  G01N31/22 ,  Y10S604/904 ,  Y10S977/707

摘要： The present invention relates to a visual indicating device and an article for controlling odors, in particular foot, garbage, basement, cooking, pet, tobacco, feces and urine odors. The article comprises a visual indicating agent that is color sensitive to the odor, and optionally, an odor absorbing agent. The visual indicating agent changes color when the article has been exposed to a sufficient amount of odor to saturate the article. The indicating agent may be applied in differing concentrations to two or more zones so as to indicate to a user of the article how much of the odor absorbing capacity has been used, or conversely, how much of the odor absorbing capacity remains. Suitable visual indicating agents that change color in response to odors are also described. The article for controlling odors may be a disposable odor absorbing sheet, air freshening product, diaper, undergarment pad, face mask, air filtration device, sanitary napkin, tampon, panty shield or incontinence pad.

公开(公告)号：EP2382481A1

公开(公告)日：2011-11-02

申请号：EP10701660.2

申请日：2010-01-22

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： WALTHER, Arnaud ,  ROBERT, Philippe ,  REDON, Olivier

IPC分类号： G01R33/022 ,  G01R33/028 ,  G01R33/038

CPC分类号： G01R33/022 ,  G01R33/0283 ,  G01R33/0286 ,  G01R33/038 ,  Y10S977/707 ,  Y10T29/4902

摘要： The invention relates to a magnetic field sensor (100) that comprises at least : a body (108) including magnetic means (112) capable of forming a torque applied onto the body by an external magnetic field to be detected; connection means (116) separate from the body for mechanically connecting the body to an inlay portion (114) of the sensor by at least one pivot link having an axis perpendicular to the direction of the magnetic field to be detected; means for detecting a stress applied onto the body by the torque, separate from the connection means and including at least one suspended stress gauge (124) having a first portion (123) mechanically connected to the inlay portion and a second portion (125) mechanically connected to the body, as well as a third portion (127) provided between the first and second portions and suspended between the inlay portion and the body.