公开(公告)号：EP1939894A4

公开(公告)日：2015-01-14

申请号：EP06810037

申请日：2006-09-01

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  HARA YOSHITAKE ,  YOSHIOKA MASAHIRO

IPC: H01B3/00 ,  C04B35/00 ,  C08K3/00 ,  H01G4/12

CPC classification number: H01G4/1227 ,  C03C17/007 ,  C03C2217/475 ,  C04B26/06 ,  C04B26/14 ,  C04B2111/90 ,  C08K7/18 ,  H01B3/006 ,  C04B14/305

公开(公告)号：EP1612810A4

公开(公告)日：2009-12-16

申请号：EP04723336

申请日：2004-03-25

Applicant: TORAY INDUSTRIES

Inventor： HARA YOSHITAKE ,  YAMASHIKI YUKA ,  KAWASAKI MANABU ,  NONAKA TOSHIHISA

IPC: H01G4/12 ,  H01B3/00 ,  H01B3/40 ,  H01G4/10 ,  H01G4/20 ,  H05K1/16

CPC classification number: H01B3/40 ,  H01B3/006 ,  H01G4/10 ,  H01G4/12 ,  H01G4/20 ,  H05K1/162 ,  H05K2201/0209 ,  Y10T428/31511

公开(公告)号：EP2940094A4

公开(公告)日：2016-08-10

申请号：EP13867003

申请日：2013-12-04

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: H01L23/00 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  H01L21/683 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a)a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

公开(公告)号：EP0706176A4

公开(公告)日：1996-09-25

申请号：EP95913347

申请日：1995-03-27

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  OHBAYASHI GENTARO ,  HIROTA KUSATO

IPC: G11B7/0045 ,  G11B7/0055 ,  G11B7/24 ,  G11B7/243 ,  G11B7/257 ,  G11B7/26

CPC classification number: G11B7/257 ,  G11B7/00454 ,  G11B7/00557 ,  G11B7/24 ,  G11B7/243 ,  G11B7/26 ,  G11B2007/24312 ,  G11B2007/24314 ,  G11B2007/24316 ,  Y10S430/146

Abstract: An optical recording medium wherein the recording, erasing and reproducing of information can be done by applying light to a recording layer formed on a substrate, and the recording and erasing of information are done by a phase change between a noncrystal phase and a crystal phase. The recording medium has a structure in which at least a first dielectric layer, a recording layer, a second dielectric layer and a reflecting layer are formed in multilayer in the mentioned order, and the second dielectric layer is not transparent. This recording medium is capable of recording and erasing information by small power. Even when the recording and erasing of information are repeated many times, the operation is stable, and the characteristics thereof are not substantially deteriorated. This recording medium has a high moisture and heat resistance, a high oxidation resistance and a long life.

公开(公告)号：EP2787039A4

公开(公告)日：2015-07-01

申请号：EP12853475

申请日：2012-10-24

Applicant: TORAY INDUSTRIES

Inventor： SHIMBA YOICHI ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08G59/24 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/10 ,  C08L63/00 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01L21/60 ,  H01L23/00

CPC classification number: H01L24/29 ,  C08G59/188 ,  C08G59/24 ,  C08K3/36 ,  C08K9/04 ,  C08K9/10 ,  C08L33/08 ,  C08L63/00 ,  C08L79/08 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29386 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/05442 ,  H01L2924/00

Abstract: A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond.

公开(公告)号：EP2489683A4

公开(公告)日：2015-03-18

申请号：EP10823349

申请日：2010-10-08

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIIZEKI SHOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/00 ,  B32B15/08 ,  C09C1/62 ,  C09C1/64 ,  C09C3/10 ,  C23C22/08 ,  H05K3/28 ,  H05K9/00

CPC classification number: C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

公开(公告)号：EP2080773A4

公开(公告)日：2010-06-02

申请号：EP07831242

申请日：2007-11-06

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIWA HIROYUKI ,  TATSUTA YOSHIKO ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/44 ,  C08F290/00 ,  C08F290/06 ,  C08K3/30 ,  C08L43/02 ,  C08L63/00 ,  G02B6/12

CPC classification number: G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

公开(公告)号：EP2234118A4

公开(公告)日：2017-08-16

申请号：EP09702030

申请日：2009-01-14

Applicant: TORAY INDUSTRIES

Inventor： SHIMBA YOICHI ,  HARA YOSHITAKE ,  MIZUGUCHI TSUKURU ,  NONAKA TOSHIHISA

IPC: H01B3/00 ,  C08K3/00 ,  H01G4/12 ,  H01G4/33

CPC classification number: H01G4/206 ,  C04B35/4682 ,  C04B35/6264 ,  C04B35/632 ,  C04B35/63404 ,  C04B35/63468 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01B3/12 ,  H01B3/306 ,  H01G4/1227 ,  H05K1/162 ,  H05K2201/0209 ,  C04B41/4529 ,  C04B41/5155 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5041 ,  C04B35/10 ,  C04B35/00 ,  C04B35/565 ,  C04B35/581

公开(公告)号：EP2647685A4

公开(公告)日：2014-09-17

申请号：EP11845999

申请日：2011-11-28

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  SHINBA YOICHI ,  NONAKA TOSHIHISA

IPC: C09J179/08 ,  C08G73/10 ,  C08G77/14 ,  C08K3/28 ,  C08L79/08 ,  C09J7/00 ,  C09J11/04 ,  C09J163/00 ,  C09J183/10 ,  H01L23/00 ,  H01L23/36

CPC classification number: C09J163/00 ,  C08G77/14 ,  C08K3/28 ,  C08K2003/2227 ,  C08L63/00 ,  C08L101/10 ,  C09J7/20 ,  C09J9/02 ,  C09J179/08 ,  C09J183/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  C08L79/08 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

公开(公告)号：EP1788412A4

公开(公告)日：2013-05-01

申请号：EP05777036

申请日：2005-09-02

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  ASAHI NOBORU ,  TATSUTA YOSHIKO

IPC: G02B6/12 ,  G02B6/122 ,  H05K1/02

CPC classification number: G02B6/1221 ,  H05K1/0274 ,  H05K2201/0209 ,  H05K2201/068