公开(公告)号：EP3224861B1

公开(公告)日：2018-10-24

申请号：EP15771448.6

申请日：2015-09-18

申请人： Raytheon Company

发明人： REZA, Shahed ,  ALTMAN, David, H. ,  TRULLI, Susan, C.

IPC分类号： H01L23/66 ,  H01L23/36 ,  H01L23/00

CPC分类号： H01L23/66 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/535 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/131 ,  H01L2224/14165 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27312 ,  H01L2224/29013 ,  H01L2224/29078 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.

公开(公告)号：EP2434297A1

公开(公告)日：2012-03-28

申请号：EP09844914.3

申请日：2009-05-21

申请人： Panasonic Corporation

发明人： HAYASHI, Shintarou ,  UEDA, Mitsuhiko ,  SANAGAWA, Yoshiharu ,  SAKAI, Takamasa

IPC分类号： G01P15/08 ,  G01P15/12 ,  G01P15/18 ,  H01L29/84 ,  H01L21/60

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.

摘要翻译： 芯片的安装结构包括具有基座，基座的上表面上的芯片以及粘合基座和第一芯片的粘合剂的基板。 粘合剂被施加到基部的上表面。 芯片具有矩形形状以具有宽度和长度，并且在其下表面处结合到基部。 粘合剂包括分别设置在基底上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。 底座上的三个点位于三角形的顶点上。 第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂粘合到基部。

公开(公告)号：EP3224861A1

公开(公告)日：2017-10-04

申请号：EP15771448.6

申请日：2015-09-18

申请人： Raytheon Company

发明人： REZA, Shahed ,  ALTMAN, David, H. ,  TRULLI, Susan, C.

IPC分类号： H01L23/66 ,  H01L23/36 ,  H01L23/00

CPC分类号： H01L24/29 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/66 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/131 ,  H01L2224/14165 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27312 ,  H01L2224/29013 ,  H01L2224/29078 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/05032 ,  H01L2924/00014 ,  H01L2924/00

摘要： A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.

摘要翻译： 一种单片微波集成电路结构，具有：具有多个有源器件的半导体衬底结构和具有输入部分，输出部分和互连部分的微波传输线，所述输入部分和互连部分在所述衬底的一个表面上电相互连接所述有源器件; 导热的，不导电的散热器; 以及用于将所述散热器结合到所述衬底的导热结合层，所述导热结合层具有导电部分和不导电部分，所述导电部分设置在所述散热器和部分的相对表面之间 具有有源器件的基板和非导电部分设置在微波传输线部分的相对表面部分重叠部分上。

公开(公告)号：EP2891177A2

公开(公告)日：2015-07-08

申请号：EP13770728.7

申请日：2013-08-30

申请人： Qualcomm Incorporated

发明人： SRINIVAS, Vaishnav ,  YANG, Bernie, Jord ,  BRUNOLLI, Michael ,  WEST, David, Ian ,  PAYNTER, Charles, David

IPC分类号： H01L23/522 ,  H01L23/50 ,  H01L21/66 ,  H01L21/60 ,  H01L23/485

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L22/32 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/0556 ,  H01L2224/05569 ,  H01L2224/11462 ,  H01L2224/13028 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/14165 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27462 ,  H01L2224/29028 ,  H01L2224/29078 ,  H01L2224/29147 ,  H01L2224/3012 ,  H01L2224/3213 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/381 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

摘要： Various aspects of an approach for routing die signals in an interior portion of a die using external interconnects are described herein. The approach provides for contacts coupled to circuits in the interior portion of the die, where the contacts are exposed to an exterior portion of the die. The external interconnects are configured to couple these contacts so that signals from the circuits in the interior portion of the die may be routed externally to the die. In various aspects of the disclosed approach, the external interconnects are protected by a packaging for the die.

公开(公告)号：EP2434297A4

公开(公告)日：2012-11-14

申请号：EP09844914

申请日：2009-05-21

申请人： PANASONIC CORP

发明人： HAYASHI SHINTAROU ,  UEDA MITSUHIKO ,  SANAGAWA YOSHIHARU ,  SAKAI TAKAMASA

IPC分类号： G01P15/08 ,  B81B7/00 ,  G01P15/12 ,  G01P15/18 ,  H01L21/60 ,  H01L29/84

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.